Browse updates and changes made in TestStand Semiconductor Module versions on extended support.

Note If you cannot find changes for your version, it might be a more recent version, documented as a new feature. Or, your version might not have included user-facing updates. You can find more information about non-visible changes, such as bug fixes, compatibility updates, and stability adjustments or maintenance adjustments, in the product Release Notes, available on ni.com.

TSM 2022 Q2 Changes

Learn about new features, behavior changes, and other updates in TSM 2022 Q2.

  • Run TSM with TestStand 2021.
  • Use LabVIEW 2021 to run TSM examples and tutorials and develop TSM code modules.
  • Quickly debug Semiconductor Sequence Call steps by reviewing test results on the Tests tab at runtime.
  • Get and set sessions through the Model-Based Instruments API.
  • Write code modules with the Mixed-Signal TSM Python API.
  • TSM no longer includes step type templates. TSM continues to provide the mechanism for other add-ons to install step type templates.
  • TSM drops support for LabVIEW 2017. TSM examples and tutorials that use LabVIEW are no longer located within year-specific folders. For example, the Accelerometer with LabVIEW 2018 example is now located in <TestStand Public>\Examples\NI_SemiconductorModule\Accelerometer\LabVIEW\Accelerometer.seq instead of in <TestStand Public>\Examples\NI_SemiconductorModule\Accelerometer\LabVIEW\2018\Accelerometer.seq.

TSM 2021 Q4 Changes

Learn about new features, behavior changes, and other updates in TSM 2021 Q4.

  • Use the Perform Part Average Testing step to perform part average testing for any tests with part average testing enabled that have already been performed for the current part. Use the Perform Part Average Testing step to determine whether to perform part average testing before or after inline QA and other steps.
  • Call larger and more complex test sequences with the Semiconductor Sequence Call step. Use the Semiconductor Sequence Call step's Step Name.Published Data Id field to assign tests to Semiconductor Multi Test steps, even if multiple Semiconductor Multi Test steps in the called sequence publish the same data ID.
  • Analyze sequences that include the Semiconductor Sequence Call step in the TestStand Sequence Analyzer to resolve errors and warnings before deploying your test program.
  • Customize the MIR EXEC_TYPE field in your STDF records to simplify downstream STDF tools and scripts.
  • The default value of the Master Information Record (MIR) EXEC_TYPE field has changed to NI STS Software and is no longer dependent on the version of the STS Software you have installed. You can also customize the EXEC_TYPE field value.

TSM 2020 Changes

Learn about new features, behavior changes, and other updates in TSM 2020.

Alarms

The alarms feature allows NI instrument drivers to report error conditions for an instrument at run-time. TSM checks for alarms after each test step and allows you to specify how alarms are handled on a per-alarm and per-pin basis.
Note NI TestStand 2020 Semiconductor Module supports the ComplianceAlarm for NI-DCPower 20.1 and later. The ComplianceAlarm indicates that the instrument state was not at its programmed value or exceeded programmed limits when a measurement was made, which invalidates the measurement.

Grouping NI-DCPower Instrument Channels for Use in Multi-Channel Sessions

You can group multiple NI-DCPower instrument channels and treat them as a single logical instrument and control them in one session. When all NI-DCPower instrument channels belong to a single group you can avoid using session loops in code modules. The instrument driver performs most operations on multiple channels in a single function call in parallel to achieve improved multisite efficiency. Refer to the instrument driver help for information about hardware limitations that prevent certain instruments from operating together as a single instrument.

By default, when you create a new NI-DCPower instrument in the pin map file, TSM creates a single channel group containing all instrument channels. TSM creates a single session for each channel group of NI-DCPower instruments in the pin map file. TSM 2019 and earlier do not allow for channel grouping and pin maps created with older versions of TSM do not contain channel group information. You must convert all NI-DCPower instruments in these pin maps to use channel groups.

Offline Mode

The default main menu now displays an Offline Mode indicator to the right of the Help menu when you enable Offline Mode. When you disable Offline Mode, the default main menu no longer displays the Offline Mode indicator.

Semiconductor Sequence Call Step

Use the Semiconductor Sequence Call step to call a sequence and pass tests to Semiconductor Multi Test steps in the called sequence.

Set Relays Step

Use the Set Relays step to control relays and to apply relay configurations.

Test Program Performance Analyzer

  • You can add notes and additional metadata to Test Program Performance Measurement Data Logs for improved record keeping during performance optimization.
  • Use the Log Browser Window to specify a directory of performance log files, view log files and their metadata, and select log files to open and/or compare.

    For improved performance while loading data in the in the Test Program Performance Analyzer, you can load only a sample of log files within a directory by specifying the Log Data Sample Rate.

Additional Improvements

The NI TestStand 2020 Semiconductor Module includes the following additional enhancements:
  • Use Semiconductor Multi Test steps and Semiconductor Action steps in most types of loops without the possibility of incorrect results. There remain some limitations to using TSM steps in loops but the steps report run-time errors in those situations instead of producing incorrect results.
  • Specify the relays you use in your code module on the Options tab of a Semiconductor Multi Test or Semiconductor Action step that uses the code module.
  • New TSM sequence analyzer rules return errors in the following situations:
    • When instruments defined in the pin map are missing from Measurement & Automation Explorer (MAX)
    • When the Specify DUT Pins or Specify Site Relays option on the Options tab of a Semiconductor Multi Test step or a Semiconductor Action step is enabled, but some of the included DUT pins or relays are not in the pin map file.
  • Create a basic TSM test program from a digital pattern project. Select Semiconductor Module » Create Test Program from Digital Pattern Project to launch the Create Test Program from Digital Pattern Project dialog box.
  • Use an expression to determine the software bin at run time. The Result.Evaluations property of the Semiconductor Multi Test step type includes a new FailBinExpr property, which is an expression that determines the software bin at run time. If the test fails and this expression is not empty, the Semiconductor Multi Test step evaluates the expression and copies the evaluated value to the FailBin property.
  • Support for logging failed cycle information from NI-Digital Pattern Drivers in .NET applications.
  • The Create Multisite Data for Analog Output VI and corresponding .NET method have been updated. The Create Multisite Data for Analog Output VI for DAQmx now supports multiple task pin queries and the Site Pin Data indicator for the Per Site Data instance of this VI has improved data representation.

    Outputs from the TSM .NET API more closely match the DAQmx API and the samplesPerSitePerPin parameter of the CreatePerSiteMultisiteDataForDAQmxAnalogOutput .NET method, which supplants the CreatePerSiteMultisiteDataForAnalogOutput .NET method, has improved data representation.

Compatibility

  • You cannot use multiple Semiconductor Multi Test steps or Semiconductor Action steps configured to use multiple threads in While loops, in Do While loops or in For loops that use the Custom Loop option when performing multisite testing. The steps report a run-time error in these situations. Use other types of loops instead, such as For loops that use the Fixed Number of Iterations option.

    Previously, NI recommended not to use Semiconductor Multi Test steps or Semiconductor Action steps in loop blocks that the TestStand For step and For Each step create because using multiple Semiconductor Multi Test steps or Semiconductor Action steps in a loop can result in incorrect step results in certain multisite situations. NI previously recommended making the last step in the loop block a Semiconductor Multi Test step or a Semiconductor Action step with the Multisite Option set to One thread only to avoid incorrect behavior of Semiconductor Multi Test steps or Semiconductor Action steps in a loop.

  • For code modules that use relays, you must specify the relays on the Options tab of the Semiconductor Multi Test step or Semiconductor Action step that uses the code module.

    Previously, TSM included all relays in the SemiconductorModuleContext for all steps. As a result, a test step that uses relays and executes successfully in previous versions of TSM might generate a run-time error in version 2020. To prevent the run-time error, specify the relays that the code module uses on the Options tab.

TSM 2019 Changes

Learn about new features, behavior changes, and other updates in TSM 2019.

  • Offline Mode—Use Offline Mode in TSM to develop, run, and debug test programs only on a computer without access to NI instruments. Ensure you meet the requirements on the computer on which you want to use Offline Mode.
  • Grouping Instruments for Use in Multi-Instrument Sessions—You can group multiple NI-Digital Pattern instruments or multiple NI-SCOPE instruments together and treat them as a single instrument. When all the instruments of the same type belong to a single group or when the instruments of the same type in a subsystem belong to a single group, you do not need to use parallel For Loops to iterate over the instrument driver sessions. The instrument driver specific to the grouped instruments performs most operations on all channels in parallel to achieve improved multisite efficiency. Refer to the instrument driver help for information about hardware limitations that prevent certain instruments from operating together as a single instrument.

    By default, when you create a new NI-Digital Pattern instrument or a new NI-SCOPE instrument in the pin map file, TSM sets the group attribute to Digital or to Scope so that all newly created NI-Digital Pattern instruments or NI-SCOPE instruments belong to the same group. TSM creates a single session for each group of NI-Digital Pattern instruments in the pin map file. TSM 2017 and earlier do not automatically group NI-Digital Pattern instruments or NI-SCOPE instruments together in pin map files. Use the Pin Map Editor to modify existing pin map files to change the value of the Group option for each instrument to assign the instrument to the same group.

  • Instrument Model Library—The Instrument Model Library is a collection of XML files that describe instruments. Instrument model description files include general information, details for connection components (channels, ports, resources), and configuration properties of the instrument and its resources. The instrument model description file does not include session information.

    Use the Instruments tab of the Pin Map Editor to add and modify instances of model-based instruments in the pin map.

    Use the following new TSM Code Module API VIs to return the names, properties, and values of model-based instruments:

    • Get All Model-Based Instrument Names—Use this VI to return the instrument names and models for all model-based instruments in the Semiconductor Module context. You can use instrument names to query the model properties for the information needed to create the appropriate sessions to drive the instrument.
    • Get Model-Based Instrument Property List—Use this VI to return an object containing the name of the model and an array of ModelBasedInstrumentProperty objects that contain the names and values of the instrument properties.
    • Get Model-Based Instrument Resource Property List—Use this VI to return an array of IModelBasedInstrumentResourcePropertyList objects where each element contains the name of a resource as well as an array of ModelBasedInstrumentProperty objects that contain the names and values of the instrument resource properties.
    • Get Model-Based Instrument Property Value—Use this VI to return the value of a named property and a Boolean value indicating whether or not the named property was found in the property list supplied.
    • Get Model-Based Instrument Resource Property Value—Use this VI to return the value of a named property from a named resource and a Boolean value indicating whether or not the named property was found in the array of resource property lists supplied.
  • Connecting Shared Resources in a Pin Map—Use the Connections table to connect shared resources in a pin map. A shared resource is a device on the tester or DIB that is connected to an instrument or relay driver module and shared by multiple sites. You can connect shared resources using system pins and system relays, or by using DUT pins and site relays.
  • Relay Configurations—
    • In the Pin Map Editor, you can now create relay configurations to set multiple relays to a state defined in the pin map.
    • Use the Apply Relay Configuration VI or the ApplyRelayConfiguration .NET method to perform relay actions on the relays in the relay configuration.
  • CSV Test Results Log—You can now enable and configure the new CSV Test Results Log to store data in a comma-separated values text file, which provides better performance than the Debug Test Results Log result processor in a production environment. The CSV Test Results Log result processor generates a single file for all sites in the test program. You can open the .csv file directly in a spreadsheet application for analysis or to correlate test results.

    The Test Results Log is now the Debug Test Results Log.

  • InstrumentStudio Integration—
    • Use the InstrumentStudio toolbar button to launch InstrumentStudio, which is a pin- and site-aware, software-based front panel application you can use to monitor, control, and record measurements from supported devices.
    • You can also use the InstrumentStudio Project Panel in the Test Program Editor to launch InstrumentStudio, or to specify an InstrumentStudio configuration file to use in a test program.
      Note If you launch InstrumentStudio in any other way, such as from the Microsoft Windows Start menu, InstrumentStudio is not pin and site aware.
  • Multisite Scaling Improvements—TSM 2019 includes extensive optimizations for multisite testing with improved parallel test efficiency (PTE). These performance improvements can significantly increase throughput for systems, depending heavily on the specifications of the system.
  • Test Program Development and Debugging Improvements—
    • You can now configure TSM-specific environments. TSM is enabled by default in custom TSM environments you create. You can disable and re-enable TSM in a custom TSM environment. Use the Configure Environment dialog box to create, load, and edit an environment.
    • You can now use the Site Data Exists and the Global Data Exists TSM Code Module API to check for the existence of per-site or global data.
    • Switching settings for are disabled. Use relays in the pin map to perform switching operations.
    • The Test Program Performance Analyzer graphs include the following changes:
      • The Average Step Times graph is now the Step Time Statistics graph with options to show average step times, PTE%, and a distribution box plot.
      • You can now view statistical distribution of test times as a scatter distribution.
    • You can log failed cycle information from the NI-Digital Pattern Driver to STDF Log files.
    • Use the Per-Instrument to Per-Site Pattern Results VI to convert Pass/Fail pattern burst results from a call to the NI-Digital Pattern driver into per-site results that you can use in per-site loops in code modules.
    • Use the Per-Instrument to Per-Site Data VI or PerInstrumentToPerSiteData .NET method to transform data that is arranged by instruments and channels into data arranged by sites and pins.
    • The LabVIEW VI Analyzer now verifies that VIs use the High Resolution Polling Waiting VI instead of other wait functions to improve wait time precision.
    • TSM now supports pin-based per-site publishing. Use the optional Pin and Published Data Id parameters of the Publish Data VI or PublishPerSite .NET method to publish data for each site to tests that have non-empty Pin and Published Data Id fields.
    • You can now use the Publish Data VI to publish data for a single value from a single site.
    • In LabVIEW, you can now use the TSM controls instead of string controls to select from the pins, relays, relay configurations, specifications, published data IDs, and input data IDs of a linked sequence file. To use this feature, you must link a LabVIEW project file to a TSM sequence file.
    • Updated step templates better conform to suggested NI code style guidelines and test program structure. The step templates include the following major changes:
      Type of Change Details
      Source File/Directory Structure
      • LabVIEW version-specific directories
      • Template-specific directories
      • Template_ prefix changed to Template - .
      Behavior of Adding to Test Program
      • Template-specific default location
      • Instantiating a .NET template contained within a .NET assembly with the same name as a template that has already been instantiated automatically references the existing assembly
      Significant Coding Style Changes
      • Use of the High Resolution Polling Wait VI for increased precision in wait times
      • Use of re-entrant VIs
      • Disabled automatic error handling
      • VIs no longer contain compiled code
      • Changed connector panes
      • Eliminated coercion dots by explicitly converting data
      • Renamed error and TSM context controls and indicators
  • Additional Improvements—The NI TestStand 2019 Semiconductor Module includes the following additional enhancements:
    • The STDF Log now includes the correlation offsets file path you specify in the Load Correlation Offsets step as a DTR.
    • In the Pin Map Editor, you can now change the type of an instrument and maintain the relevant property values and existing connections among pins, relays, instruments, and channels. Right-click the instrument and select Change to in the context menu or use the Instrument Type drop-down menu to select the new instrument type.
    • The TSM Operator interface now displays the active STS Software installed on the system.
    • The Pin(s) to NI-Digital Pattern Session(s) VI and the GetNIDigitalPatternSession(s) .NET methods now support pin queries for single or multiple pins that return a single NI-Digital instrument.
    • The Set Site Data VI is now a polymorphic VI that allows the use of 2D arrays, in which each row of the array contains data corresponding to one site.
    • You can now use the generic versions of the GetSiteData and GetGlobalData .NET methods to specify a data type to cast the retrieved data to before returning it.
    • If you configure the LabVIEW Adapter to use the LabVIEW Development System, the window title of the VI clone displays a comma-separated list of the site numbers executing on that VI clone. For example, the window title for a VI clone that executes sites 1 and 2 for the Continuity VI will read: Continuity.vi: Site(s) 1,2.
    • The Lot Summary Report now includes a Test Results section that contains a table of test evaluation results by site for all the tests that executed at least once in the lot, sorted by execution order. You can use this data to compare the results of lots, which can be helpful during debugging. You can programmatically obtain the same data with the Test Results Statistics TSM Application API.
    • The Test Results Log is now the Debug Test Results Log. With the new performance improvements to the Debug Test Results Log, you can now leave the Debug Test Results Log enabled during production. Enabling the Debug Test Results Log might affect the performance of a test program. Perform a benchmark to ensure no performance loss exists when you enable the Debug Test Results Log.

Compatibility

  • TSM 2019 modifies the behavior of the Control Relay VI Multiple Relays - Multiple Actions polymorphic instance and the ControlRelay .NET method. Final relay state positions are now determined sequentially, based on the order of the input relays or relay groups. The following table demonstrates the change in relay behavior between TSM 2017 and TSM 2019:
    Relays/Relay Groups (Input) States (Input) Final States (TSM 2017) Final States (TSM 2019)
    Rly1, Rly2, Rly3, Rly1 Open Relay, Close Relay, Open Relay, Close Relay Rly1:Closed, Rly2:Closed, Rly3:Open Rly1:Closed, Rly2:Closed, Rly3:Open
    Rly1, Rly2, Rly3, Rly1 Close Relay, Close Relay, Open Relay, Open Relay Rly1:Closed, Rly2:Closed, Rly3:Open Rly1:Open, Rly2:Closed, Rly3:Open
    Grp1 (Rly1, Rly2, Rly3), Rly1 Close Relay, Open Relay Rly1: Closed, Rly2: Closed, Rly3: Closed Rly1: Open, Rly2: Closed, Rly3: Closed
    Rly1, Grp1 (Rly1, Rly2, Rly3) Close Relay, Open Relay Rly1: Closed, Rly2: Open, Rly3: Open Rly1: Open, Rly2: Open, Rly3: Open
  • You can group multiple NI-Digital Pattern instruments or multiple NI-SCOPE instruments together and treat them as a single instrument. When all the instruments of the same type belong to a single group or when the instruments of the same type in a subsystem belong to a single group, you do not need to use parallel For Loops to iterate over the instrument driver sessions. The instrument driver specific to the grouped instruments performs most operations on all channels in parallel to achieve improved multisite efficiency. Refer to the instrument driver help for information about hardware limitations that prevent certain instruments from operating together as a single instrument. By default, when you create a new NI-Digital Pattern instrument or a new NI-SCOPE instrument in the pin map file, TSM sets the group attribute to Digital or to Scope so that all newly created NI-Digital Pattern instruments or NI-SCOPE instruments belong to the same group. TSM creates a single session for each group of NI-Digital Pattern instruments in the pin map file. TSM 2017 and earlier do not automatically group NI-Digital Pattern instruments or NI-SCOPE instruments together in pin map files. Use the Pin Map Editor to modify existing pin map files to change the value of the Group option for each instrument to assign the instrument to the same group.
  • The Test Results Log is now the Debug Test Results Log.
  • The following table lists how TSM 2019 changes the error reporting behavior when you enable or disable the STDF Log.
    Conditions STDF Log Enabled STDF Log Disabled
    Multiple tests with 0 as a test number or blank test numbers and different test names or evaluation types Error in TSM 2017No error in TSM 2019 No error in TSM 2017No error in TSM 2019
    Multiple tests with non-zero test numbers and different test names or evaluation types Error in TSM 2017Error in TSM 2019 No error in TSM 2017Error in TSM 2019
  • The Get Site Data VI and the GetSiteData .NET method now return an error if the site data does not exist for all the sites in the Semiconductor Module Context.
  • TSM 2019 stores the path of the simulated handler driver in the HandlerDriverSequenceFilePath station setting property when you enable the NI built-in simulated handler driver. TSM 2017 or earlier leaves that property unchanged when you enable the simulated handler driver.
  • Names for NI instruments in the pin map file are no longer case sensitive. Names for custom instruments in the pin map file remain case sensitive.
  • TSM 2019 renames the Limit Number of Results Reported option in the Debug Test Results Log Options dialog box to Limit Number of Results Displayed in Report View. The option no longer applies to the Debug Test Results Log file and now applies only to the Report View.
  • TSM 2019 updates the directories for some LabVIEW examples and tutorials. Verify the example and tutorial directories before using them.
  • If you modified any TSM step templates, compare the modified versions to the updated versions of the step templates in NI TestStand 2019 Semiconductor Module.

TSM 2017 Changes

Learn about new features, behavior changes, and other updates in TSM 2017.

Step Templates

TSM includes the following new step types with template code:

  • NI-DAQmx Create AI Voltage Tasks
  • NI-DAQmx Acquire AI Voltage Waveforms
  • NI-DAQmx Clear Tasks

Additional Instrument Support

The TSM Code Module API now includes support for the PXI-2567 relay driver module. Install NI-SWITCH 17.0 or later to use the built-in support for the PXI-2567 relay driver module in TSM.

Use the Relay Driver Module section of the System View in the Digital Pattern Editor 18.0 to control and monitor relays.

TSM Sequence Editor UI Configuration

The default TSM UI Configuration of the TestStand Sequence Editor includes the following changes to streamline semiconductor test program development.

  • Simplified toolbar, including the following changes:
    Toolbar Change
    Standard No change
    Debug Removed
    Environment The following items have been removed:
    • Selected Adapter
    • User Manager
    • Find Previous
    • Find Next
    The Lock/Unlock UI Configuration toggle button is set to Lock.
    Navigation No change
    Help The following items have been removed:
    • Guide to Documentation
    • Getting Started
    • Web Resources
    • Discussion Forum
    Sequence Hierarchy Removed
    Sequence Analyzer No change
    Semiconductor Module The following debug items have been added:
    • Step Into
    • Step Over
    • Step Out
    The Launch InstrumentStudio button has been added.
  • Altered Execute menu that replaces the Test UUTs and Single Pass items with the Start Lot and Single Test items
  • Modified Insertion Palette pane that displays the Semiconductor Module folder and the Action Step at the top of the Step Types list
  • More detailed Steps pane, including the following changes:
    • The Steps pane of the Sequence File window expands the Description column to include the VI name or ClassName:MethodName for the associated code module. The pane also includes new Num Tests, Pins, and Multisite Option columns.
    • The Steps pane of the Execution window includes a new Module Time column.

When you launch TSM for the first time or enable TSM, it loads the TSM UI Configuration, named NI_SemiconductorModule, and saves the most recently active UI configuration as NI_SemiconductorModule_SavedLayout. When you disable TSM, TestStand loads the NI_SemiconductorModule_SavedLayout UI configuration. You can modify the TSM UI Configuration and restore it to the default state.

Test Program Performance Analysis

During the test program development phase, you can now use built-in TSM tools to measure test program performance and then analyze the resulting data with the Test Program Performance Analyzer. Some common use cases include identifying the slowest test times, identifying low parallel test efficiency (PTE) values, and displaying the overall socket time and the calculated PTE value for each site configuration.

Static Code Analysis

TSM now includes general, performance, best practices, and statistics rules to use in the TestStand Sequence Analyzer. The TSM rules are enabled by default.

TSM now installs the following test, enabled by default, to the LabVIEW VI Analyzer in the TestStand Semiconductor Module section:

  • TSM Context Closing—Verifies that a VI properly closes Semiconductor Module Context references. Detects cases where the output of a Semiconductor Module Context reference is not wired or not wired to a Close Reference function. Closing references in LabVIEW frees up memory that LabVIEW allocates for the references. Failure to close references causes reference leaks, which can negatively affect the performance of the VI over time.

Refer to the LabVIEW Help for more information about the LabVIEW VI Analyzer. In LabVIEW, select Help » LabVIEW Help to launch the LabVIEW Help.

Enabling Sites

The default Configure Lot Settings dialog box now sets the number of sites to the number of sites in the test program pin map. You can use the Enabled Sites control in the dialog box to enable or disable specific sites. You can no longer use the Configure Station Settings dialog box to specify the number of sites to test.

Examples, Tutorials, and Step Templates Support LabVIEW 2018 Features

The TSM examples, tutorials, and step templates incorporate LabVIEW 2018 support for Parallel For Loops with error registers and the High Resolution Polling Wait VI. Refer to the LabVIEW Help for more information about these LabVIEW features. In LabVIEW, select Help » LabVIEW Help to launch the LabVIEW Help.

The examples and tutorials include LabVIEW 2017 and earlier and LabVIEW 2018 and later directories for support files based on the version of LabVIEW you want to use.

When you use TSM step templates, TSM selects the version of the VI template that corresponds to the active version of LabVIEW on the computer. You can save version-specific or version-neutral custom templates in the <TestStand Public> directory.

Support for Correlation Offsets

You can generate a tab-delimited correlation offsets template file based on the numerical limit tests in a sequence file by selecting Semiconductor Module » Export Correlation Offset Template file based on <filename>. You can use the template file as a starting point for a custom correlation offsets file.

Use the Load Correlation Offsets Step and associated edit tab to load and apply correlation offset values to test results on a per-site basis at run time before evaluating the test result data against limits. The Test Results Log includes the correlation offset values.

Get Test Information Step

The Get Test Settings step was redesigned and renamed to Get Test Information. Use the step and the associated edit tab to more easily obtain the values for lot settings, station settings, STS state, execution data, and custom test conditions.

Control STS Test Head Step

Use the Control STS Test Head step and associated edit tab to control properties of the STS. The step requires STS Maintenance Software 17.1 or later and must be run on an STS. Use the Get Test Information step to obtain the TestHead.TestHeadAvailable property at run time to determine whether you can access the STS properties.

Additional Improvements

The NI TestStand 2017 Semiconductor Module includes the following additional enhancements:

  • Custom execution captions—The Windows pane and the Execution window now display the site number and part ID in addition to the sequence filename and testing state.
  • Pin Group and Relay Group API—Use the Get Pins in Pin Group(s) API to obtain a list of pins contained in the pin group or list of pin groups you specify. Use the Get Relays in Relay Group(s) API to obtain a list of relays contained in the relay group or list of relay groups you specify.
  • Numerical order of site numbers—The Get Site Numbers VI and the SiteNumbers .NET property now return site numbers in numerical order instead of in a random order determined by the order in which sites execute.
  • OnSiteTestingComplete—Use the OnSiteTestingComplete callback sequence to perform actions on a DUT or on instruments after all DUT tests have completed and TSM has assigned a bin to the DUT. TSM calls the sequence after the MainSequence sequence, after all PAT tests complete, and after TSM assigns a bin to the DUT.
  • Report Orientation of Test Results Log—You can now specify the orientation of the Test Results Log. The default is portrait orientation. Landscape orientation uses wider columns for tests with long test numbers or test names.
  • SemiconductorModuleManager parameter in handler/prober driver entry points—The handler/prober driver entry points now include a SemiconductorModuleManager parameter, which is an object reference to an instance of a Semiconductor Module Manager that you can use in applications that use the TSM Application API. Use this object reference to get information about test execution, obtain test statistics, monitor the state of the test system, and so on.
  • Menu and Toolbar Improvements—You can now use the Semiconductor Module menu or the TSM toolbar to launch InstrumentStudio.
  • Operator Interface Improvements—The default TSM operator interfaces now include an Open STS Maintenance Software button to launch STS Maintenance Software 17.1 or later. The operator interfaces also display the status of an STS running STS Maintenance Software 18.0 or later. The operator interfaces disable the Start Lot and Single Test buttons when STS Maintenance Software 18.0 or later is using the tester.
  • Adding text data to Test Results Log—You can now add data that is not a measurement or test limit to the Test Results Log.

Compatibility

Refer to the List of Known Issues in NI TestStand 2017 Semiconductor Module on the NI website for a list of known issues in NI TestStand 2017 Semiconductor Module (TSM).

  • TSM removed support for custom operator interfaces based on the default NI TestStand 2013 Semiconductor Module LabVIEW operator interface. Those operator interfaces might not function correctly in NI TestStand 2017 Semiconductor Module. NI TestStand 2014 Semiconductor Module introduced the TSM Application API and significant changes to the default operator interfaces to simplify operator interface implementation. You must upgrade custom operator interfaces to use this new technology.
  • TSM removed many custom properties from the NI.SemiconductorModule container in the attributes of the ModelData container passed to process model plug-ins. Previous versions of TSM used these properties to communicate information among TSM process model plug-ins. This information is now available only in the TSM Application API and the Get Test Information step.
  • TSM 2017 installs SeqEdit.exe.config in the <TestStand>\Bin directory and overwrites any existing file with the same filename in that directory. If you have created a custom SeqEdit.exe.config file, complete the following steps to preserve the custom file.
    1. Move the existing eqEdit.exe.config file to a location outside the <TestStand> directory.
    2. Install TSM 2017.
    3. Compare the SeqEdit.exe.config file TSM 2017 installed to the custom version of the file and merge the custom changes into the file TSM 2017 installed.

TSM 2016 SP1 Changes

Learn about new features, behavior changes, and other updates in TSM 2016 SP1.

Step Templates

Use the TSM step types with template code to perform common operations, such as setting up and closing instruments, powering up a DUT, or executing common tests. You can modify the code to customize the behavior of the step within a test program.

TSM provides template code for the following step types:

  • Setup and Close
    • NI-DCPower Close
    • NI-DCPower Initialize
    • NI-Digital Pattern Close
    • NI-Digital Pattern Initialize
  • DUT Power Up
  • DUT Power Down
  • Burst Pattern
  • Continuity Test
  • Leakage Test

Additional Instrument Support

The TSM Code Module API now includes implementations for NI-DAQmx, NI-DMM, NI-FGEN, and NI-SCOPE.

Custom Instrument Panels

You can now create custom pin- and site-aware instrument panel VIs to debug instruments during test program execution at a breakpoint, which can be useful during test program development and troubleshooting. Custom instrument panels obtain active instrument sessions stored in Semiconductor Module context objects using the Set Session VIs or .NET methods in the TSM Code Module API. During active test program execution, TSM disables the custom instrument panel to avoid conflicts.

The custom instrument panel components must reside in the <TestStand Public>\Components\Modules\NI_SemiconductorModule\InstrumentPanels directory for the panels to appear in the Semiconductor Module menu.

Refer to the Parametric I/V Instrument Panel example and the following resources that you can use as starting points for custom instrument panels you create:

  • Examples located in the <TestStand Public>\Examples\NI_SemiconductorModule\Custom Instrument Panels directory
  • A template for the required custom instrument panel callback sequence file named CustomInstrumentPanel.seq located in the <TestStand>\Components\Modules\NI_SemiconductorModule\Templates directory
  • A template for the required corresponding custom instrument panel LabVIEW project files located in the <TestStand>\Components\Modules\NI_SemiconductorModule\Templates\CustomInstrumentPanelTemplate directory
Note To modify the installed examples or templates, copy the files from the existing locations to the <TestStand Public> directory and make changes to the copies of the files.

Toolbar Improvements

You can now use the TSM toolbar buttons instead of the default TestStand toolbar buttons to resume sequence execution from a breakpoint for lot or part testing.

LabVIEW VI Analyzer Test

TSM now installs the following test, enabled by default, to the LabVIEW VI Analyzer in the TestStand Semiconductor Module section:

  • For Loop Error Handling—Verifies error handling in VIs that use For Loops. Confirms that errors from the For Loop are merged with any errors that occurred before the loop executed to ensure that errors that occur before the loop executes are propagated correctly.

Refer to the LabVIEW Help for more information about the LabVIEW VI Analyzer. In LabVIEW, select Help » LabVIEW Help to launch the LabVIEW Help.

Part Average Testing Support

Part average testing (PAT) is a method based on statistical analysis to identify and fail parts that have characteristics significantly outside the normal distribution of other parts in the same lot. TSM does not install a default implementation of part average testing. You must use the TSM PAT plug-in architecture to customize and perform part average testing with TSM. The TSM PAT plug-ins include a required PAT callback sequence file and corresponding code modules. The PAT callback sequence file contains PAT entry point sequences that TSM calls during execution to accomplish part average testing. Use the example PAT plug-in, located in the <TestStand Public>\Examples\NI_SemiconductorModule\Part Average Testing\Example Part Average Testing Plug-In directory, as a starting point for custom PAT plug-ins you create.

Refer to the Part Average Testing Examples for information about enabling and performing part average testing (PAT) in a test program.

Additional Improvements

The NI TestStand 2016 SP1 Semiconductor Module includes the following additional enhancements:

  • The Standard Test Data Format (STDF) Log result processing plug-in now generates summary records for the Hardware Bin Record (HBR), Software Bin Record (SBR), Test Synopsis Record (TSR), and Part Count Record (PCR) records. The records are included at the end of the STDF log file and have a HEAD_NUM value of 255 to indicate that they are summary records. Visit ni.com/info and enter the Info Code exr3v6 for information about disabling these summary records.
  • TSM now uses the EXEC_TYPE and EXEC_VER fields in the Master Information Record (MIR) of the STDF log file to record whether STS Software is installed and which version is installed.
  • You can now log results only when a DUT fails. Use the Log Results Only for DUT Failures option in the Test Results Logs Options dialog box during debugging to record only failures instead of all test results.
  • You can now use the AvailableSiteNumbers property on the NI_SemiconductorModule_StationSettings data type to specify which site numbers from a pin map for a test program to use when running the test program. For example, you can set this property to disable specific sites or to use the particular connections of a pin map that match the DIB for the test station. The default TSM operator interfaces and the Lot Statistics Viewer display only the sites you specify. Update existing custom LabVIEW or C# operator interfaces to display the configured site numbers when you use the AvailableSites station setting. Additionally, you can modify the ConfigureStationSettings callback to provide a custom operator interface to set the AvailableSites station setting.

    Ensure that any custom handler driver you created reads the Boolean values from the RequestedSiteState parameter in the StartOfTest callback to determine which sites to test. If you use the AvailableSiteNumbers property to specify the set of site numbers for the test program to use, the RequestedSiteState array contains True values for each site number the test uses and False values for each site number the test does not use.

  • In the Pin Map Editor, you can now manually enter relative file paths or manually modify existing file paths to be relative. Browsing to a file using the Select Pin Map File dialog box always uses an absolute path.

    The Get All FPGA Instrument Names, Get All NI-RFPM Instrument Names, Get All NI-RFPM De-embedding Data, Get All NI-5530 RF Port Module Names, and Pin(s) To NI-RFPM Sessions TSM Code Module API VIs and the GetFpgaInstrumentNames, GetNIRfpmInstrumentNames, GetNIRfpmSessions, and GetAllNIRfpmDeembeddingData TSM Code Module API .NET class library methods now resolve file paths differently. If the path is an absolute path, the VI or method returns the absolute path whether the file exists or not. If the path is a relative path and the file exists relative to the path of the pin map file, the VI or method returns the absolute path of the existing file. Otherwise, the VI or method returns a string without error. This change in behavior breaks any test programs that use the previous versions of these VIs or methods that expect relative file paths to remain unresolved.

  • You can now specify and obtain the orientation of data in S2P files that characterize the de-embedding network for each port.

    The pin map XML schema now includes a deembeddingOrientation attribute on the Connection, SystemConnection, and MultiplexedDUTPinRoute elements that you can use with the deembeddingFilePath attribute to specify the orientation of the data in the S2P file relative to the port the channel attribute specifies. Valid values are Port1TowardDUT and Port2TowardDUT.

    The Get All NI-RFPM De-embedding Data VI and the Pin(s) To NI-RFPM Sessions VI now include a De-embedding Files indicator that returns the path and orientation of the data in the S2P file relative to the port you specify. The connector pane for these VIs have changed, which will not break existing code. However, if you want to use the new De-embedding Files indicator, you must replace existing VIs with the new versions of the VIs on the NI-RFPM VIs palette.

  • You can now use the Select All checkboxes on the DUT Pins, System Pins, or Pin Groups tabs of the Pin Map tab of the Pin Map Editor to add or remove pins from the pin group.
  • Refer to the Query Pin/Site Measurement for Unsupported Measurement Type example in the Multisite Programming Scenarios example for information about how to query for measurement data for a pin and site combination if the Extract Pin Data VI does not support the measurement type.

Compatibility

Refer to the List of Known Issues in NI TestStand 2016 SP1 Semiconductor Module on the NI website for a list of known issues in NI TestStand 2016 SP1 Semiconductor Module (TSM).

  • The default TSM operator interfaces display only the sites you specify when you use the AvailableSiteNumbers property on the NI_SemiconductorModule_StationSettings data type to specify which site numbers from a pin map for a test program to use when running the test program. The TSM 2016 and earlier default operator interfaces and custom operator interfaces based on those versions display site numbers starting at 0 and increasing by 1, up to the number of sites. You must update existing custom LabVIEW or C# operator interfaces to display the configured site numbers when you use the AvailableSites station setting.
  • In previous versions of TSM, the RequestedSiteState array in the StartOfTest callback contained only True values. Ensure that any custom handler driver you created reads the Boolean values from the RequestedSiteState parameter in the StartOfTest callback to determine which sites to test. If you use the AvailableSiteNumbers property to specify the set of site numbers for the test program to use, the RequestedSiteState array contains True values for each site number the test uses and False values for each site number the test does not use.
  • The version number of the pin map XML schema changed from 1.2 to 1.3. The schema is not backward compatible with NI TestStand 2016 Semiconductor Module.
  • The Get All FPGA Instrument Names, Get All NI-RFPM Instrument Names, Get All NI-RFPM De-embedding Data, Get All NI-5530 RF Port Module Names, and Pin(s) To NI-RFPM Sessions TSM Code Module API VIs and the GetFpgaInstrumentNames, GetNIRfpmInstrumentNames, GetNIRfpmSessions, and GetAllNIRfpmDeembeddingData TSM Code Module API .NET class library methods now resolve file paths differently. If the path is an absolute path, the VI or method returns the absolute path whether the file exists or not. If the path is a relative path and the file exists relative to the path of the pin map file, the VI or method returns the absolute path of the existing file. Otherwise, the VI or method returns a string without error. This change in behavior breaks any test programs that use the previous versions of these VIs or methods that expect relative file paths to remain unresolved.
  • The Get All NI-RFPM De-embedding Data VI and the Pin(s) To NI-RFPM Sessions VI now include a De-embedding Files indicator that returns the path and orientation of the data in the S2P file relative to the port you specify. The connector pane for these VIs have changed, which will not break existing code. However, if you want to use the new De-embedding Files indicator, you must replace existing VIs with the new versions of the VIs on the NI-RFPM VIs palette.
  • TSM now uses the EXEC_TYPE and EXEC_VER fields in the Master Information Record (MIR) of the STDF log file to record whether STS Software is installed and which version is installed.

TSM 2016 Changes

Learn about new features, behavior changes, and other updates in TSM 2016.

Semiconductor Action Step

Use the Semiconductor Action step to perform an action, such as instrument configuration, with access to the pin map and per-site inputs. You can configure multisite and per-site input options directly on the step.

Support for the Digital Pattern Editor and the NI-Digital Pattern Driver

  • Select Semiconductor ModuleLaunch Digital Pattern Editor or click the Launch Digital Pattern Editor button on the TSM toolbar to open digital pattern project files in the Digital Pattern Editor.
  • Use the Digital Pattern Project panel of the Test Program Editor to specify the pathname of the digital pattern project file to use in the test program. You can use the Specifications Files panel of the Test Program Editor to view the specifications files in a digital pattern project.
  • The Pin Map schema now includes native support for Digital Pattern instruments with the NIDigitalPatternInstrument element.
  • The NI TestStand 2016 Semiconductor Module natively supports digital pattern instruments that use the NI-Digital Pattern Driver, such as the PXIe-6570, and legacy digital waveform instruments that use the NI-HSDIO driver, such as the PXIe-6556. Use the TSM Code Module API that corresponds to the type of digital instrument the test system includes. For example, use the NI-Digital Pattern VIs to manage digital pattern instruments and sessions, to manage digital pattern waveform data, and to access digital pattern project files.
    Note The VIs on this palette are available only in 64-bit LabVIEW.
  • The Accelerometer and Multisite Programming Scenarios examples now use the NI-Digital Pattern driver. Versions of these examples that use the NI-HSDIO driver remain available.

Customizing Operator Interface Run-Time Error Behavior

The default operator interfaces now write a message to an error log file and continue testing when the MainSequence sequence returns a run-time error from a source other than TSM, such as a code module or an instrument driver. You can change the operator interface run-time error behavior by using the two new TSM Application API properties EndLotOnCodeModuleRuntimeError and DisplayDialogOnCodeModuleRuntimeError to specify whether to end the lot and display error dialog boxes when the MainSequence sequence returns a run-time error from a source other than TSM.

C# NI-RFmx and NI-RFPM TSM Code Module API Support

The TSM Code Module API now includes C# implementations for NI-RFmx and NI-RFPM.

Additional Improvements

The NI TestStand 2016 Semiconductor Module includes the following additional enhancements:

  • Expression to Determine Test Number at Run Time—The Result.Evaluations property of the Semiconductor Multi Test step type includes a new TestNumberExpr field, which is an expression that determines the test number at run time. If this expression is not empty, the Semiconductor Multi Test step evaluates the expression and copies the evaluated value to the TestNumber property.
  • Indicating End of Wafer using Batch Process Model—Prober drivers no longer need to set the EndOfWafer parameter of the EndOfTest handler/prober driver entry point to indicate the end of each wafer when using the Batch process model. The NI TestStand 2016 Semiconductor Module determines the end of the wafer from the WaferRuntimeData.StartOfWafer parameter in the StartOfTest handler/prober driver entry point. When using the Batch process model, omitting the wait for an end-of-wafer status message to set the EndOfWafer parameter in the EndOfTest entry point might improve performance of the test system.

    Prober drivers must set the EndOfWafer parameter at the end of each wafer when using the Sequential process model.

  • Bin Types Passed to Handler—TSM passes an array of bin types to the EndOfTest handler/prober driver entry point. Each element in the array indicates the type of bin (Pass, Fail, and so on) of the corresponding element in the SoftwareBinData and HardwareBinData parameter arrays.
  • Temporary STDF File—During testing, the STDF Log result processor writes data to a temporary file with an extension of .stdtemp in the destination directory you specify in the STDF Log Options dialog box. When the file completes, the STDF Log result processor renames the file to the final report filename you specify.

Compatibility

Refer to the List of Known Issues in TestStand NI 2016 Semiconductor Module on the NI website for a list of known issues in NI TestStand 2016 Semiconductor Module (TSM).

  • The default TSM operator interfaces no longer display an error message and end testing when the MainSequence sequence returns a run-time error from a source other than TSM, such as a code module or an instrument driver. Instead, the default operator interfaces now write the error message to an error log file and continue testing the lot. The change in behavior does not affect operator interfaces based on source code from previous versions of TSM. You can change the operator interface run-time error behavior by setting TSM Application API properties on or by handling events from the SemiconductorModuleManager object in the operator interface source code. By default, when any run-time error occurs, TSM assigns the current part to the Default Error bin the bin definitions file specifies.
  • The file extensions for pin map files and bin definitions files have changed from .xml to .pinmap and .bins, respectively. You can continue to load pin map files and bin definitions files with .xml file extensions without error or warning.
  • The Accelerometer examples, located in the <TestStand Public>\Examples\NI_SemiconductorModule\Accelerometer directory, now use the NI-Digital Pattern driver. Refer to the examples in the <TestStand Public>\Examples\NI_SemiconductorModule\Accelerometer - Legacy Digital directory for Accelerometer examples that use the NI-HSDIO driver.
  • TSM detects a retested part by comparing the part IDs or die coordinates that the handler or prober provides for the part to the part IDs and die coordinates that the handler or prober provided for previously tested parts. TSM determines the number of passing and failing parts and the number of parts per bin based on the test results of the last time it tested the part. In the STDF log file, TSM sets the PART_FLG field of the Part Result Records (PRR) that represent results of retested parts and sets the RTST_CNT field of the Wafer Result Record (WRR) and the Part Count Record (PCR) to the number of parts retested one or more times. Previous versions of TSM did not distinguish between the first test of a part and subsequent tests of the same part except when you clicked the Retest toolbar button in the sequence editor. As a result, the part counts that previous versions of TSM generate differ from the part counts that the NI TestStand 2016 Semiconductor Module generates if the handler or prober retests one or more parts. The affected STDF fields include the following:
    • PRR.PART_FLG
    • WCR.GOOD_CNT
    • WCR.PART_CNT
    • WCR.RTST_CNT
    • PCR.GOOD_CNT
    • PCR.PART_CNT
    • PCR.RTST_CNT
    • HBR.HBIN_CNT
    • SBR.SBIN_CNT
  • The name of the NamespacedSymbol(s)ToValue(s) VI on the Specifications palette has changed to Get Specification(s) Value(s). The name change does not require changes to VIs that use the old name.

TSM 2014 SP1 Changes

Learn about new features, behavior changes, and other updates in TSM 2014 SP1.

RFmx Pin Map API

The Pin Map API now supports the RFmx Instrument Sessions.

NI-RFPM Pin Map API

The Pin Map API now supports the RF Port Module (NI-RFPM) API. This API serves as a replacement for the NI-5530 Port Module API. It provides several usability enhancements for developing multi-port RF measurements.

Custom Model Plug-in API

TSM now has an easier way to access lot statistics, start times, end times, wafer information, and handler/prober information in a custom result processor so you can create custom reports and log files.

Execution Profiler

Use the Execution Profiler window to view and record duration of steps, code modules, and other resources a multithreaded TestStand system uses over a period of time. You can review the recorded data in graphs and sortable tables to identify performance bottlenecks and design flaws and to gain insight into the behavior and timing of complex multithreaded systems. You can copy the information to external applications, such as Microsoft Word or Excel.

Additional Improvements

NI TestStand 2014 Semiconductor Module SP1 includes the following additional enhancements:

  • Base Deployment License—The NI TestStand Semiconductor Module Base Deployment License is the minimum license required for all deployed TSM-based applications. Activate this license to deploy the NI TestStand Semiconductor Module Runtime, the TestStand Runtime, and the Switch Executive Runtime. The Base Deployment License enables you to run a TSM operator interface and test programs on the single test station to which the license applies. This license does not grant the ability to perform any development tasks using the TestStand Sequence Editor, a TestStand custom sequence editor, or the TestStand API.
  • Improved Getting Started Content—The getting started content now includes a brief tour of TSM, an overview of test program components, and a new example that demonstrates several features of TSM in a test program that makes common measurements to test an imagined accelerometer part.
  • Start Lot Without Configuring—You can customize the operator interface to run without requiring a Configure Lot button by implementing the ConfigureLotSettings callback to programmatically set the LotSettings instead of using a dialog box.
  • End of Test dialog box—This dialog box launches at the end of each test and displays hardware and software bin information on a per test or per lot basis when you use the Batch or Sequential process model with the NI Simulated Handler Driver.
  • Toolbar Enhancements—You can now use the Selected Configuration control on the TSM toolbar to select the test program configuration to use when testing. The available items correspond to the configurations in the active sequence file. The value initially corresponds to the value of the LotSettings.Standard.ActiveConfigurationName property in the lot settings. If the active sequence file does not contain a configuration that corresponds to the ActiveConfigurationName lot setting, the control displays one of the configurations in the sequence file. Changing the selected configuration with this control does not modify the ActiveConfigurationName lot setting. You can also use the Configure Lot Settings dialog box to change the test program configuration.
  • .NET (C#) Example Code—Code module development topics include .NET example code.

Compatibility

Refer to the List of Known Issues in NI TestStand 2014 Semiconductor Module SP1 on the NI website for a list of known issues in NI TestStand 2014 Semiconductor SP1 (TSM).

  • The method for creating custom DTRs has changed when you enable the Generate One File per Wafer option.
  • The EndOfTest handler/prober driver entry point includes a new EndOfWafer parameter, which must be set to True at the end of each wafer for the Generate One File per Wafer option to function correctly and to generate Wafer Result Records (WRR).
  • To better comply with STDF standards, the START_T field of the Master Information Record (MIR) is recorded at the time the handler or prober sends the initial start-of-test (SOT) signal. In NI TestStand 2014 Semiconductor Module, the START_T field contains the time that the operator clicked the Start Test button.
  • The SemiconductorModuleContext object on any instance of a Semiconductor Multi Test step includes only the pins specified on the Options tab unless you call the step from a process model callback sequence, such as ProcessSetup and ProcessCleanup, in which case the SemiconductorModuleContext object includes all pins in the pin map.

    In previous versions of TSM, when executing with the Sequential or Parallel process models, SemiconductorModuleContext objects included all the pins in the pin map regardless of the settings on the Options tab. Semiconductor Multi Test steps that execute without errors using the Sequential or Parallel process models in NI TestStand 2014 Semiconductor Module might generate run-time errors in NI TestStand 2014 Semiconductor Module SP1 if the code module for the step attempts to use pins that you did not specify on the Options tab. To correct the error, specify all necessary pins on the Options tab of the Semiconductor Multi Test step.