TestStand Semiconductor Module New Features and Changes
- Updated2026-06-19
- 3 minute(s) read
TestStand Semiconductor Module New Features and Changes
Learn about updates, including new features and behavior changes, introduced in each version of TestStand Semiconductor Module.
Discover what is new in the latest releases of TestStand Semiconductor Module.
Note If you cannot find new
features and changes for your version, it might not include user-facing updates.
However, your version might include non-visible changes such as bug fixes and
compatibility updates. For information about non-visible changes, refer to your
product Release Notes.
TestStand Semiconductor Module 2026 Q1 Changes
Learn about new features, behavior changes, and other updates in TSM 2026 Q1.
New Features
This version of the TestStand Semiconductor Module adds support for the following features:
- Improved Runtime Data Viewer functionality.
- Redesigned Runtime Data Viewer to sustain real-time display with a responsive UI throughout long test runs.
- Improved filtering on the Summary tab. A new collapsible Filter
Options panel allows for easier filtering without having to remember
precise syntax options. The Filter Options panel also includes
input validation and inline error feedback. The Filter Options
panel also include two new filters:
- Alarm—Shows only alarmed tests or parts
- SW Bin—Filters by software bin number. SW Bin is also now shown in the part column headers.
- A new Settings dialog lets you set a Max History limit, implementing a cap on the number of batches Runtime Data Viewer retains. This feature limits memory usage during long test runs.
- Added Test Number Generation Override. This feature allows users to populate Test Numbers and detect test number conflicts.
- Added a new Station Settings option that disables tiled execution windows when the specified number of sites is exceeded.
- Added Trace Logging for the following operations and APIs:
- Hardware calls
- Sequence-level events
- TSM Code Module .NET API
- User-supplied calls
- Improved Alarm configuration options. Users can now view the pin groups associated with each pin in the new Pin Groups column. User can also now filter the Alarm configuration table by pin, pin group, or alarm type.
- Steps within a sequence called by a Semiconductor Sequence Call disable certain columns in the Tests tab. The test values defined in the Semiconductor Sequence Call determine which columns to override.
- Semiconductor Sequence Call step now supports autocomplete of the following
parameters:
- Step Names from available steps
- Published Data Ids within the selected subsequence
- Debug Test Results Log now includes pass/fail status and alarm details for each step. The Debug Test Results Log also includes an improved part summary, with assigned binning information and alarm details.
- Added an option to enable TSM to automatically set the bin to the default Error bin. This action happens if no test was performed for a given part. TSM disables this option by default. You must explicitly enable this option.
Behavior Changes
- The Show last batches display filter now appears at the top of the Display Settings panel on the Detailed tab. The filter defaults to enabled with a value of 100, improving display performance on long test runs.
- Step Over and Resume debug commands in TestStand Sequence Editor updated to apply to all executions TSM batches together. The current step Multisite Option configuration determines the application of this feature.
Additional Changes
- TSM no longer supports the ability to create a test program from a Digital Pattern project.
TSM 2024 Q3.1 Patch 2 Changes
TSM 2024 Q3.1 Patch 2 includes only bug fixes. Refer to the TSM bug fix list for a list of bug fixes.
TSM 2024 Q3.1 Patch 1 Changes
TSM 2024 Q3.1 Patch 1 includes only bug fixes. Refer to the TSM bug fix list for a list of bug fixes.
Related Information
- TSM Release Notes
- Viewing TSM Data at Runtime
- Semiconductor Module Menu
- Semiconductor Sequence Call Step
- Logging Trace Data
Use trace logging to track all test activity, including instrument I/O and test operations.
- General Tab
- Alarms Panel
- Debug Test Results Logs (TSM)
- Binning DUTs Based on Test Results (TSM)