5G Changes the Way We Think about Wireless Test
The promises of 5G come with added complexity. New, lower cost over-the-air test techniques are necessary.
We know that semiconductor technology requirements outpace traditional test coverage approaches. That’s why NI prioritizes investments in semiconductor manufacturing software, systems, and automatic test equipment (ATE) that help you build solutions that meet your evolving business needs at every step of the process. With testing support for analog, mixed-signal, 5G, and RF devices, we're uniquely qualified to help you bring new products to market.
With NI’s software-connected approach, you can make data-driven decisions that deliver unprecedented manufacturing efficiency and product reliability.
Quickly characterize the latest wideband RF 5G devices with modular, fast, and accurate lab benches that integrate precision DC, digital, analog, and RF instrumentation.
Reduce the cost of mixed-signal devices, ranging from data converters to power management and optoelectronics.
NI’s parametric test solutions enable you to stay ahead of industry trends through massively parallel and flexible systems that can adapt and scale easily over time.
NI provides a smarter alternative to traditional automated test equipment (ATE) to meet cost and coverage requirements of increasingly complex RF and mixed-signal semiconductor devices.
If you’re anything like us, you’re probably wondering: What’s next for semiconductor? From 5G to optical sensing to autonomous driving, your industry plays a major role in shaping a better future. It's our privilege to innovate with you.
Putting our customers’ needs first and elevating the impact of their creativity and innovation is at the heart of how NI works. We’re proud to work with the semiconductor engineers and enterprises solving some of the world’s most complex challenges.
Using PXI and LabVIEW, we were able to test our MEMS devices at a fraction of the cost, weight, power consumption, and footprint of our previous ATE system.
Analog Devices Inc.
As LED chips get smaller, the number of chips per wafer increases to tens of millions. NI’s PXI SMU helped FitTech solve their throughput challenge.
Imec used accurate electrical wafer-level tests in to detect process-related issues at an early stage to manage yield drops, optimize the R&D process flow, reduce costs, and decrease time to market.
Maximize productivity and reduce costs with NI services. As your trusted partner and expert connector, we’re here to help you Engineer Ambitiously™.