Use the EndOfTest entry point to send the end-of-test notification to move DUTs from test sites to hardware bins.

TSM sends the hardware bin results of the current DUTs to the EndOfTest entry point.

The EndOfTest entry point accepts the following parameters:

Parameter Type Description
HandlerDriverData Input or Output Container that stores handler-specific settings, prober-specific settings, or run-time data. In a handler/prober driver sequence file, you can modify the default structure of this parameter, such as by changing the data type from the default Container to a custom container data type. However, the Configure entry point must create, and optionally assign, each field of this parameter using the TestStand API, such as the PropertyObject.NewSubProperty method or a PropertyObject Set value method, such as SetValNumber.

Do not enable the Check Type option for this parameter. Right-click the parameter and remove the checkmark from Check Type in the context menu to disable the Check Type option.
HardwareBinData Input Array of hardware bin numbers that specify the hardware bins assigned to each part on each site. The index to the array corresponds to the site number of the test site. A hardware bin value of -1 indicates that TSM did not assign a hardware bin for the site for one of the following reasons:
  • When you execute tests using the Batch process model, you disabled the site.
  • When you execute tests using the Parallel process model and the site is not the currently executing site.
SoftwareBinData Input An array of software bins assigned to each part on each site. The index to the array corresponds to the site number of the test site. A software bin value of -1 indicates that TSM did not assign a software bin for the site for one of the following reasons:
  • When you execute tests using the Batch process model, you disabled the site.
  • When you execute tests using the Parallel process model and the site is not the currently executing site.
EndOfWafer Output Boolean value that indicates whether the tester just finished testing the last batch of parts on a wafer. Set this property to True when the prober indicates that there are no more die to test on the wafer. TSM uses this property to determine when to generate Wafer Results Records (WRR) of the STDF log file and to determine when to finish writing STDF logs and Lot Summary Reports when you enable the Generate One File per Wafer option for those report generators.

This output parameter is optional when you execute with the Batch process model. If the prober driver does not set this parameter when executing with the Batch process model, TSM infers the end of the wafer when the prober sets the WaferRuntimeData.StartOfWafer parameter to true in the StartOfTest handler/prober driver entry point. When using the Batch process model, omitting the wait for an end-of-wafer status message to set the EndOfWafer parameter in the EndOfTest entry point might improve performance of the test system.
BinTypes Input Array of numbers that specifies the types of the bins assigned to each part on each site. Each element in the array has one of the following values to indicate the type of bin of the corresponding element in the SoftwareBinData and HardwareBinData parameter arrays:
  • 0—The bin is a Pass bin.
  • 1—The bin is a Fail bin.
  • 2—The bin is an Other bin.
  • -1—TSM did not assign a bin for the part tested on that site.
SemiconductorModuleManager Input or Output Object reference to an instance of a Semiconductor Module Manager. Use this object reference with the TSM Application API to get information about test execution, obtain test statistics, monitor the state of the test system, and so on.
Note If one or more test sockets in a batch execution prematurely stop running, such as when you abort a test socket, TSM stops all tests without calling the EndOfTest entry point for the current DUTs.