Ettus USRP X420 Specifications

These specifications apply to the Ettus USRP X420.

Revision History

Version Date changed Description
379277A-01 April 2026 Initial release.

Looking For Something Else?

For information not found in the specifications for your product, such as operating instructions, browse Related Information.

Definitions

Warranted Specifications describe the performance of a model under stated operating conditions and are covered by the model warranty.

Characteristics describe values that are relevant to the use of the model under stated operating conditions but are not covered by the model warranty.

  • Typical—describes the performance met by a majority of models.
  • Nominal—describes an attribute that is based on design, conformance testing, or supplemental testing.
  • Measured—describes the measured performance of a representative model.

    • Specifications are Measured unless otherwise noted.

    Conditions

    Specifications are valid under the following conditions unless otherwise noted.

    • Specifications are valid at 23 °C ambient temperature.
    • Specifications that reference dBFS are based on a full-scale digital level at the ADC or DAC interface.
    • For receive operations below 500 MHz tuning frequency, specifications are based on a −6 dBFS full-scale level.
    • Specifications are based on the default exhaust airflow configuration.

    Software

    Table 1. Software
    Operating system OpenEmbedded Linux (ARM Cortex‑A53)
    Device software USRP Hardware Driver™ version 4.10.0 or later
    FPGA framework RFNoC
    Application environments GNU Radio
    Programming languages C/C++, Python

    Ettus USRP X420 Pinouts

    Use the pinouts to connect to terminals on the Ettus USRP X420.

    Note RF and LO connectors are repeated on the front panel and organized into two identical groups labeled DB 0 and DB 1. Each DB group provides equivalent radio frequency and local oscillator connectivity.

    Ettus USRP X420 RF Connectors

    Table 2. RF Connector Signal Descriptions
    Connector Connector Type Description
    TX/RX 0 SMA (f), 50 Ω Bidirectional radio frequency signal connector used for transmit and receive operations.
    RX 1 SMA (f), 50 Ω Radio frequency signal connector used for receive‑only operations.

    Ettus USRP X420 LO Connectors

    Table 3. LO Connector Signal Descriptions
    Connector Connector Type Description
    LO IN SMA (f), 50 Ω Input for an external transmit and receive local oscillator signal. +10 dBm damage level. By default, the internal LO source is used.
    LO OUT SMA (f), 50 Ω Output of the transmit and receive local oscillator signal for sharing or external reference. +9 dBm maximum output level By default, the internal LO source is used.

    Ettus USRP X420 GPIO Connector Pinout

    Table 4. GPIO Connector Signal Descriptions
    Connector Connector Type Description
    GPIO 0, GPIO 1 HDMI Type-A General Purpose Input/Output digital terminals. Output voltage can be configured per individual connector, either 1.8 V (default), 2.5 V, or 3.3 V.
    Figure 1. Ettus USRP X420 GPIO Connector Pinout


    Table 5. GPIO Connector Pinout
    Pin Name Direction Voltage Domain Description
    1 Data[0] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    2 GND N/A N/A Ground reference
    3 Data[1] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    4 Data[2] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    5 GND N/A N/A Ground reference
    6 Data[3] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    7 Data[4] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    8 GND N/A N/A Ground reference
    9 Data[5] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    10 Data[6] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    11 GND N/A N/A Ground reference
    12 Data[7] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    13 Data[8] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    14 N/C N/A N/A Do not connect
    15 Data[9] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    16 Data[10] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    17 GND N/A N/A Ground reference
    18 VCC Out +3.3 V External power for GPIO accessories (450 mA maximum)
    19 Data[11] In/Out Configurable (1.8 V, 2.5 V, or 3.3 V) General-purpose digital I/O
    Note The GPIO connector is not intended to drive large loads.
    Note Although the GPIO uses an HDMI connector, it is not an HDMI interface and must not be connected to HDMI equipment.
    Note Digital I/O voltage is selectable per GPIO port and applies to all data pins.
    Note The +3.3 V power pin is disabled by default and can be enabled in software.
    Note The GPIO connector pins are mapped to indexed data signals in software. For details, see the X4x0 GPIO API documentation on uhd.readthedocs.io.

    Ettus USRP X420 Timing and Reference Connectors

    Table 6. Timing and Reference Connector Signal Descriptions
    Connector Connector Type Description
    REF IN SMA (f), 50 Ω Input for an external 10 MHz reference clock signal used for frequency synchronization.
    PPS IN SMA (f), 50 Ω Input for an external pulse‑per‑second (PPS) signal used for time synchronization.
    TRIG IN/OUT SMA (f), 50 Ω Bidirectional trigger signal used for external event synchronization.
    GPS ANT SMA (f), 50 Ω Input for an external GPS antenna used by the onboard GPSDO.

    Ettus USRP X420 High-Speed Data Interfaces

    Table 7. High-Speed Serial Connector Signal Descriptions
    Connector Connector Type Description
    QSFP28 zQSFP+ Supports high‑speed, low‑latency data streaming. Provides four lanes with data rates of up to 25 Gbps per lane and an aggregate bandwidth of up to 100 Gbps. Conforms to QSFP28 industry‑standard electrical and signaling specifications.
    iPass+ zHD iPass+ zHD The iPass+ zHD connectors are not used on this product. Do not connect peripheral devices to these connectors.

    Ettus USRP X420 System Interfaces

    Table 8. System Interface Connector Signal Descriptions
    Connector Connector Type Description
    CONSOLE JTAG USB-C USB Type‑C connector for development and debugging. Provides access to JTAG, PS serial console, and SCU serial console. Use 115200 baud, 8 data bits, 1 stop bit, no parity.
    USB to PS USB-C USB Type‑C connector supporting USB 2.0 for peripheral devices connected to the processing system (PS). Supports tasks such as accessing USB mass storage devices and writing a new file system to internal storage.
    ETHERNET RJ45 1 Gb Ethernet connector that interfaces with the onboard processing system (PS). Supports SSH access and UHD management traffic in Network Mode. The interface uses a DHCP‑assigned IP address by default.

    Physical Characteristics

    Table 9. Physical Characteristics
    Dimensions, enclosure 26.7 cm × 22.2 cm × 4.4 cm (10.5 in. × 8.7 in. × 1.7 in.)
    Dimensions, enclosure with connectors 28.5 cm × 22.2 cm × 4.4 cm (11.2 in. × 8.7 in. × 1.7 in.)
    Weight 2.8 kg (6.2 lb)
    Form factor 1U half-wide 19" rack
    Note For more information on product dimensions, visit ni.com/dimensions, search by model number, and click the appropriate link.

    Controller

    Table 10. Processing System
    CPU Quad-core ARM Cortex-A53 (1200 MHz)
    RAM 4 GB DDR4, 2.4 GT/s
    Storage 32 GB eMMC (Pseudo SLC)
    Host Ethernet interface 1 GbE host connection (RJ45)
    USB interface

    USB to PS: USB-C (USB 2.0)

    Console/JTAG: USB-C
    Table 11. Programmable Logic
    FPGA model AMD RFSoC XCZU28DR
    FPGA speed grade Speed Grade −1
    RAM 2 × 4 GB DDR4, 2.4 GT/s
    SD-FEC cores 8 dedicated SD-FEC cores
    Interfaces and protocols

    2 × QSFP28, 4 lanes each, 10/100 GbE, Aurora (with custom FPGA bitfile)

    2 × iPass+ zHD, 4 lanes each
    GPIO 2 × HDMI GPIO
    • 12 I/O lines per connector; 100 Mbps max
    • Selectable I/O voltage: 3.3 V, 2.5 V, 1.8 V
    Trigger SMA trigger interface with bidirectional trigger input and output; 3.3 V I/O voltage
    Table 12. Baseband
    Supported I/Q sample rates Default I/Q Sample Rate (Master Clock Rate) applicable for RF specifications:
    • 1.25 GSps
    Other supported rates:
    • 491.52 MSps
    • 250 MSps
    • 245.76 MSps
    Lower rates are supported through integer resamplers in the X4_200 bitfile.
    Number of available channels 2

    RF Frequency

    Table 13. Frequency Characteristics
    Frequency range 10 MHz to 20 GHz
    Frequency step < 1 kHz
    Table 14. Maximum Instantaneous Real-Time Bandwidth Per Channel
    10 MHz to 2.2 GHz 200 MHz[1]1 1.5 GHz (L-Band) center frequency supports up to 1000 MHz instantaneous real-time bandwidth.
    2.2 GHz to 20 GHz

    1000 MHz (xx_1000 FPGA image)

    200 MHz (other FPGA image flavors)

    RF Transmitter

    Table 15. TX Baseline Characteristics
    Number of channels 2 (independent)
    TX/RX switch settling time 1.5 µs
    Non-harmonic spurs[2]2 Measured at TX Gain = 45 dB. Excludes LO leakage, residual sideband image, and baseband harmonics. better than −60 dBc
    Table 16. TX Maximum Output Power, Typical
    < 100 MHz ≥ 15.0 dBm
    100 MHz to 500 MHz ≥ 20.0 dBm
    500 MHz to 6 GHz ≥ 18.5 dBm
    6 GHz to 9 GHz ≥ 19.0 dBm
    9 GHz to 15 GHz ≥ 13.0 dBm
    15 GHz to 18 GHz ≥ 10.0 dBm
    18 GHz to 20 GHz ≥ 7.5 dBm
    Note The values listed in Table 16. TX Maximum Output Power, Typical were measured at the maximum gain setting (TX Gain = 68 dB) using a 0 dBFS CW signal. The output power is not leveled and can be compressed.
    Table 17. TX Gain Range, Nominal
    10 MHz to 6 GHz 22 dB to 68 dB
    6 GHz to 9 GHz 0 dB to 68 dB
    9 GHz to 20 GHz 19 dB to 68 dB
    Table 18. TX Gain Step, Nominal
    10 MHz to 6 GHz 2 dB
    6 GHz to 20 GHz 1 dB
    Table 19. TX Gain Settling Time
    10 MHz to 6 GHz 2 µs
    6 GHz to 20 GHz 10 µs[3]3 For center frequencies above 9 GHz, TX gain may overshoot by up to 18 dB during the settling interval. Resulting output power depends on the baseband signal and does not exceed the maximum specified output power.
    Note The values listed in Table 19. TX Gain Settling Time include both analog settling and configuration latency.
    Table 20. TX Average Noise Density
    100 MHz to 500 MHz ≤ −152.5 dBm/Hz
    500 MHz to 3.6 GHz ≤ −145.2 dBm/Hz
    3.6 GHz to 6 GHz ≤ −143.9 dBm/Hz
    6 GHz to 9 GHz ≤ −141.8 dBm/Hz
    9 GHz to 12 GHz ≤ −139.1 dBm/Hz
    12 GHz to 16 GHz ≤ −141.2 dBm/Hz
    16 GHz to 20 GHz ≤ −143.4 dBm/Hz
    Note The values listed in Table 20. TX Average Noise Density were measured at TX Gain = 45 dB.
    Table 21. TX OIP3
    10 MHz to 6 GHz 14.9 dBm
    6 GHz to 9 GHz 19.9 dBm
    9 GHz to 15 GHz 14.8 dBm
    15 GHz to 20 GHz 9.5 dBm
    Note The values listed in Table 21. TX OIP3 were measured at TX Gain = 45 dB.
    Table 22. TX Phase Noise
    1 GHz center frequency, 1 kHz offset −96 dBc/Hz
    1 GHz center frequency, 10 kHz offset −111 dBc/Hz
    1 GHz center frequency, 100 kHz offset −121 dBc/Hz
    5.8 GHz center frequency, 1 kHz offset −81 dBc/Hz
    5.8 GHz center frequency, 10 kHz offset −96 dBc/Hz
    5.8 GHz center frequency, 100 kHz offset −106 dBc/Hz
    18 GHz center frequency, 1 kHz offset −71 dBc/Hz
    18 GHz center frequency, 10 kHz offset −84 dBc/Hz
    18 GHz center frequency, 100 kHz offset −95 dBc/Hz
    Note The values listed in Table 22. TX Phase Noise represent single-sideband phase noise, measured at TX Gain = 46 dB.
    Table 23. TX LO Leakage
    10 MHz to 500 MHz N/A
    500 MHz to 6 GHz < −33 dBc
    6 GHz to 9 GHz < −40 dBc
    9 GHz to 20 GHz < −40 dBc
    Table 24. TX Residual Sideband Image
    10 MHz to 500 MHz N/A
    500 MHz to 6 GHz < −45 dBc
    6 GHz to 9 GHz < −40 dBc
    9 GHz to 20 GHz < −45 dBc
    Note The values listed in Table 23. TX LO Leakage and Table 24. TX Residual Sideband Image were measured at Tone offset = 10 MHz, TX Gain = 45 dB, and USRP Hardware Driver™ TX corrections applied.

    TX Measurements

    TX Error Vector Magnitude

    Table 25. TX EVM Measurement Conditions
    Link direction UL
    Duplex FDD
    Antenna configuration SISO
    Carrier aggregation 4CC × 100 MHz
    Bandwidth 400 MHz
    Subcarrier spacing 120 kHz
    Modulation 256-QAM
    UHD IQ and DC Offset Correction Applied
    Frequency Tune Frequency (no offset)
    Note For the Carrier aggregation and Bandwidth characteristics listed in Table 25. TX EVM Measurement Conditions, a 1 GHz frequency measurement utilizes 1CC × 100 MHz.
    Figure 2. TX EVM Bathtub Curves, 5G NR

    TX error vector magnitude bathtub curves for a 5GNR uplink signal at multiple center frequencies, showing EVM variation versus channel offset for each frequency.

    TX Output Power

    Note Linear output power represents output power within the linear operating region of the transmit chain. Maximum output power can be higher and can involve gain compression and increased distortion.
    Table 26. TX Output Power Measurement Conditions
    Baseband level 0 dBFS
    Signal type CW
    Frequency Tune frequency + 10 MHz offset
    Figure 3. TX Maximum Output Power, Gain Setting Maximum

    TX maximum output power versus frequency for a continuous‑wave signal at tune frequency, measured at typical temperature with maximum gain applied.
    Figure 4. TX Maximum Output Power, Gain Setting Maximum, 0 °C to 50 °C

    TX maximum output power versus frequency for a continuous‑wave signal at tune frequency, measured across a temperature range from 0 °C to 50 °C with maximum gain applied.
    Figure 5. TX Output Power, Gain Setting 52, 23 °C

    TX output power versus frequency for a continuous‑wave signal at tune frequency, measured at 23 °C with gain setting 52.
    Figure 6. TX Output Power, Gain Setting 52, 0 °C to 50 °C

    TX output power versus frequency for a continuous‑wave signal at tune frequency, measured across a temperature range from 0 °C to 50 °C with gain setting 52.

    RF Receiver

    Table 27. RX Baseline Characteristics
    Number of channels 2 (independent)
    Maximum input power, damage level 0 dBm, nominal
    Notice Supplying input power in excess of the maximum input power can result in permanent device damage. Using the manual RX gain profile can reduce the hardware damage threshold and increase the risk of damage at lower input power levels.
    Table 28. RX Input Power to Reach 0 dBFS, at 32 dB Gain
    10 MHz to 500 MHz[4]4 Full scale definition is −6 dBFS below 500 MHz tuning frequency where the direct sampling path is used. < −8.4 dBm
    500 MHz to 20 GHz < −0.6 dBm
    Table 29. RX Gain Range, Nominal
    10 MHz to 1.4 GHz 0 dB to 48 dB
    1.4 GHz to 2.9 GHz 0 dB to 47 dB
    2.9 GHz to 4.1 GHz 0 dB to 40 dB
    4.1 GHz to 6 GHz 0 dB to 38 dB
    6 GHz to 8 GHz 0 dB to 36 dB
    8 GHz to 9 GHz 0 dB to 34 dB
    9 Hz to 14 GHz 0 dB to 35 dB
    14 GHz to 20 GHz 0 dB to 32 dB
    Table 30. RX Gain Step
    Step size 1 dB, nominal
    Table 31. RX Gain Settling Time
    10 MHz to 2.9 GHz < 3.5 µs
    2.9 GHz to 9 GHz < 18 µs
    9 GHz to 20 GHz < 11 µs
    Table 32. RX Noise Figure
    1.0 GHz 9.9 dB
    2.4 GHz 11.1 dB
    3.5 GHz 12.8 dB
    5.8 GHz 16.4 dB
    7.1 GHz 16.3 dB
    13 GHz 19.9 dB
    18 GHz 22.5 dB
    Table 33. RX Input IP3
    1.0 GHz 5.7 dBm
    2.4 GHz 10.5 dBm
    3.5 GHz 2.1 dBm
    5.8 GHz 3.5 dBm
    7.1 GHz 2.6 dBm
    13 GHz 7.2 dBm
    18 GHz 5.5 dBm
    Note The values listed in Table 33. RX Input IP3 were measured at −30 dBm input power and maximum gain.
    Table 34. RX DC Offset
    10 MHz to 500 MHz N/A
    500 MHz to 6 GHz < −54 dBFS
    6 GHz to 9 GHz < −42 dBFS
    9 GHz to 20 GHz < −61 dBFS
    Table 35. RX Residual Sideband Image
    10 MHz to 500 MHz N/A
    500 MHz to 6 GHz < −45 dBc
    6 GHz to 9 GHz < −45 dBc
    9 GHz to 20 GHz < −45 dBc
    Note The values listed in Table 34. RX DC Offset and Table 35. RX Residual Sideband Image were measured with Tone offset = 10 MHz, RX Gain = 30 dB, and USRP Hardware Driver™ RX corrections applied.

    RX Measurements

    RX Error Vector Magnitude

    Table 36. RX EVM Measurement Conditions
    Link direction UL
    Duplex FDD
    Antenna configuration SISO
    Carrier aggregation 4CC × 100 MHz
    Bandwidth 400 MHz
    Subcarrier spacing 120 kHz
    Modulation 256-QAM
    Note For the Carrier aggregation and the Bandwidth characteristics listed in RX EVM Measurement Conditions, a 1 GHz frequency measurement utilizes 1CC × 100 MHz.
    Figure 7. RX EVM Bathtub Curves, 5G NR

    RX error vector magnitude bathtub curves for a 5G NR signal at multiple center frequencies. The plot shows EVM variation versus input power offset for each frequency.

    RX Input Power

    Figure 8. RX Input Power to Reach 0 dBFS, at 32 dB Gain

    RX input power versus frequency for a continuous‑wave signal at tune frequency, measured with maximum gain applied.

    RX Noise Figure

    Figure 9. RX Noise Figure, Gain Setting Maximum

    Line graph showing receiver noise figure in dB versus frequency from about 1 GHz to 20 GHz, with noise figure increasing gradually with frequency and a noticeable mid‑band discontinuity.

    RF Isolation

    Table 37. TX-RX Isolation
    500 MHz 97 dBc
    6 GHz 103 dBc
    9 GHz 102 dBc
    18 GHz 71 dBc
    Note The values listed in Table 37. TX-RX Isolation were measured at 0 dBm TX output power and 0 dBm RX input power.

    RF Local Oscillator

    Note Local oscillator import/export and multi-channel phase behavior depend on configuration.
    Table 38. General Specifications
    LO IN damage level +10 dBm, nominal
    Table 39. Frequency Range
    LO IN 500 MHz to 6 GHz, nominal
    LO OUT 500 MHz to 6 GHz, nominal
    Note Internal LO multiplication is applied to achieve higher frequencies.
    Table 40. Power Level
    LO IN[5]5 Recommended LO IN power level.

    −5 dBm for RF tune frequencies ≤1.6 GHz

    0 dBm for RF tune frequencies >1.6 GHz
    LO OUT

    −5 dBm nominal for RF tune frequencies ≤1.6 GHz

    0 dBm nominal for RF tune frequencies >1.6 GHz

    RF Phase Coherency

    Note This section describes measured phase and delay stability between channels under defined operating conditions. Phase coherency depends on configuration and reference distribution.
    Note Phase stability and repeatability depend on reference clock quality, LO distribution, and system configuration. Frequency retunes, session restarts, and power cycles are treated as repeatability events unless otherwise noted.
    Note Phase coherency results are sensitive to LO import/export configuration, reference clock quality, and LO power levels. Results may vary for different configurations.

    Definitions

  • Phase stability—describes the short‑term variation of phase and delay measured over a continuous observation window.
  • Phase repeatability—describes the variation of phase and delay observed after configuration‑changing events such as power cycles.
  • Repeatability events—include frequency retunes, session restarts, and power cycles unless otherwise noted.

    • Measurement Conditions

    Table 41. RF Phase Coherency Measurement Conditions
    Master clock rate 1250 MS/s[6]6 For coherent operation, the Ettus USRP X420 supports a 1250 MS/s master clock rate at initial release. Support for additional master clock rates is planned for a future software release.
    Baseband stimulus Constant‑amplitude multitone
    Signal bandwidth 800 MHz (80% of in‑band)
    RX number of tones 1600
    TX number of tones 400
    Tone spacing 500 kHz
    Observation window (single data point) 1 ms
    IQ imbalance and DC correction Enabled
    Reference clock External 10 MHz (OctoClock‑G CDA‑2990)
    PPS OctoClock‑G CDA‑2990
    LO distribution Device 0 LO OUT to all LO IN ports[7]7 The LO distribution uses an SC 2510 microwave distribution amplifier from Signal Craft Technologies. For details, see SC 2510 under Related Information.
    Temperature 23 °C after 30‑minute warm‑up

    TX Phase Stability

    Table 42. TX Phase Stability (Standard Deviation)
    Tune Frequency Single Device Phase RMS Single Device Delay RMS Multi-Device Phase RMS Multi-Device Delay RMS
    2.4 GHz 0.082 deg 0.206 ps 0.150 deg 0.824 ps
    5.8 GHz 0.031 deg 0.206 ps 0.045 deg 0.824 ps
    10 GHz 0.040 deg 0.206 ps 0.072 deg 0.824 ps
    13 GHz 0.038 deg 0.206 ps 0.075 deg 0.824 ps
    18 GHz 0.045 deg 0.206 ps 0.093 deg 0.824 ps

    RX Phase Stability

    Table 43. RX Phase Stability (Standard Deviation)
    Tune Frequency Single Device Phase RMS Single Device Delay RMS Multi-Device Phase RMS Multi-Device Delay RMS
    2.4 GHz 0.010 deg 0.092 ps 0.029 deg 0.666 ps
    5.8 GHz 0.003 deg 0.092 ps 0.006 deg 0.666 ps
    10 GHz 0.017 deg 0.092 ps 0.043 deg 0.666 ps
    13 GHz 0.016 deg 0.092 ps 0.054 deg 0.666 ps
    18 GHz 0.038 deg 0.092 ps 0.073 deg 0.666 ps

    TX Phase Repeatability

    Table 44. TX Phase Repeatability (Power-Cycle Events)
    Tune Frequency Single Device Phase RMS Single Device Delay RMS Multi-Device Phase RMS Multi-Device Delay RMS
    2.4 GHz 0.016 deg 0.119 ps 0.280 deg 4.514 ps
    5.8 GHz 0.048 deg 0.119 ps 0.106 deg 4.514 ps
    10 GHz 0.066 deg 0.119 ps 0.141 deg 4.514 ps
    13 GHz 0.072 deg 0.119 ps 0.202 deg 4.514 ps
    18 GHz 0.087 deg 0.119 ps 0.239 deg 4.514 ps

    RX Phase Repeatability

    Table 45. RX Phase Repeatability (Power-Cycle Events)
    Tune Frequency Single Device Phase RMS Single Device Delay RMS Multi-Device Phase RMS Multi-Device Delay RMS
    2.4 GHz 0.002 deg 0.083 ps 0.011 deg 3.888 ps
    5.8 GHz 0.005 deg 0.083 ps 0.012 deg 3.888 ps
    10 GHz 0.011 deg 0.083 ps 0.030 deg 3.888 ps
    13 GHz 0.013 deg 0.083 ps 0.039 deg 3.888 ps
    18 GHz 0.013 deg 0.083 ps 0.021 deg 3.888 ps

    GPS Disciplined Oscillator (GPSDO)

    Table 46. Frequency Accuracy
    OCXO (not locked to GPS)[8]8 Factory default accuracy. To tune the OCXO output frequency, contact NI. 2.5 ppm
    OCXO (locked to GPS) 5 ppb
    Note The values listed in Table 46. Frequency Accuracy are based on oven‑controlled crystal oscillator (OCXO) vendor specifications and are not measured. You can use an external reference source to provide a more precise frequency reference clock and improve frequency accuracy.
    Table 47. Active Antenna
    Type 3.3 V active antenna
    Power 0.19 W
    Frequency band(s) L1, C/A 1.574 GHz

    Power

    Notice The protection provided by this product may be impaired if it is used in a manner not described in this document.
    Table 48. Power
    Voltage rating 12 V DC
    Current/power rating 16 A, maximum
    Power supply 190 W, minimum[9]9 For part numbers, see the Ettus USRP X420 User Manual.
    Caution The product must be powered with an AC adapter offered by NI that meets the power requirements for the product and has appropriate safety certification marks for country of use.

    Environmental Guidelines

    Notice Failure to follow the mounting instructions in the Ettus USRP X420 User Manual can cause temperature derating.
    Notice Use this product indoors only.
    Notice Apply strain relief near the input connectors of all cables. Ensure the strain relief does not cause directional bias on the cable connectors within the input connectors.

    Environmental Characteristics

    Table 49. Temperature
    Operating temperature, with exhaust fans (default) 0 °C to 50 °C
    Operating temperature, with intake fans 0 °C to 45 °C
    Storage temperature −40 °C to 71 °C
    Table 50. Humidity
    Operating humidity 10% to 90%, non-condensing
    Storage humidity 5% to 95%, non-condensing
    Table 51. Pollution Degree
    Pollution Degree 2
    Table 52. Maximum Altitude
    Maximum altitude 2,000 m (800 mbar) (at 25 °C ambient temperature)
    Table 53. Shock and Vibration
    Operating vibration 5 to 500 Hz, 0.3 g RMS
    Non-operating vibration 5 to 500 Hz, 2.4 g RMS
    Operating shock 30 g, half-sine, 11 ms pulse
    Non-operating shock 50 g, half-sine, 11 ms pulse

    1 1.5 GHz (L-Band) center frequency supports up to 1000 MHz instantaneous real-time bandwidth.

    2 Measured at TX Gain = 45 dB. Excludes LO leakage, residual sideband image, and baseband harmonics.

    3 For center frequencies above 9 GHz, TX gain may overshoot by up to 18 dB during the settling interval. Resulting output power depends on the baseband signal and does not exceed the maximum specified output power.

    4 Full scale definition is −6 dBFS below 500 MHz tuning frequency where the direct sampling path is used.

    5 Recommended LO IN power level.

    6 For coherent operation, the Ettus USRP X420 supports a 1250 MS/s master clock rate at initial release. Support for additional master clock rates is planned for a future software release.

    7 The LO distribution uses an SC 2510 microwave distribution amplifier from Signal Craft Technologies. For details, see SC 2510 under Related Information.

    8 Factory default accuracy. To tune the OCXO output frequency, contact NI.

    9 For part numbers, see the Ettus USRP X420 User Manual.