sbRIO-9637 Specifications

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Updated2024-03-12
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This document lists the specifications for the NI sbRIO-9637. The following specifications are typical for the -40 °C to +85 °C operating temperature range unless otherwise noted.

Caution Do not operate the sbRIO-9637 in a manner not specified in this document. Product misuse can result in a hazard. You can compromise the safety protection built into the product if the product is damaged in any way. If the product is damaged, return it to NI for repair.

Processor

Type	Xilinx Zynq-7000, XC7Z020 All Programmable SoC
Architecture	ARM Cortex-A9
Speed	667 MHz
Cores	2
Operating system	NI Linux Real-Time (32 bit)
Nonvolatile memory^[1]¹ Formatted nonvolatile memory may be slightly less than this value.	512 MB
Volatile memory (DRAM)	512 MB
Real-time clock, accuracy	5 ppm
Flash reboot endurance^[2]² You can increase the flash reboot endurance value by performing field maintenance on the device. If you expect that your application may exceed the maximum cycle count listed in this document, contact NI support for information about how to increase the reboot endurance value.	100,000 cycles

Note For information about the life span of the nonvolatile memory and about best practices for using nonvolatile memory, visit ni.com/info and enter the Info Code SSDBP.

Operating System

Note For minimum software support information, visit ni.com/info and enter the Info Code swsupport.

Supported operating system

NI Linux Real-Time (32-bit)

Minimum software requirements

Application software
LabVIEW	LabVIEW 2015, LabVIEW 2015 Real-Time Module, LabVIEW 2015 FPGA Module

Driver software

NI CompactRIO Device Drivers August 2015

To set up a C/C++ based toolchain, visit ni.com/info and enter the info code NILRTCrossCompile for more information.

Reconfigurable FPGA

Type	Xilinx Zynq-7000, XC7Z020 All Programmable SoC
Number of logic cells	85,000
Number of flip-flops	106,400
Number of 6-input LUTs	53,200
Number of DSP slices (18 x 25 multipliers)	220
Available block RAM	560 KB
Number of DMA channels	16
Number of logical interrupts	32

Network/Ethernet Port

Number of interfaces
Front Panel Ethernet	1 (Eth0)

Network interface

10Base-T, 100Base-TX, and 1000Base-T Ethernet^[3]³ For revision D and earlier, 1000Base-T Ethernet link and communication is not guaranteed for the Ethernet port below -20 °C. If you expect ambient temperatures below -20 °C, NI recommends using a 10/100 network infrastructure or assigning 10/100Mbps communication speeds to the Ethernet Adapter in NI Measurement & Automation Explorer (MAX).

Compatibility

IEEE 802.3

Communication rates

10 Mbps, 100 Mbps, 1000 Mbps auto-negotiated, half-/full-duplex

Maximum cabling distance

100 m/segment

RS-232 (DTE) Serial Port

Number of interfaces
Onboard RS-232	2 (Serial1, Serial2)

Baud rate support

Arbitrary

Maximum baud rate

230,400 bps

Data bits

5, 6, 7, 8

Stop bits

1, 2

Parity

Odd, Even, Mark, Space

Flow control

RTS/CTS, XON/XOFF, DTR/DSR, None

RS-485 Serial Port

Number of interfaces
Onboard RS-485	1 (Serial3)

Maximum baud rate

460,800 bps

Data bits

5, 6, 7, 8

Stop bits

1, 1.5, 2

Parity

Odd, Even, Mark, Space

Flow control

XON/XOFF

Wire mode

4-wire, 2-wire, 2-wire auto

Isolation voltage, port to earth ground

None

Embedded CAN

Number of interfaces
Onboard CAN	1 (CAN0)

Onboard CAN transceiver

NXP PCA82C251T

Maximum baud rate

1 Mbps

Minimum baud rate

10 kbps

USB Port

Number of interfaces
Front Panel USB Host	1 (USB0)

Compatibility

USB 2.0, Hi-Speed

Maximum data rate

480 Mb/s

Maximum front panel USB current

900 mA

SD Card Slot

Number of interfaces
Front Panel SD	1 (SDIO0)

Supported Standards

SD, SDHC^[4]⁴ Both standard SD and microSD interfaces are supported.

Front Panel SD Throughput
Read	12.0 MB/s maximum
Write	9.0 MB/s maximum

3.3 V Digital I/O on 50-Pin IDC Connector

Number of DIO channels

Maximum tested current per channel

±3 mA

Input logic levels
Input low voltage, V_IL	-0.3 V minimum; 0.8 V maximum
Input high voltage, V_IH	2.0 V minimum; 5.25 V maximum

Output logic levels
Output high voltage, V_OHwhen sourcing 3 mA	2.4 V minimum; 3.45 V maximum
Output low voltage, V_OL when sinking 3 mA	0.0 V minimum; 0.4 V maximum

Analog Input Characteristics

Number of channels

16 single-ended or 8 differential

ADC resolution

16 bits

Maximum aggregate sampling rate

200 kS/s

Input range

±10 V, ±5 V, ±2 V, ±1 V

Maximum working voltage (signal + common mode)
10 V range	±11 V
5 V range	±10.5 V
2 V range	±9 V
1 V range	±8.5 V

Input impedance
Powered on	> 1 GΩ in parallel with 100 pF
Powered off/overload	2.3 kΩ minimum

Overvoltage protection
Powered on	±25 V, for up to 2 AI pins
Powered off	±15V

AI accuracy


Measurement Conditions	Range	Percent of Reading (Gain Error)	Percent of Range (Offset Error)
Typical (25 °C, ±5 °C)	1 V	0.042%	0.007%
	2 V		0.007%
	5 V		0.007%
	10 V		0.008%
Max (-40 to 85 °C)	1 V	0.380%	0.179%
	2 V	0.360%	0.138%
	5 V	0.348%	0.113%
	10 V	0.344%	0.105%

Gain drift

12 ppm of reading/°C

Offset drift

4 ppm of range/°C

AI noise
10 V range	200 μVrms
5 V range	105 μVrms
2 V range	45 μVrms
1 V range	30 μVrms

INL

±64 ppm of range, maximum

DNL

No missing codes guaranteed

CMRR, DC to 60 Hz

-80 dB

Input bandwidth (-3 dB)

540 kHz, typical

Settling error (multichannel scanning)

±60 ppm step size, typical

Crosstalk (10 kHz)

-70 dB

Typical performance

1378 — Figure 1. Common Mode Rejection Ratio versus Frequency

Analog Output Characteristics

Number of channels

DAC resolution

16 bits

Maximum update rate^[5]⁵ This is the maximum update rate when running one AO channel in a loop with the FPGA top-level clock set to 40 MHz.

336 kS/s

Range

±10 V

Overrange operating voltage
Minimum	10.3 V
Typical	10.6 V
Maximum	10.9 V

Output impedance

0.4 Ω typical

Current drive

±3 mA/channel maximum

Protection

Short-circuit to ground

Power-on state^[6]⁶ When the analog output initializes, a voltage glitch occurs for about 20 μs, peaking at 1.3 V, typical.

0 V

AO accuracy


Measurement Conditions	Percent of Reading (Gain Error)	Percent of Range (Offset Error)^[7]⁷ Range is 5 V.
Typical (25 °C, ±5 °C)	0.09%	0.02%
Maximum (-40 to 85 °C)	0.50%	0.20%

Gain drift

23 ppm of reading/°C

Offset drift

5.4 ppm of range/°C

INL

±194 ppm of range, maximum

DNL

±16 ppm of range, maximum

Capacitive drive

1.5 nF, typical

Slew rate

3.7 V / μsec, typical

Settling time (100 pF load to 320 μV)
FS step	50 μs
2 V step	12 μs
0.2 V step	9 μs

CMOS Battery

Note The battery is user-replaceable. The NI sbRIO device ships with a BR1225 coin cell battery from RAYOVAC, which is industrial-rated. Ensure that power remains connected to the NI sbRIO device while you replace the battery so that time-keeping is not disrupted. Refer to the Battery Replacement and Disposal section for information about replacing the battery.

Typical battery life with power applied to power connector	10 years
Typical battery life in storage at 55 °C	2.5 years ^[8]⁸ Battery life may drop dramatically in extreme temperatures.

Power Outputs on 50-Pin IDC Connector

Caution This output is protected by a fuse. Exceeding the power limits may cause this fuse to open.

+5 V power output
Output voltage	5 V ±5%
Maximum current	1.5 A
Maximum ripple and noise	50 mV

Power Requirements

The NI sbRIO device requires a power supply connected to the power connector. Refer to the Powering On the NI sbRIO Device section in the NI sbRIO-9637 Getting Started Guide on ni.com/manuals for information about connecting the power supply.

Caution Exceeding the power limits may cause unpredictable device behavior.

Recommended power supply	55 W, 30 VDC maximum
Power supply voltage range	9 VDC to 30 VDC
Reversed-voltage protection	30 VDC
Power consumption	26 W maximum

Environmental

Caution Clean the sbRIO-9637 with a soft, nonmetallic brush. Make sure that the device is completely dry and free from contaminants before returning it to service.

Local ambient operating temperature near device (IEC 60068-2-1, IEC 60068-2-2)

-40 °C to 85 °C ^[9]⁹ If you expect ambient temperatures below -20 °C, NI recommends using a 10/100 network infrastructure or assigning 10/100Mbps communication speeds to the Ethernet Adapter in NI MAX. Refer to the Network/Ethernet Port section of this document for more information.

Maximum reported onboard sensor temperature
CPU/FPGA temperature	98 °C
Primary System temperature	85 °C
Secondary System temperature	85 °C

Table 1. Component Maximum Case Temperature
Component	Manufacturer	Maximum Case Temperature
CPU/FPGA	Xilinx	NA^[10]¹⁰ Use digital approach to ensure the on-chip temperature reading is below 98°C.
DDR memory	Micron	95 °C
NAND flash	Micron	89 °C
CPLD	Lattice	94 °C
USB PHY	Microchip	120 °C
ENET PHY	Micrel	120 °C

The sbRIO-9637 includes three onboard temperature monitoring sensors to simplify validation of a thermal solution by indicating thermal performance during validation and deployment. The sensors measure the CPU/FPGA junction temperature and printed circuit board temperatures that can be used to approximate the primary and secondary side local ambient temperatures. This approach is called digital validation. Alternatively, the traditional analog approach using thermocouples can be used to validate thermal performance. The digital approach is more accurate for determining the performance of the CPU/FPGA but is more conservative for determining the local ambient temperatures. NI recommends using digital validation.

For digital validation, ensure that the reported CPU/FPGA, reported Primary System, and reported Secondary System temperatures do not exceed any of the maximum temperatures listed in this document. Thermal validation is complete if the reported temperatures are within specifications. For more information about how to access the onboard sensors, visit ni.com/info and enter the Info Code sbriosensors. If the reported Primary System temperature or reported Secondary System temperature exceed the maximum temperatures listed in this document then analog validation may be used for further verification.

For analog validation, measure the local ambient temperature by placing thermocouples on both sides of the PCB, 5 mm (0.2 in.) from the board surface. Avoid placing thermocouples next to hot components such as the CPU/FPGA or near board edges, which can cause inaccurate temperature measurements. In addition to the local ambient temperature, the case temperature of the components should not exceed the recommended maximum case temperature.

Note Some systems may require a heat sink or air flow to remain within the maximum allowed temperature ranges. You can mount the Thermal Kit for NI sbRIO-9607/9627/9637 (153901-02) heat spreader on the NI sbRIO device.

Note The NI sbRIO device thermal performance is greatly influenced by several factors, including resource utilization, mounting, and adjacent power dissipation. These factors can substantially affect the achievable external ambient temperature at which the maximum local and reported temperatures are reached. NI recommends additional thermal design to remain within the maximum allowed temperature ranges. For information about and examples of environmental and design factors that can affect the thermal performance of NI sbRIO systems, visit ni.com/info and enter the Info Code sbriocooling. For device-specific guidelines about enabling proper thermal design, refer to the NI sbRIO-9637 User Manual on ni.com/manuals.

Storage temperature (IEC 60068-2-1, IEC 60068-2-2)	-40 °C to 85 °C
Operating humidity (IEC 60068-2-78)	10% RH to 90% RH, noncondensing
Storage humidity (IEC 60068-2-78)	5% RH to 95% RH, noncondensing
Maximum altitude	5,000 m
Pollution Degree (IEC 60664)	2

The NI sbRIO device is intended for indoor use only.

Physical Characteristics

Weight

128.7 g (4.540 oz)

Safety Voltages

Connect only voltages that are below these limits.

V terminal to C terminal

30 VDC maximum, Measurement Category I

Environmental Management

NI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.

For additional environmental information, refer to the Engineering a Healthy Planet web page at ni.com/environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.

EU and UK Customers

Waste Electrical and Electronic Equipment (WEEE)—At the end of the product life cycle, all NI products must be disposed of according to local laws and regulations. For more information about how to recycle NI products in your region, visit ni.com/environment/weee.

Battery Replacement and Disposal

Battery Directive—This product contains a long-life coin cell battery. If you need to replace it, use the Return Material Authorization (RMA) process or contact an authorized NI service representative. For more information about compliance with the EU Battery Directive 2006/66/EC about Batteries and Accumulators and Waste Batteries and Accumulators, visit ni.com/environment/batterydirective.

电子信息产品污染控制管理办法（中国RoHS）

中国RoHS— NI符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。关于NI中国RoHS合规性信息，请登录 ni.com/environment/rohs_china。(For information about China RoHS compliance, go to ni.com/environment/rohs_china.)

¹ Formatted nonvolatile memory may be slightly less than this value.

² You can increase the flash reboot endurance value by performing field maintenance on the device. If you expect that your application may exceed the maximum cycle count listed in this document, contact NI support for information about how to increase the reboot endurance value.

³ For revision D and earlier, 1000Base-T Ethernet link and communication is not guaranteed for the Ethernet port below -20 °C. If you expect ambient temperatures below -20 °C, NI recommends using a 10/100 network infrastructure or assigning 10/100Mbps communication speeds to the Ethernet Adapter in NI Measurement & Automation Explorer (MAX).

⁴ Both standard SD and microSD interfaces are supported.

⁵ This is the maximum update rate when running one AO channel in a loop with the FPGA top-level clock set to 40 MHz.

⁶ When the analog output initializes, a voltage glitch occurs for about 20 μs, peaking at 1.3 V, typical.

⁷ Range is 5 V.

⁸ Battery life may drop dramatically in extreme temperatures.

⁹ If you expect ambient temperatures below -20 °C, NI recommends using a 10/100 network infrastructure or assigning 10/100Mbps communication speeds to the Ethernet Adapter in NI MAX. Refer to the Network/Ethernet Port section of this document for more information.

¹⁰ Use digital approach to ensure the on-chip temperature reading is below 98°C.