TestStand 2017 Semiconductor Module Bug Fixes


This document contains the TestStand Semiconductor Module Bug Fixes that were discovered before and since the release of NI TestStand 2017 Semiconductor Module. Not every bug fix known to NI will appear on this list; it is intended to only show the severe and more common issues that have been addressed.


Contacting NI

Feel free to contact NI regarding this document or issues in the document. If you are contacting NI in regards to a specific issue, be sure to reference the ID number given in the document to the NI representative. The ID number contains the current issue ID number as well as the legacy ID number (use the current ID number when contacting National Instruments). You can contact us through any of the normal support channels including phone, email, or the discussion forums. Visit the NI Website to contact us. 

Bug Fixes

The following items are Bug Fixes in NI TestStand 2017 Semiconductor Module.

ID Fixed Issue Issue Details
528021 TSM result processors do not appear in the Result Processing dialog box If the Result Processing dialog box has been opened at least once before TSM is installed, the installer is unable to update the items in the Result Processing dialog box. This results in the TSM result processors not showing in the dialog.
645338 Intermittent error when closing sequence editor An infrequent fatal error message occurs when you close the TestStand Sequence Editor when the Test Program Editor is displayed. This has no effect on files that were loaded at the time.
647125 TSM bins the part correctly but reports incorrect measurement data when a step errors out If a Semiconductor Multi Test step produces an error on a run other than the first in a lot, TSM logs the measurements of the step from the previous batch. TSM bins the DUT correctly, and the step returns an error.
648900 Run-time error occurs in test programs not using PAT if PAT algorithm settings include bin numbers that are not in the bin definitions file A run-time error can occur if you include bin numbers in a PAT algorithm settings and do not include those bin numbers in the bin definitions file, even if the test program does not use a PAT algorithm. This only occurs if the setting has the DisplaySoftwareBinComboBox attribute set to True.
651595 Memory usage can increase when using reentrant VIs and testing a high number of sites Testing with many sites that call reentrant VIs can cause increased memory use because TestStand creates a clone of a reentrant VI in each thread where the VI executes. Duplicate clones can be created because the thread used depends on the order at which the sites arrive at the step. The order can vary when you test with many sites.
669922 Run-time errors occur when looping on TSM steps Intermittent errors can occur if you use TSM steps in a loop or enable looping settings in certain multisite situations.
700536 Importing a large number of test limits takes a long time to complete It takes a long time to import limits files that contain on the order of tens of thousands of limits. The user interface is unresponsive during loading but returns to normal after the load action completes.

Glossary of Terms


  • Bug ID - When an issue is reported to NI, you may be given this ID or find it on ni.com.  You may also find IDs posted by NI on the discussion forums or in KnowledgeBase articles.
  • Legacy ID – An older issue ID that refers to the same issue.  You may instead find this issue ID in older known issues documents.
  • Description - A few sentences which describe the problem. The brief description given does not necessarily describe the problem in full detail.
  • Workaround - Possible ways to work around the problem.
  • Reported Version - The earliest version in which the issue was reported.
  • Resolved Version - Version in which the issue was resolved or was no longer applicable. "N/A" indicates that the issue has not been resolved.
  • Date Added - The date the issue was added to the document (not the reported date).