PCB Assembly Test Toolkit for LabVIEW New Features and Changes

Learn about updates, including new features and behavior changes, introduced in each version of PCB Assembly Test Toolkit for LabVIEW.

Discover what is new in the latest releases of PCB Assembly Test Toolkit for LabVIEW.
Note If you cannot find new features and changes for your version, it might not include user-facing updates. However, your version might include non-visible changes such as bug fixes and compatibility updates.

PCB Assembly Test Toolkit 2025 Q2 for LabVIEW Changes

Learn about new features, behavior changes, and other updates in PCB Assembly Test Toolkit 2025 Q2 for LabVIEW.

New Features

This version of the PCB Assembly Test Toolkit for LabVIEW provides support for the following features:

  • Updated DAQ functions to support PCIe, PXIe, and USB devices, emphasizing support for NI 63xx (X Series) devices. Updated icons colors and library names (existing libraries now have a DAQ_ prefix) to distinguish new hardware and mixed signal support.
  • Added new individual simple DMM functions to measure AC/DC voltage and current, frequency and period, and 2-wire or 4-wire resistance. A new DMM mixed measurement library integrates all measurements while using the same Initialize, Configure and Measure, and Close function pattern used in other PCB Assembly Test Toolkit libraries.
  • Added new simple switch function to support NI multiplexers and all topologies using a path method to connect and disconnect internal relays (for example, ch1, com0).
  • Added new simple functions to support DMM Scan using three different hardware methods. Supported hardware methods correspond to the following NI bundles: PXI DMM Switches, PXI DMM with Switch Relay Driver and External Relays, and PXI DAQ DO with Custom External Relays).
  • Added a new list of examples for DAQ, DMM, DMM Scan methods in LabVIEW.
  • Updated TestStand automation sequences using PC-based devices, such as NI 63xx (X Series) devices.