PXIe-6545 Specifications

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Updated2025-04-24
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PXIe-6545 Specifications

This document provides the specifications for the PXIe-6545.

Note All values were obtained using a 1 m cable (SHC68-C68-D4 recommended). Performance specifications are not guaranteed when using longer cables.

Definitions and Conditions

Specifications are valid for the range 0 °C to 55 °C unless otherwise noted.

Maximum and minimum specifications are warranted not to exceed these values within certain operating conditions and include the effects of temperature and uncertainty unless otherwise noted.

Typical specifications are unwarranted values that are representative of a majority (3σ) of units within certain operating conditions and include the effects of temperature and uncertainty unless otherwise noted.

Characteristic specifications are unwarranted values that are representative of an average unit operating at room temperature.

Nominal specifications are unwarranted values that are relevant to the use of the product and convey the expected performance of the product.

All specifications are Typical unless otherwise noted.

PXIe-6545 Pinout

The PXIe-6545 front panel exposes the following connections:

Three SMA connectors named CLK IN, PFI 0, and CLK OUT
One 68-pin VHDCI connector named DIGITAL DATA & CONTROL, or DDC

Figure 1. PXIe-6545 Front Panel with VHDCI Connector Pinout

Table 1. PXIe-6545 DDC Connector Pins
Pins	Signal Name	Signal Type	Signal Description
33	DDC_CLK OUT	Control	Output terminal for the exported Sample Clock.
67	Strobe	Control	Terminal for the external Sample clock source, which can be used for dynamic acquisition.
1, 3, 5, 7, 9, 11, 13, 15, 17, 19, 21, 23, 25, 27, 29, 31, 35, 37, 39, 41, 43, 45, 47, 49, 51, 53, 55, 57, 59, 61, 63, 65	DIO <0..31>	Data	Bidirectional digital I/O data channels 0 through 31.
26, 30, 64	Programmable Function Interface (PFI) <1..3>	Control	Input terminals to the device for external triggers, or output terminals from the device for events.
2, 4, 6, 10, 12, 14, 16, 18, 20, 22, 24, 28, 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 54, 56, 58, 62, 66	GND	Ground	Ground reference for signals.
8, 52, 60	RESERVED	N/A	Terminals reserved for future use. Do not connect to these pins.

Table 2. PXIe-6545 SMA Connectors
Connector	Signal Name	Signal Type	Description
CLK IN	Reference Clock Input	Control	Terminal for the external Reference clock used for the PLL or for the external Sample clock used for dynamic generation and/or acquisition.
PFI 0	PFI 0	Control	Single-ended input terminals to the device for static I/O, for external triggers, or for output terminals from the device for events. Refer to the device specifications for signal voltage levels.
CLK OUT	Reference Clock Output	Control	Terminal for the exported PLL Reference clock or the exported Sample clock.

Channels

Data

Number of channels

32, single data rate (SDR)^[1]¹ Using SDR, data is clocked using the rising or falling edge of the Sample clock.

Direction control

Per channel

Per operation

Time to tristate (t_PZ), 2 kΩ and 15 pF load

6.2 ns, nominal

Programmable Function Interface (PFI)
Number of channels	4
Direction control	Per channel

Clock terminals
Input	2
Output	2

Generation Channels

Channels

Data

DDC CLK OUT

PFI <0..3>

Generation signal type

Single-ended

DC generation voltage accuracy^[2]² Into 1 MΩ; does not include system crosstalk.

±35 mV, typical

±200 mV, maximum

Table 3. Generation Voltage Levels
Logic Family^[3]³ For all data, PFI, and clock channels. Does not include system crosstalk.	Voltage Low Level (V_OL)		Voltage High Level (V_OH)		Accuracy for Nominal Values into 1 MΩ Load
	Nominal	Max	Min	Nominal	Accuracy for Nominal Values into 1 MΩ Load
1.2 V (V_OH = 1.2 V)	0.0 V	0.2 V	1 V	1.2 V	±35 mV, typical
1.5 V (V_OH = 1.5 V)			1.3 V	1.5 V
1.8 V (V_OH = 1.8 V)			1.6 V	1.8 V
2.5 V (V_OH = 2.5 V)			2.3 V	2.5 V
3.3 V (V_OH = 3.3 V)			3.1 V	3.3 V

Note Generation and acquisition sessions share a common voltage resource. Simultaneous operations must be set to the same logic family.

Output impedance

50 Ω, nominal

Maximum allowed DC drive strength per channel, by logic family
1.2 V	±12 mA, nominal
1.5 V	±15 mA, nominal
1.8 V	±18 mA, nominal
2.5 V	±25 mA, nominal
3.3 V	±33 mA, nominal

Data channel driver enable/disable control

Software-selectable: per channel

Channel power-on state

Drivers disabled, 50 kΩ nominal input impedance

Output protection
Range	0 V to 5 V
Duration	Indefinite

Acquisition Channels

Channels

Data

STROBE

PFI <0..3>

Acquisition signal type

Single-ended

Accuracy^[4]⁴ Does not include system crosstalk.

±150 mV, typical

±30%, maximum


Logic Family^[5]⁵ For all data, PFI, and clock channels. Does not include system crosstalk.	Voltage Thresholds Low (V_IL)		Voltage Thresholds High (V_IH)
	Minimum	Typical	Typical	Maximum
1.2 V (V_IH, V_IL = 0.60 V)	420 mV	450 mV	750 mV	780 mV
1.5 V (V_IH, V_IL = 0.75 V)	525 mV	600 mV	900 mV	975 mV
1.8 V (V_IH, V_IL = 0.90 V)	630 mV	750 mV	1.05 V	1.17 V
2.5 V (V_IH, V_IL = 1.25 V)	875 mV	1.10 V	1.40 V	1.625 V
3.3 V (V_IH, V_IL = 1.65 V)	1.155 V	1.50 V	1.80 V	2.145 V

Note Generation and acquisition sessions share a common voltage resource. Simultaneous operations must be set to the same logic family.

Input impedance	High-impedance (50 kΩ), nominal
Input protection^[6]⁶ Internal diode clamps may begin conduction outside the -0.5 V to 3.5 V range.	-1 V to 5 V

Timing

Sample Clock

Sources

1. On Board clock (internal 800 MHz VCO with 32-bit DDS)

2. CLK IN (SMA jack connector)

3. STROBE (Digital Data & Control [DDC] connector; acquisition only)

Frequency range
On Board clock	100 Hz to 200 MHz
CLK IN	20 kHz to 200 MHz
STROBE	100 Hz to 200 MHz

On Board clock characteristics

Resolution^[7]⁷ Varies with Sample clock frequency. You can query NI-HSDIO for the programmed frequency value.

0.2 Hz, maximum

Accuracy^[8]⁸ Accuracy may be increased by using a higher-performance external Reference clock.

±150 ppm + 5 ppm per year

On Board clock characteristics valid only when PLL reference source is set to None
Frequency accuracy	±150 ppm (including temperature effects), typical
Aging	±5 ppm first year, nominal

Sample clock relative delay adjustment^[9]⁹ You can apply a delay or phase adjustment to the On Board clock to align multiple devices.

Range
Acquisition sessions	0.0 to 1.0 Sample clock periods
Generation sessions	0.0 ns to 5.0 ns

Resolution

0.5 ps

Exported Sample clock destinations

DDC CLK OUT (DDC connector)

CLK OUT (SMA jack connector)

Exported Sample clock delay

Range

0.0 to 1.0 Sample clock periods

Resolution (δ_C)^[10]¹⁰ Resolution is nonlinearly dependent on clock frequency. You can query clock frequency using NI-HSDIO.

117 ps to 143 ps, nominal

Frequency
On Board clock	All supported frequencies
External clock	Frequencies ≥20 MHz

Exported Sample clock jitter, using On Board clock
Period	24 ps_rms, characteristic
Cycle-to-cycle	43 ps_rms, characteristic

Figure 2. Characteristic Period Jitter (RMS) vs. Frequency

Generation Timing

Channels

Data

DDC CLK OUT

PFI <0..3>

Data channel-to-channel skew^[11]¹¹ Maximum skew across all data channels, PFI channels, and voltage levels when using the same data position or data delay bank.

±300 ps, maximum

Maximum data rate per channel
SDR	100 Mbps

Note Includes maximum data channel-to-channel skew and typical crosstalk.

The following figure shows an eye diagram of a 400 Mbps pseudorandom bit sequence (PRBS) waveform in DDR mode at 3.3 V. This waveform was captured on DIO 0 at room temperature into high impedance.

Figure 3. Characteristic Eye Diagram (High Impedance)

The following figure shows an eye diagram of a 400 Mbps PRBS waveform in DDR mode at 3.3 V. This waveform was captured on DIO 0 at room temperature into 50 Ω termination.

Figure 4. Characteristic Eye Diagram (50 Ω Termination, characteristic)

Data position modes

Sample clock rising edge

Sample clock falling edge

Delay from Sample clock rising edge

Data delay banks

1 bank for all channels and PFI lines

Generation data delay

Range (δ_G)

0.0 to 1.0 Sample clock periods

Resolution (δ_G)^[12]¹² Resolution is nonlinearly dependent on clock frequency. You can query resolution using NI-HSDIO.

117 ps to 143 ps, nominal

Frequency
On Board clock	All supported frequencies
External clock	Frequencies ≥20 MHz

Figure 5. Characteristic Data Delay Accuracy

Exported Sample clock offset (t_CO)	0.0 ns or 1.65 ns (default),^[13]¹³ Software-selectable for DDC CLK OUT. nominal
Time delay from On Board Sample clock to DDC connector (t_SCDDC)	8.1 ns, characteristic; exported Sample clock offset = 0 ns

Generation Provided Setup and Hold Times

Compare the setup and hold times from the datasheet of your device under test (DUT) to the values in the table. The provided setup and hold times must be greater than the setup and hold times required for the DUT. If you require more setup time, configure your exported Sample clock mode to Inverted and/or delay your clock or data relative to the Sample clock. This table includes worst-case effects of channel-to-channel skew and intersymbol interference.


Exported Sample Clock Offset (t_PCO)	Minimum Provided Setup Time (t_PSU)	Minimum Provided Hold Time (t_PH)
1.65 ns	t_p - 2.15 ns	1.15 ns
0.0 ns	t_p - 500 ps	-500 ps

Note This table assumes the data position is set to Sample clock rising edge and the noninverted Sample Clock is exported to the DDC connector.

Figure 6. Generation Provided Setup and Hold Times Timing Diagram

Note Provided setup and hold times account for maximum channel-to-channel skew and jitter.

Acquisition Timing

Channels

Data

STROBE

PFI <0..3>

Channel-to-channel skew^[14]¹⁴ Across all data channels, PFI channels, and voltage levels.

±350 ps, maximum

Maximum data rate per channel^[15]¹⁵ Includes maximum data channel-to-channel skew and typical crosstalk.
SDR	100 Mbps

Data position modes

Sample clock rising edge

Sample clock falling edge

Delay from Sample clock rising edge

Table 4. Setup and Hold Times to STROBE, Characteristic^[16]¹⁶ Includes maximum data channel-to-channel skew and uncertainty, but does not include system crosstalk. Performance may vary with system crosstalk performance.
Voltage Threshold	Setup Time (t_sus)		Hold Time (t_hs)
Voltage Threshold	ƒ <20 MHz	ƒ ≥20 MHz	ƒ <20 MHz	ƒ ≥20 MHz
1.25 V to 1.65 V	2.8 ns	1.15 ns	2.4 ns	900 ps
0.90 V to 1.20 V		1.20 ns		1.00 ns
0.75 V to 0.85 V		1.40 ns		1.10 ns
0.60 V to 0.70 V		1.75 ns		1.25 ns

Setup and hold times to Sample clock^[17]¹⁷ Does not include channel-to-channel skew, t_DDCSC, or t_SCDDC
Setup time (t_susc)	900 ps, nominal
Hold time (t_HSC)	425 ps, nominal

Data delay banks

1 bank for all channels and PFI lines

Time delay from DDC connector to internal Sample clock

6.8 ns, nominal

Acquisition data delay

Frequency
On Board clock	All supported frequencies
External clock and STROBE	Frequencies ≥20 MHz

Range

0.0 to 1.0 Sample clock periods

Resolution^[18]¹⁸ Resolution is nonlinearly dependent on clock frequency. You can query resolution using NI-HSDIO.

117 ps to 143 ps, nominal

Figure 8. Acquisition Timing Diagram Using STROBE as the Sample Clock

Figure 9. Acquisition Timing Diagram with Sample Clock Sources Other than STROBE

CLK IN

Connector	SMA jack
Direction	Input
Destinations	1. Reference clock (PLL) 2. Sample clock
Input coupling	AC
Input protection	±10 VDC, nominal
Input impedance	Software-selectable: 50 Ω (default) or 1 kΩ, nominal
Minimum detectable pulse width	2 ns, nominal
Clock requirements	Free-running (continuous) clock

Waveform Voltage Ranges

Square wave voltage range

0.65 V_pk-pk to 5.0 V_pk-pk

Table 5. Sine Wave Voltage Ranges
Voltage Range (V_pk-pk)	Frequency Range
0.65 to 5.0	20 MHz to 200 MHz
1.0 to 5.0	13 MHz to 200 MHz
1.3 to 5.0	10 MHz to 200 MHz
2.6 to 5.0	5 MHz to 200 MHz

CLK IN Implementations

As Sample clock^[19]¹⁹ Nominal 3 dB cutoff point at 100 MHz when using 1 kΩ input impedance.

Frequency range

20 kHz to 200 MHz

Duty cycle range
ƒ <20 MHz	25% to 75%
ƒ ≥20 MHz	40% to 60%

As Reference clock
Frequency range	5 MHz to 100 MHz (integer multiples of 1 MHz)
Frequency accuracy^[20]²⁰ Required accuracy of the external Reference clock source.	±0.1%
Duty cycle range	25% to 75%

STROBE

Connector

DDC

Direction

Input

Destination

Sample clock (acquisition only)

Frequency range

100 Hz to 200 MHz

Duty cycle range (at the programmed threshold)
ƒ <20 MHz	25% to 75%
ƒ ≥20 MHz	40% to 60% (corrected to 50%)

Minimum detectable pulse width^[21]²¹ Required at acquisition voltage thresholds.

2 ns, nominal

Clock requirements

Free-running (continuous) clock

Input impedance

50 kΩ, nominal

CLK OUT

Connector	SMA jack
Direction	Output
Sources	1. Sample clock (excluding STROBE) 2. Reference clock (PLL)
Output impedance	50 Ω, nominal
Logic type	Matched with generation and acquisition sessions

DDC CLK OUT

Connector	DDC
Direction	Output
Source	Sample clock (generation only)

Note STROBE and acquisition Sample clock cannot be routed to DDC CLK OUT.

Reference Clock (PLL)

Sources^[22]²² Provides the frequency for the PLL.	1. PXI_CLK100 (PXI Express backplane) 2. CLK IN (SMA jack connector) 3. None (internal oscillator locked to an internal reference)
Destination	CLK OUT (SMA jack connector)
Lock time	150 ms, maximum (not including software latency)
Frequency range	5 MHz to 100 MHz (integer multiples of 1 MHz), 0.1% required accuracy
Duty cycle range	25% to 75%

Waveform

Memory and Scripting

Memory architecture

This device uses the Synchronization and Memory Core (SMC) technology in which waveforms and instructions share onboard memory. Parameters such as number of script instructions, maximum number of waveforms in memory, and number of samples (S) available for waveform storage are flexible and user defined.

Onboard memory size^[23]²³ Maximum limit for generation sessions assumes no scripting instructions.

1 Mbit per channel
Acquisition	1 Mbit per channel (4 MBytes total)
Generation	1 Mbit per channel (4 MBytes total)

8 Mbit per channel
Acquisition	8 Mbit per channel (32 MBytes total)
Generation	8 Mbit per channel (32 MBytes total)

64 Mbit per channel
Acquisition	64 Mbit per channel (256 MBytes total)
Generation	64 Mbit per channel (256 MBytes total)

Generation

Single-waveform mode

Generates a single waveform once, n times, or continuously

Scripted mode^[24]²⁴ Use scripts to describe the waveforms to be generated, the order in which the waveforms are generated, how many times the waveforms are generated, and how the device responds to Script Triggers.

Generates a simple or complex sequence of waveforms.

Finite repeat count

1 to 16,777,216

Waveform quantum^[25]²⁵ DDR mode sets data width to 2.
Data width = 4	1 sample
Data width = 2	2 samples

Waveform block size (in physical memory)
Data width = 4	32 samples
Data width = 2	64 samples

Table 6. Generation Minimum Waveform Size^[26]²⁶ Sample rate dependent. Increasing sample rate increases minimum waveform size requirement.
Configuration	Sample Rate
Configuration	200 MHz	100 MHz
Single waveform	1 S	1 S
Continuous waveform	128 S	64 S
Stepped sequence	128 S	64 S
Burst sequence	1056 S	512 S

Acquisition
Minimum waveform size^[27]²⁷ Regardless of waveform size, NI-HSDIO allocates at least 640 bytes for a record.	1 S
Record quantum	1 S
Total number of records^[28]²⁸ The session should fetch quickly enough that unfetched data is not overwritten.	2,147,483,647
Total pre-Reference trigger samples	0 up to full record
Total post-Reference trigger samples	0 up to full record

Triggers


Types	Sessions	Edge Detection	Level Detection
1. Start	Acquisition and generation	Rising or falling	—
2. Pause	Acquisition and generation	—	High or low
3. Script <0..3>	Acquisition	Rising or falling	High or low
4. Reference	Acquisition	Rising or falling	—
5. Advance	Acquisition	Rising or falling	—
6. Stop	Generation	Rising or falling	—

Sources

1. PFI 0 (SMA jack connector)

2. PFI <1..3> (DDC connector)

3. PXI_TRIG <0..7> (PXI Express backplane)

4. Pattern match (acquisition sessions only)

5. Software (user function call)

6. Disabled (do not wait for a trigger)

Destinations, excluding Pause trigger^[29]²⁹ Each trigger can be routed to any destination except the Pause trigger. The Pause trigger cannot be exported.

1. PFI 0 (SMA jack connector)

2. PFI <1..3> (DDC connector)

3. PXI_TRIG <0..6> (PXI Express backplane)

Minimum required trigger pulse width

15 ns

Trigger rearm time
Start to Reference trigger	150 S, maximum
Start to Advance trigger	220 S, maximum
Advance to Advance trigger	220 S, maximum
Reference to Reference trigger	220 S, maximum

Delay from Pause trigger to Pause state and Stop trigger to Done state^[30]³⁰ Use the Data Active event during generation to determine on a sample-by-sample basis when the device enters the Pause or Done states.
Generation sessions	50 Sample clock periods + 300 ns, maximum
Acquisition sessions	Synchronous with the data

Delay from Start trigger and Script trigger to digital data output

3 Sample clock periods + 600 ns, maximum

Events


Types	Sessions
1. Marker <0..2>	Generation
2. Data Active	Generation
3. Ready for Start	Acquisition and generation
4. Ready for Advance	Acquisition
5. End of Record	Acquisition

Destinations (excluding Data Active event)^[31]³¹ The Data Active event can only be routed to the PFI channels.

1. PFI 0 (SMA jack connectors)

2. PFI <1..3> (DDC connector)

3. PXI_TRIG <0..6> (PXI Express backplane)

Marker time resolution (placement)
SDR	Can be placed at any sample
DDR	Must be placed at an integer multiple of two samples

Software

Driver Software

Driver support for this device was first available in NI-HSDIO 1.6.

NI-HSDIO is an IVI-compliant driver that allows you to configure, control, and calibrate the PXIe-6545. NI-HSDIO provides application programming interfaces for many development environments.

Application Software

NI-HSDIO provides programming interfaces, documentation, and examples for the following application development environments:

LabVIEW
LabWindows™/CVI™
Measurement Studio
Microsoft Visual C/C++
.NET (C# and VB.NET)

NI Measurement Automation Explorer

NI Measurement Automation Explorer (MAX) provides interactive configuration and test tools for the PXIe-6545. MAX is included on the NI-HSDIO media.

Power

Note Characteristic results are commensurate with an average user application using all data channels into high impedance load. Maximum results include worst-case data pattern.


VDC	Current, Characteristic	Current, Maximum
+3.3 V	1.75 A	1.77 A
+12 V	2.2 A	2.3 A

Total power

32.2 W, characteristic

33.5 W, maximum

Warm-up time

15 minutes

Physical

Dimensions

Single 3U, CompactPCI Express slot, PXI Express compatible

21.6 cm × 2.0 cm × 13.0 cm

Weight

519 g (18.3 oz)

I/O Panel Connectors


Label	Connector Type	Description
CLK IN	SMA jack	External Sample clock, external Reference clock
PFI 0		Events, triggers
CLK OUT		External Sample clock, exported Reference clock
DIGITAL DATA & CONTROL	68-pin VHDCI	Digital data channels, exported Sample clock, STROBE, events, triggers

Environment

Note To ensure that the PXIe-6545 cools effectively, follow the guidelines in the Maintain Forced Air Cooling Note to Users included with the PXIe-6545 or available at ni.com/manuals. The PXIe-6545 is intended for indoor use only.

Operating temperature	0 °C to 55 °C in all NI PXI Express chassis and hybrid NI PXI Express chassis
Operating relative humidity	10 to 90% relative humidity, noncondensing (meets IEC 60068-2-56)
Storage temperature	-20 °C to 70 °C
Storage relative humidity	5 to 95% relative humidity, noncondensing (meets IEC 60068-2-56)
Operating shock	30 g, half-sine, 11 ms pulse (meets IEC 60068-2-27; test profile developed in accordance with MIL-PRF-28800F)
Operating vibration	5 Hz to 500 Hz, 0.31 g_rms (meets IEC 60068-2-64)
Storage shock	50 g, half-sine, 11 ms pulse (meets IEC 60068-2-27; test profile developed in accordance with MIL-PRF-28800F)
Storage vibration	5 Hz to 500 Hz, 2.46 g_rms (meets IEC 60068-2-64; test profile exceeds requirements of MIL-PRF-28800F, Class B)
Altitude	0 to 2,000 m above sea level (at 25 °C ambient temperature)
Pollution degree	2

Compliance and Certifications

Safety Compliance Standards

This product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:

IEC 61010-1, EN 61010-1
UL 61010-1, CSA C22.2 No. 61010-1

Note For safety certifications, refer to the product label or the Product Certifications and Declarations section.

Electromagnetic Compatibility

This product meets the requirements of the following EMC standards for electrical equipment for measurement, control, and laboratory use:

EN 61326-1 (IEC 61326-1): Class A emissions; Basic immunity
EN 55011 (CISPR 11): Group 1, Class A emissions
EN 55022 (CISPR 22): Class A emissions
EN 55024 (CISPR 24): Immunity
AS/NZS CISPR 11: Group 1, Class A emissions
AS/NZS CISPR 22: Class A emissions
FCC 47 CFR Part 15B: Class A emissions
ICES-001: Class A emissions

Note In the United States (per FCC 47 CFR), Class A equipment is intended for use in commercial, light-industrial, and heavy-industrial locations. In Europe, Canada, Australia, and New Zealand (per CISPR 11), Class A equipment is intended for use only in heavy-industrial locations.

Note Group 1 equipment (per CISPR 11) is any industrial, scientific, or medical equipment that does not intentionally generate radio frequency energy for the treatment of material or inspection/analysis purposes.

Note For EMC declarations, certifications, and additional information, refer to Product Certifications and Declarations.

Notice Refer to the Read Me First: Safety and Electromagnetic Compatibility document for important safety and electromagnetic compatibility information. To obtain a copy of this document online, visit ni.com/manuals and search for the document title.

Notice To ensure the specified EMC performance, operate this product only with shielded cables and accessories. Do not use unshielded cables or accessories unless they are installed in a shielded enclosure with properly designed and shielded input/output ports and connected to the product using a shielded cable. If unshielded cables or accessories are not properly installed and shielded, the EMC specifications for the product are no longer guaranteed.

Note SHC68-C68-D4 shielded cable and the provided snap-on ferrite beads, National Instruments part number 711627-01, must be used when operating the PXIe-6545.

Notice To ensure the specified EMC performance, the length of all I/O cables must be no longer than 3 m (10 ft).

Notice To ensure the specified EMC performance, you must install PXI EMC Filler Panels, National Instruments part number 778700-01, in all open chassis slots.

CE Compliance

This product meets the essential requirements of applicable European Directives, as follows:

2014/35/EU; Low-Voltage Directive (safety)
2014/30/EU; Electromagnetic Compatibility Directive (EMC)
2011/65/EU; Restriction of Hazardous Substances (RoHS)
2014/53/EU; Radio Equipment Directive (RED)
2014/34/EU; Potentially Explosive Atmospheres (ATEX)

Product Certifications and Declarations

Refer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for NI products, visit ni.com/product-certifications, search by model number, and click the appropriate link.

Environmental Management

NI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.

For additional environmental information, refer to the Engineering a Healthy Planet web page at ni.com/environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.

EU and UK Customers

Waste Electrical and Electronic Equipment (WEEE)—At the end of the product life cycle, all NI products must be disposed of according to local laws and regulations. For more information about how to recycle NI products in your region, visit ni.com/environment/weee.

电子信息产品污染控制管理办法（中国RoHS）

中国RoHS— NI符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。关于NI中国RoHS合规性信息，请登录 ni.com/environment/rohs_china。(For information about China RoHS compliance, go to ni.com/environment/rohs_china.)

¹ Using SDR, data is clocked using the rising or falling edge of the Sample clock.

² Into 1 MΩ; does not include system crosstalk.

³ For all data, PFI, and clock channels. Does not include system crosstalk.

⁴ Does not include system crosstalk.

⁵ For all data, PFI, and clock channels. Does not include system crosstalk.

⁶ Internal diode clamps may begin conduction outside the -0.5 V to 3.5 V range.

⁷ Varies with Sample clock frequency. You can query NI-HSDIO for the programmed frequency value.

⁸ Accuracy may be increased by using a higher-performance external Reference clock.

⁹ You can apply a delay or phase adjustment to the On Board clock to align multiple devices.

¹⁰ Resolution is nonlinearly dependent on clock frequency. You can query clock frequency using NI-HSDIO.

¹¹ Maximum skew across all data channels, PFI channels, and voltage levels when using the same data position or data delay bank.

¹² Resolution is nonlinearly dependent on clock frequency. You can query resolution using NI-HSDIO.

¹³ Software-selectable for DDC CLK OUT.

¹⁴ Across all data channels, PFI channels, and voltage levels.

¹⁵ Includes maximum data channel-to-channel skew and typical crosstalk.

¹⁶ Includes maximum data channel-to-channel skew and uncertainty, but does not include system crosstalk. Performance may vary with system crosstalk performance.

¹⁷ Does not include channel-to-channel skew, t_DDCSC, or t_SCDDC

¹⁸ Resolution is nonlinearly dependent on clock frequency. You can query resolution using NI-HSDIO.

¹⁹ Nominal 3 dB cutoff point at 100 MHz when using 1 kΩ input impedance.

²⁰ Required accuracy of the external Reference clock source.

²¹ Required at acquisition voltage thresholds.

²² Provides the frequency for the PLL.

²³ Maximum limit for generation sessions assumes no scripting instructions.

²⁴ Use scripts to describe the waveforms to be generated, the order in which the waveforms are generated, how many times the waveforms are generated, and how the device responds to Script Triggers.

²⁵ DDR mode sets data width to 2.

²⁶ Sample rate dependent. Increasing sample rate increases minimum waveform size requirement.

²⁷ Regardless of waveform size, NI-HSDIO allocates at least 640 bytes for a record.

²⁸ The session should fetch quickly enough that unfetched data is not overwritten.

²⁹ Each trigger can be routed to any destination except the Pause trigger. The Pause trigger cannot be exported.

³⁰ Use the Data Active event during generation to determine on a sample-by-sample basis when the device enters the Pause or Done states.

³¹ The Data Active event can only be routed to the PFI channels.