PCIe-GPIB Specifications

Definitions

Warranted specifications describe the performance of a model under stated operating conditions and are covered by the model warranty.

Characteristics describe values that are relevant to the use of the model under stated operating conditions but are not covered by the model warranty.

  • Typical specifications describe the performance met by a majority of models.
  • Nominal specifications describe an attribute that is based on design, conformance testing, or supplemental testing.

Specifications are Typical unless otherwise noted.

Performance

GPIB

3-wire

up to 1670 kbytes/s

HS488

up to 7980 kbytes/s

Power Requirements

Note A version of the PCIe-GPIB controller (part number 190243x-01, manufactured prior to 2008) differs from these specifications in power consumption, physical dimensions, and ambient temperature range. For specific details, refer to Notice of Board Change—PCIe-GPIB on ni.com.

PCIe-GPIB (+3.3 V)

320 mA, Typical; 500 mA, Maximum

PCIe-GPIB Pinout

Use the pinout to connect to terminals on the PCIe-GPIB.

Figure 1. PCIe-GPIB Connector Pinout


Table 1. Signal Descriptions
Signal Terminal Description
DIO1 1 Data Input/Output Bit.
DIO2 2 Data Input/Output Bit.
DIO3 3 Data Input/Output Bit.
DIO4 4 Data Input/Output Bit.
EOI 5 End-Or-Identify.
DAV 6 Data Valid.
NRFD 7 Not Ready For Data.
NDAC 8 Not Data Accepted.
IFC 9 Interface Clear.
SRQ 10 Service Request.
ATN 11 Attention.
SHIELD 12 Shield.
DIO5 13 Data Input/Output Bit.
DIO6 14 Data Input/Output Bit.
DIO7 15 Data Input/Output Bit.
DIO8 16 Data Input/Output Bit.
REN 17 Remote Enable.
GND 18 Ground—Wire twisted with DAV.
GND 19 Ground—Wire twisted with NRFD.
GND 20 Ground—Wire twisted with NDAC.
GND 21 Ground—Wire twisted with IFC.
GND 22 Ground—Wire twisted with SRQ.
GND 23 Ground—Wire twisted with ATN.
SIGNAL GROUND 24 Logic Ground.

Physical Characteristics

Dimensions

9.754 cm × 6.888 cm (3.840 in. × 2.712 in.)

Connector

GPIB

IEEE 488 24-pin connector

PCI Express

x1

Environment

Operating ambient temperature

0 °C to 55 °C (Tested in accordance with IEC 60068-2-1 and IEC 60068-2-2.)

Operating relative humidity

10% to 90%, noncondensing (Tested in accordance with IEC 60068-2-56.)

Storage ambient temperature

-20 °C to 70 °C (Tested in accordance with IEC 60068-2-1 and IEC 60068-2-2.)

Storage relative humidity

5% to 95%, noncondensing (Tested in accordance with IEC 60068-2-56.)