Ettus USRP X410 Specifications

These specifications apply to the Ettus USRP X410.

Revision History

Version Date changed Description
378493G-01 May 2025 Added maximum input power footnote.
378493F-01 February 2025 Added device pinout.
378493E-01 November 2024 Updated NVM footnote.
378493D-01 March 2024 Updated power supply, environmental, and physical specifications.
378493C-01 July 2023 Updated device weight and RX input power graph.
378493B-01 May 2022 Updated current and power specifications.
378493A-01 June 2021 Initial release.

Looking For Something Else?

For information not found in the specifications for your product, such as operating instructions, browse Related Information.

Definitions

Warranted specifications describe the performance of a model under stated operating conditions and are covered by the model warranty.

Characteristics describe values that are relevant to the use of the model under stated operating conditions but are not covered by the model warranty.

  • Typical specifications describe the performance met by a majority of models.
  • Nominal specifications describe an attribute that is based on design, conformance testing, or supplemental testing.

Specifications are Characteristics unless otherwise noted.

Conditions

Specifications are valid at 23 °C ± 5 °C unless otherwise noted.

Ettus USRP X410 Pinout

Figure 1. Front Panel


Table 1. Front Panel Connector Descriptions
Conector Description
TX/RX 0 Output and input terminal for the RF signal. TX/RX 0 is an SMA (f) connector with an impedance of 50 Ω and is a single-ended input or output channel.
RX 1 Input terminal for the RF signal. RX 1 is an SMA (f) connector with an impedance of 50 Ω and is a single-ended input channel.
GPIO 0, GPIO 1 General Purpose Input/Output (GPIO) digital terminals. GPIO 0 and GPIO 1 are HDMI Type-A connectors. Output voltage can be configured per individual connector, either 1.8 V (default), 2.5 V, or 3.3 V.

Individual connectors not within a larger grouping of connectors are named according to their label on the front panel. Individual connectors within a grouping of connectors are named according to the convention DB Label: Grouping Label: Connector Label. For example:

  • GPIO 0—The individual connector on the Ettus USRP X410 front panel labeled GPIO 0
  • DB 0: RF 0: TX/RX 0—The individual connector on the Ettus USRP X410 front panel labeled TX/RX 0 within the group of connectors on the device labeled RF 0 in the DB 0 area
  • Key Specifications

    Table 2. Key Specifications
    RF capabilities

    4 TX, 4 RX, independently tunable

    Superheterodyne architecture

    1 MHz to 7.2 GHz, tunable up to 8 GHz

    Up to 400 MHz bandwidth per channel

    Processing system (PS)

    Quad Core ARM Cortex-A53 (1200 MHz)

    4 GB DDR4

    Programmable logic (PL)

    FPGA: RFSoC ZU28DR

    2 × 4 GB DDR4

    Software

    UHD version 4.1 or later

    RFNoC

    GNU Radio

    C/C++

    Python

    OpenEmbedded Linux on A53

    NI-USRP 20.8 or later

    LabVIEW 2020 or later

    LabVIEW FPGA 2020 or later

    Synchronization

    REF IN (clock reference input)

    PPS IN (PPS time reference)

    TRIG IN/OUT

    GPSDO included

    OCXO included

    Digital interfaces

    2 QSFP28 (10/100 GbE, Aurora)[1]1 100 GbE is supported in the UHD Toolflow. Aurora streaming is supported in the LabVIEW FPGA Toolflow. Support for these capabilities is not available in UHD 4.1. It will be added in a subsequent release.

    2 iPass+ zHD (cabled PCIe Gen3 x8)[2]2 This feature is supported in the LabVIEW FPGA Toolflow.

    Ethernet (1 GbE to PS)

    2 USB-C (USB to PS, Console/JTAG)

    2 HDMI (GPIO)

    Power, form factor

    12 V DC, 16 A maximum

    Half-wide RU

    28.5 cm × 22.2 cm × 4.4 cm (11.2 in. × 8.7 in. × 1.7 in.)

    Controller

    Processing System

    Table 3. Processing System
    CPU Quad Core ARM Cortex-A53 (1200 MHz)
    Memory 4 GB DDR4, 2.4 GT/s
    NVM[3]3 Module assembly H and earlier has an NVM of 16 GB. All other module assemblies have an NVM of 32 GB. 32 GB eMMC (Pseudo SLC)
    RJ45 1 GbE host connection
    USB-C USB to PS (USB 2.0)

    USB Console/JTAG

    Programmable Logic

    Table 4. Programmable Logic
    FPGA Xilinx RFSoC XCZU28DR Speed Grade -1
    Memory 2 × 4 GB DDR4, 2.4 GT/s
    SD-FEC 8 dedicated SD-FEC cores
    QSFP28 2 × 4 lanes

    10/100 GbE, Aurora[4]4 100 GbE is supported in the UHD Toolflow. Aurora streaming is supported in the LabVIEW FPGA Toolflow. Support for these capabilities is not available in UHD 4.1. It will be added in a subsequent release.

    iPass+ zHD 2 × 4 lanes

    PCIe Gen3x8[5]5 This feature is supported in the LabVIEW FPGA Toolflow.

    GPIO

    2 HDMI

    12 I/O lines per connector

    Maximum data rate 100 Mbps

    Selectable I/O voltage (3.3 V, 2.5 V, or 1.8 V)

    Trigger SMA: Trigger In/Out (3.3 V I/O voltage)

    Baseband

    Table 5. Baseband
    Maximum I/Q sample rates[6]6 The applicable maximum value depends on the sample rate selected in software. 491.52 MSps

    500.00 MSps

    Number of available channels 4
    ADC resolution 12 bit
    DAC resolution 14 bit

    RF Transmitter

    Table 6. Transmitter
    Number of channels 4
    Frequency range 1 MHz to 7.2 GHz, tunable up to 8 GHz[7]7 Tuning the frequency to values >7.2 GHz may degrade output power, TX EVM, noise density, and noise figure specifications.
    Frequency step <1 Hz
    Maximum output power[8]8 Maximum output power varies by frequency. Refer to the subsequent TX Measurements section for additional information. <23 dBm
    TX/RX settling time 0.3 μs[9]9 This settling time applies to the TX/RX switch.
    TX gain settling time 1 μs
    Gain range[10]10 The output power resulting from the gain setting varies over the frequency band and among devices. 60 dB, nominal
    Gain step 1 dB, nominal
    Table 7. TX Phase Noise, 1 GHz Carrier Frequency, 23 °C, Nominal
    1 kHz offset -91 dBc/Hz
    10 kHz offset -101 dBc/Hz
    100 kHz offset -103 dBc/Hz
    Table 8. Bandwidth and Noise Density
    Maximum instantaneous real-time bandwidth 400 MHz
    Average noise density (23 °C, 10 MHz to 8 GHz)[11]11 Measured at the TX gain setting required to reach 0 dBm output power with 0 dBFS baseband signal. -146 dBm/Hz

    TX Measurements

    Figure 2. TX EVM Bathtub Curves: 5GNR, UL, FDD, SISO, 100 MHz BW, 30 kHz SCS, 256 QAM, 23 °C ± 5 °C


    Figure 3. TX Maximum Output Power: 0 dBFS CW, Maximum Gain Setting, 23 °C ± 5 °C


    Note The previous figure depicts the average TX maximum output power based on 4 units with 16 channels total measured at 18 °C, 23 °C, and 28 °C. The bars represent 80% confidence intervals at selected frequencies.

    RF Receiver

    Table 9. Receiver
    Number of channels 4
    Frequency range 1 MHz to 7.2 GHz, tunable up to 8 GHz
    Frequency step <1 Hz
    Table 10. Gain Range
    ≤500 MHz 38 dB, nominal
    >500 MHz 60 dB, nominal
    Note The gain range is the received signal amplitude resulting from the gain setting varies over the frequency band and among devices.
    Table 11. Gain Step
    Gain step 1 dB, nominal
    Table 12. Maximum Input Power, Damage Level
    ≤3 GHz +14 dBm continuous
    >3 GHz +17 dBm continuous, +20 dBm for up to 5 minutes
    Table 13. Maximum Operating Power
    Maximum operating power[12]12 Maximum operating power refers to the maximum input power at the RF input port that does not saturate the ADC. The ADC can become saturated when the input power is greater than the maximum operating power. You can input a CW tone at maximum operating power at any frequency. You can configure gain settings at all frequencies to allow input signals at the maximum operating power to avoid saturating the ADC. 0 dBm
    Notice It is sometimes necessary to use attenuation when connecting multiple Ettus USRP X410 devices or when creating a loopback connection to avoid damaging the hardware.
    Table 14. RX Gain Settling Time
    RX gain settling time 0.3 μs
    Table 15. Noise Figure
    500 MHz to 3.1 GHz 8 dB
    3.1 GHz to 6 GHz 6.5 dB
    6 GHz to 8 GHz 9 dB
    Table 16. Input and Bandwidth
    Input IP3, 0 dBm input, full scale +12 dBm
    Maximum instantaneous real-time bandwidth 400 MHz

    RX Measurements

    Figure 4. RX EVM Bathtub Curves: 5GNR, UL, FDD, SISO, 100 MHz BW, 30 kHz SCS, 256 QAM, 23 °C ± 5 °C


    Figure 5. RX Input Power to Reach 0 dBFS: CW Input, 30 dB Gain Setting, 23 °C ± 5 °C


    Note The previous figure depicts the average RX input power to reach 0 dBFS based on 4 units with 16 channels total measured at 18 °C, 23 °C, and 28 °C. The bars represent 80% confidence intervals at selected frequencies.

    GPS Disciplined Oscillator (GPSDO)

    Table 17. Frequency Accuracy
    OCXO (not locked to GPS)[13]13 Factory default accuracy. Contact NI if your application requires tuning the OCXO output frequency. 2.5 ppm
    OCXO (locked to GPS) 5 ppb
    Note Frequency accuracy is based on oven-controlled crystal oscillator (OCXO) vendor specifications and is not measured. Alternatively, you can incorporate an external reference source to provide a more precise frequency Reference Clock and to achieve better frequency accuracy.
    Table 18. Active Antenna
    Voltage 3.3 V
    Power 0.19 W
    Frequency band(s) L1, C/A 1.574 GHz

    Power

    Notice The protection provided by this product may be impaired if it is used in a manner not described in this document.
    Table 19. Power
    Voltage rating 12 V
    Frequency rating DC
    Current/power rating 7 A to 16 A (bitfile dependent)
    Power supply 190 W, minimum
    Caution The product must be powered with an AC adapter offered by NI that meets the power requirements for the product and has appropriate safety certification marks for country of use.

    Physical Characteristics

    Dimensions and Weight

    Table 20. Dimensions and Weight
    Dimensions, enclosure 26.7 cm × 22.2 cm × 4.4 cm (10.5 in. × 8.7 in. × 1.7 in.)
    Dimensions, enclosure and connectors 28.5 cm × 22.2 cm × 4.4 cm (11.2 in. × 8.7 in. × 1.7 in.)
    Weight 2.7 kg (6 lb)

    Ventilation Clearance and Cooling

    This product is designed to operate on a bench or in an instrument rack. Fan vents are located at the back of the product. Standard airflow provision of the product is set up as front to back cooling with option to change the airflow direction in the interest for directing back to front cooling using a fan cartridge accessory.

    Adequate clearance is required at the front and back of the product and surrounding equipment, inclusive of indiscriminate heat generating devices, and any potential air flow blockages must be maintained to ensure proper cooling.

    Table 21. Ventilation Clearance and Cooling
    Minimum cooling clearances 51 mm (2 in.) at the front and back
    Note Benchtop and rack mount applications may require additional cooling clearances for optimal airflow and to reduce any unexpected hot air recirculation in either direction of the air inlet fans.

    Environment

    Environmental Characteristics

    Table 22. Environmental Characteristics
    Operating temperature range 0 °C to 55 °C
    Storage temperature range -40 °C to 71 °C
    Maximum altitude 2,000 m (800 mbar) (at 25 °C ambient temperature)
    Operating humidity range 10% to 90%, noncondensing
    Storage humidity range 5% to 95%, noncondensing
    Pollution Degree 2

    Indoor use only.

    Environmental Standards

    This product meets the requirements of the following environmental standards for electrical equipment.

    • IEC 60068-2-1 Cold
    • IEC 60068-2-2 Dry heat
    • IEC 60068-2-78 Damp heat (steady state)
    • IEC 60068-2-64 Random vibration
    • IEC 60068-2-27 Shock
    Note To verify marine approval certification for a product, refer to the product label or visit ni.com/certification and search for the certificate.

    Shock and Vibration

    Table 23. Shock and Vibration
    Operating vibration 5 Hz to 500 Hz, 0.3 g RMS
    Non-operating vibration 5 Hz to 500 Hz, 2.4 g
    RMS operating shock 30 g, half-sine, 11 ms pulse
    Non-operating shock 50 g, half-sine, 11 ms pulse

    1 100 GbE is supported in the UHD Toolflow. Aurora streaming is supported in the LabVIEW FPGA Toolflow. Support for these capabilities is not available in UHD 4.1. It will be added in a subsequent release.

    2 This feature is supported in the LabVIEW FPGA Toolflow.

    3 Module assembly H and earlier has an NVM of 16 GB. All other module assemblies have an NVM of 32 GB.

    4 100 GbE is supported in the UHD Toolflow. Aurora streaming is supported in the LabVIEW FPGA Toolflow. Support for these capabilities is not available in UHD 4.1. It will be added in a subsequent release.

    5 This feature is supported in the LabVIEW FPGA Toolflow.

    6 The applicable maximum value depends on the sample rate selected in software.

    7 Tuning the frequency to values >7.2 GHz may degrade output power, TX EVM, noise density, and noise figure specifications.

    8 Maximum output power varies by frequency. Refer to the subsequent TX Measurements section for additional information.

    9 This settling time applies to the TX/RX switch.

    10 The output power resulting from the gain setting varies over the frequency band and among devices.

    11 Measured at the TX gain setting required to reach 0 dBm output power with 0 dBFS baseband signal.

    12 Maximum operating power refers to the maximum input power at the RF input port that does not saturate the ADC. The ADC can become saturated when the input power is greater than the maximum operating power. You can input a CW tone at maximum operating power at any frequency. You can configure gain settings at all frequencies to allow input signals at the maximum operating power to avoid saturating the ADC.

    13 Factory default accuracy. Contact NI if your application requires tuning the OCXO output frequency.