TestStand Semiconductor Module 2020 Bug Fixes

Overview

The following items are notable issues fixed between the release of TestStand Semiconductor Module 2019 and TestStand Semiconductor Module 2020, including additional patches and service packs. If you have an issue ID, you can search this list to validate that the issue has been fixed. This is not an exhaustive list of issues fixed in the current version of TestStand Semiconductor Module.

Bug Number

Legacy ID

Description

Details

566136 686176

TSM configuration for TestStand Sequence Editor does not provide option to resume when paused at breakpoint if running without a process model

When you use the TestStand Semiconductor Module configuration for the TestStand Sequence Editor, execute a sequence from an entry point that is not a TSM entry point, and pause execution at a breakpoint, no visible Resume option exists to resume execution.

Workaround:

Right-click the execution caption and select Resume from the context menu.

Reported Version:

TestStand Semiconductor Module 2017

Resolved Version:

TestStand Semiconductor Module 2020

Added:

Aug 12, 2019

228125 711014

TSM Context Closing Test Returns Incorrect Results for Case Structures or For Loops

The TSM Context Closing test, which is included in the LabVIEW VI Analyzer tool, verifies that a VI properly closes Semiconductor Module Context references. When a reference is closed inside a case structure of For loop, the TSM Context Closing test can either improperly report a warning or fail to report a warning when there should be one.

This bug has been resolved in TSM 2019 and later.

Workaround:

Use TSM 2019 or later.

Reported Version:

TestStand Semiconductor Module 2017

Resolved Version:

TestStand Semiconductor Module 2019

Added:

Aug 12, 2019

228153 741443

You cannot build a deployment of test programs with template steps that use the High Resolution Polling Wait VI in LV 2018 and later

Because of a dependency issue, you cannot build deployments of VIs that use the High Resolution Polling Wait VI. As a result, you cannot build deployments of test programs that use the VI in template steps if you are using LabVIEW 2018 or later.

Workaround:

There is currently no known workaround for this issue.

Reported Version:

TestStand Semiconductor Module 2017

Resolved Version:

TestStand Semiconductor Module 2020

Added:

Aug 12, 2019

228154 741749

NI-DAQmx .NET TSM Code Module API methods cause run-time errors in 64-bit TestStand

NI-DAQmx versions 19.0 and 19.1 do not install policy files for 64-bit assemblies. Attempting to use the NI-DAQmx .NET TSM Code Codule API methods results in run-time errors.

Workaround:

There is currently no known workaround for this issue.

Reported Version:

TestStand Semiconductor Module 2019

Resolved Version:

TestStand Semiconductor Module 2020

Added:

Aug 12, 2019

Additional Patch Information

Installing some patches may require certain additional steps or considerations. Please refer to the following table for more information about patches for this release.

These patches currently do not have any special instructions.

Glossary of Terms

 

  • Bug ID - When an issue is reported to NI, you may be given this ID or find it on ni.com.  You may also find IDs posted by NI on the discussion forums or in KnowledgeBase articles.
  • Legacy ID – An older issue ID that refers to the same issue.  You may instead find this issue ID in older known issues documents.
  • Description - A few sentences which describe the problem. The brief description given does not necessarily describe the problem in full detail.
  • Workaround - Possible ways to work around the problem.
  • Reported Version - The earliest version in which the issue was reported.
  • Resolved Version - Version in which the issue was resolved or was no longer applicable. "N/A" indicates that the issue has not been resolved.
  • Date Added - The date the issue was added to the document (not the reported date).