Due to the degree of customization possible with the high-speed serial device FPGAs, some applications may draw too much power or dissipate too much heat. Monitor the device state carefully, especially if your device pushes the power or heat limits. Use the Read Module Temperature and Read Module Power method nodes to monitor device temperature and heat, respectively.

Read Module Temperature allows you to read two onboard sensors: one sensor is embedded directly in the FPGA, and one reads the device temperature.

Figure 19. Read Module Temperature

Read Module Power provides information about how much power the device is drawing from the chassis 3.3V and 12V power rails.

Figure 20. Read Module Power