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Refer to the List of Bugs Fixed in NI TestStand 2017 Semiconductor Module on the NI website for a list of bugs fixed in NI TestStand 2017 Semiconductor Module.

The following list describes the new features in the NI TestStand 2019 Semiconductor Module (TSM) and other changes since the NI TestStand 2017 Semiconductor Module.

TSM calls the GetStationSettings callback sequence to programmatically obtain station settings without requiring much, if any, test engineer or technician interaction when execution begins.

Use TestStand and TSM with other NI development tools to build, debug, customize, and deploy semiconductor characterization and production test systems.

A semiconductor test program can include a pin map file, a main sequence file, subordinate sequence files, code modules, specifications, timing files, levels files, pattern files, source and capture waveforms, ...

Use the Configure entry point to provide a mechanism for end users to configure the handler/prober driver and to persist the settings for multiple lots.

When you perform multisite testing, you can improve performance by simultaneously testing multiple sites using multiple execution threads. When you use the TestStand Batch process model to test multiple ...

It is common to add a settling time before taking measurements to achieve the required precision. Once a test program is running well, evaluate the settling times to reduce them to the minimum settling ...

Depending on the number of sites a test program tests, the number of pins in the pin map, the number of independent instrument resources on the tester, and the number of logical processors on the tester, ...

A semiconductor test program must communicate information from the tester instrumentation to the DUT to which the instrumentation is connected. To handle this communication in a test program, test engineers ...

The pin map XML schema, located at \Components\Schemas\NI_SemiconductorModule\PinMap.xsd, defines the following structure for a pin map XML file:

Skip to Content Bookmarks Watch List Search Preferences Log in TestStand 2020 Semiconductor Module 2021 Q4 TestStand Semiconductor Module Help Tags: Feature Usage TestStand 2020 Semiconductor Module 2021 ...

Use the Pin Map Editor to view, create, modify, and save pin map files instead of editing the XML files directly. Use the Pin Map panel in the Test Program Editor to specify a pin map file for a test

Use the Connections table on the Pin Map tab to view and edit connections and connection attributes. The Connections table includes a row for every possible connection that can be made with the available ...

Use the Instruments section on the Pin Map tab to specify the type of instruments required to execute the test program and the name and attributes of each instrument. You can right–click any item in the ...

Use the Pins section on the Pin Map tab to specify the DUT pins and other pin types connected to the tester. You can right–click any item in the section you want to edit and use the context menu to

Use the Relay Configurations section on the Pin Map tab to specify a set of relays and their relay position states. You can set the relay state position of all relays with a single call to the TSM Code ...

Use the Relay Groups section on the Pin Map tab to specify a grouping of relays that you can reference with a single name. You can right–click any item in the section you want to edit and use the context ...

Use the Relays section on the Pin Map tab to specify the relays on the site and the relays on the tester that the test program associates with the pin map file references. You can right–click any item ...

Use the Sites section on the Pin Map tab to specify the sites on the tester. Site numbers start at 0 and must be consecutive without gaps. You can right–click any item in the section you want to edit and ...

If the contents of the pin map XML file do not satisfy the constraints the pin map schema defines, TSM reports error messages. Some of the error messages are generic XML validation errors and can be difficult ...

You can generate the following types of TSM reports and data logs. Enable and configure the corresponding TSM result processing plug-in to generate the report or data log.

You can initiate a retest from the TestStand Sequence Editor, an operator interface, or a handler/prober. The STDF log file includes retest information.

Use the Scaling Factor column in the Tests table on the Tests tab of the Semiconductor Multi Test step and the Semiconductor Sequence Call step to specify the scaling factor for the base units for test ...

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