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PXI-5422 Specifications

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    Last Modified: November 30, 2018

    These specifications apply to the 8 MB, 32 MB, 256 MB, and 512 MB PXI-5422.

    Conditions

    Specifications are valid under the following conditions unless otherwise noted:

    • Analog filter enabled
    • Signals terminated with 50 Ω
    • Direct path set to 1 V pk-pk
    • Low-gain amplifier path set to 2 V pk-pk
    • High-gain amplifier path set to 12 V pk-pk
    • Sample rate set to 200 MS/s
    • Sample Clock source set to Divide-by-N

    Typical specifications are representative of an average unit and valid under the following conditions unless otherwise noted:

    • Ambient operating temperature range of 20 ±3 °C

    CH 0 Analog Output

    Number of channels

    1

    Connector type

    SMB jack

    Output Voltage

    Full-scale voltage

    Main output path[1]

    12.00 V pk-pk to 5.64 mV pk-pk into a 50 Ω load

    Direct output path[2]

    1.000 V pk-pk to 0.707 V pk-pk

    DAC resolution

    16 bits

    Amplitude and Offset

    Table 1. Amplitude Range [3]
    Path Load Amplitude (V pk-pk)
    Minimum Maximum
    Direct 50 Ω 0.707 1.00
    1 kΩ 1.35 1.91
    Open 1.41 2.00
    Low-gain amplifier 50 Ω 0.00564 2.00
    1 kΩ 0.0107 3.81
    Open 0.0113 4.00
    High-gain amplifier 50 Ω 0.0338 12.0
    1 kΩ 0.0644 22.9
    Open 0.0676 24.0

    Amplitude resolution

    <0.06% (0.004 dB) of Amplitude Range

    Offset range[4]

    Span of ±50% of Amplitude Range with increments <0.0028% of Amplitude Range

    Maximum Output Voltage

    Table 2. Maximum Output Voltage [5]
    Path Load Maximum Output Voltage (V)
    Direct 50 Ω ±0.500
    1 kΩ ±0.953
    Open ±1.000
    Low-gain amplifier 50 Ω ±1.000
    1 kΩ ±1.905
    Open ±2.000
    High-gain amplifier 50 Ω ±6.000
    1 kΩ ±11.43
    Open ±12.00

    Accuracy

    Table 3. DC Accuracy [6]
    Path DC Accuracy
    ±10 °C of Self-Calibration Temperature 0 °C to 55 °C
    Low-gain amplifier ±0.2% of Amplitude Range ± 0.05% of Offset ± 500 µV ±0.4% of Amplitude Range ± 0.05% of Offset ± 1 mV
    High-gain amplifier
    Path Gain Accuracy
    ±10 °C of Self-Calibration Temperature 0 °C to 55 °C
    Direct ±0.2% Amplitude Range ±0.4% Amplitude Range

    DC offset error[7]

    ±30 mV

    AC amplitude accuracy[8]

    (+2.0% + 1 mV), (-1.0% - 1 mV)

    (+0.8% + 0.5 mV), (-0.2% - 0.5 mV), typical

    Output

    Output impedance

    Software-selectable: 50 Ω or 75 Ω, nominal

    Output coupling

    DC

    Output enable

    Software-selectable[9]

    Maximum output overload

    CH 0 can be connected to a 50 Ω, ±12 V (±8 V for the direct path) source without sustaining any damage.[10]

    Waveform summing

    Supported[11]

    Frequency and Transient Response

    Analog filter[12]

    Software-selectable: 7-pole elliptical filter for image suppression
    Table 4. Pulse Response [13]
    Path Rise/Fall Time (ns), Typical Aberration (%), Typical
    Direct 1.0 16
    Low-gain amplifier 2.1 6
    High-gain amplifier 4.8 8
    Figure 1. Normalized Passband Flatness, Direct Path
    Figure 2. Normalized Passband Flatness, Low-Gain Amplifier Path
    Figure 3. Normalized Passband Flatness, High-Gain Amplifier Path
    Figure 4. Pulse Response, Low-Gain Amplifier Path with a 50 Ω Load

    Suggested Maximum Frequencies

    Table 5. Suggested Maximum Frequencies for Common Functions [14]
    Path Frequency (MHz)
    Sine Square[15] Ramp[15] Triangle[15]
    Direct 80 Not recommended
    Low-gain amplifier 50 10
    High-gain amplifier 43 25
    Figure 5. Amplitude Versus Recommended Sine Wave Frequency

    Spectral Characteristics

    Table 6. Spurious-Free Dynamic Range (SFDR) with Harmonics [16]
    Frequency SFDR with Harmonics (dB), Typical
    Direct Path Low-Gain Amplifier Path High-Gain Amplifier Path
    1 MHz 70 65 66
    5 MHz 58
    10 MHz 52
    20 MHz 63 64 49
    30 MHz 57 60 43
    40 MHz 48 53 39
    50 MHz —
    60 MHz 47 52
    70 MHz
    80 MHz 41
    Table 7. Spurious-Free Dynamic Range (SFDR) without Harmonics [16]
    Frequency SFDR without Harmonics (dB), Typical
    Direct Path Low-Gain Amplifier Path High-Gain Amplifier Path
    1 MHz 84 79 76
    5 MHz
    10 MHz 79
    20 MHz
    30 MHz 72 70 67
    40 MHz 47 57 54
    50 MHz 52 —
    60 MHz 46 51
    70 MHz
    80 MHz 40
    Table 8. Average Noise Density [17], Direct Path
    Amplitude Range Average Noise Density, Typical
    nV √Hz dBm/Hz dBFS/Hz
    1.00 V pk-pk 4.0 dBm 19.9 -141 -145
    Table 9. Average Noise Density [17], Low-Gain Amplifier Path
    Amplitude Range Average Noise Density, Typical
    nV √Hz dBm/Hz dBFS/Hz
    0.06 V pk-pk -20.5 dBm 1.3 -148 -144
    0.10 V pk-pk -16.0 dBm 2.2
    0.40 V pk-pk -4.0 dBm 8.9
    1.00 V pk-pk 4.0 dBm 22.3 -140
    2.00 V pk-pk 10.0 dBm 44.6 -134
    Table 10. Average Noise Density [17], High-Gain Amplifier Path
    Amplitude Range Average Noise Density, Typical
    nV √Hz dBm/Hz dBFS/Hz
    4.00 V pk-pk 16.0 dBm 93.8 -128 -144
    12.00 V pk-pk 25.6 dBm 281.5 -118
    Figure 6. 10 MHz Single-Tone Spectrum [18], Direct Path, 200 MS/s, Typical
    Figure 7. 10.00001 MHz Single-Tone Spectrum [18], Low-Gain Amplifier Path, 200 MS/s, Typical
    Figure 8. Total Harmonic Distortion, Direct Path, Typical
    Figure 9. Total Harmonic Distortion, Low-Gain Amplifier Path, Typical
    Figure 10. Total Harmonic Distortion, High-Gain Amplifier Path, Typical
    Figure 11. Intermodulation Distortion, 200 kHz Separation, Typical
    Figure 12. Direct Path, Two-Tone Spectrum [18], Typical

    Sample Clock

    Sources

    Internal[19]

    Divide-by-N (N ≥ 1)

    DDS-based, High-Resolution

    External

    CLK IN (SMB front panel connector)

    DDC CLK IN (DIGITAL DATA & CONTROL front panel connector)

    PXI Star Trigger (backplane connector)

    PXI_Trig <0..7> (backplane connector)

    Sample Rate Range and Resolution

    Table 11. Sample Rate Range
    Sample Clock Source Sample Rate Range (MS/s)
    Divide-by-N 5 to 200
    High-Resolution 5 to 100
    >100 to 200
    CLK IN 5 to 200
    DDC CLK IN
    PXI Star Trigger 5 to 105
    PXI_Trig <0..7> 5 to 20
    Table 12. Sample Rate Resolution
    Sample Clock Source Sample Rate Resolution
    Divide-by-N Configurable to (200 MS/s)/N (1 ≤ N ≤ 40)
    High-Resolution 1.06 µHz
    4.24 µHz
    CLK IN

    Resolution determined by external clock source. External Sample Clock duty cycle tolerance 40% to 60%.

    DDC CLK IN
    PXI Star Trigger
    PXI_Trig <0..7>

    Sample Clock Delay Range and Resolution

    Table 13. Delay Adjustment Range
    Sample Clock Source Delay Adjustment Range
    Divide-by-N ±1 Sample Clock period
    High-Resolution
    CLK IN 0 ns to 7.6 ns
    DDC CLK IN
    PXI Star Trigger
    PXI_Trig <0..7>
    Table 14. Delay Adjustment Resolution
    Sample Clock Source Delay Adjustment Resolution
    Divide-by-N < 5 ps
    High-Resolution ≤100 MHz Sample Clock period/16,384
    High-Resolution >100 MHz Sample Clock period/4,096
    CLK IN <15 ps
    DDC CLK IN
    PXI Star Trigger
    PXI_Trig <0..7>

    System Phase Noise and Jitter (10 MHz Carrier)

    Table 15. System Phase Noise Density Offset [20]
    Sample Clock Source System Phase Noise Density Offset (dBc/Hz), Typical
    100 Hz 1 kHz 10 kHz
    Divide-by-N -110 -122 -138
    High-Resolution[21] 100 MS/s -109 -120 -120
    High-Resolution[21] 200 MS/s -108 -122
    CLK IN -116 -130 -143
    PXI Star Trigger[22] -111 -128 -136
    Table 16. System Output Jitter [23]
    Sample Clock Source System Output Jitter (ps rms), Typical
    Divide-by-N 1.5
    High-Resolution[21] 100 MS/s 4.0
    High-Resolution[21] 200 MS/s 4.2
    CLK IN 1.1
    PXI Star Trigger[22] 2.1
    External Sample Clock input jitter tolerance

    Cycle-cycle jitter

    ±150 ps, typical

    Period jitter

    ±1 ns, typical

    Sample Clock Exporting

    Destinations[24]

    PFI <0..1> (SMB front panel connectors)

    DDC CLK OUT (DIGITAL DATA & CONTROL front panel connector)

    PXI_Trig <0..6> (backplane connector)

    Maximum frequency

    PFI <0..1>

    200 MHz

    DDC CLK OUT

    200 MHz

    PXI_Trig <0..6>

    20 MHz
    Jitter

    PFI 0

    6 ps rms, typical

    PFI 1

    12 ps rms, typical

    DDC CLK OUT

    60 ps rms, typical
    Duty cycle

    PFI <0..1>

    25% to 65%

    DDC CLK OUT

    35% to 65%

    Onboard Clock (Internal VCXO)

    Source

    Internal Sample Clocks can either be locked to a Reference Clock using a phase-locked loop or derived from the onboard VCXO frequency reference.

    Frequency accuracy

    ±25 ppm

    Phase-Locked Loop (PLL) Reference Clock

    Sources[25]

    PXI_CLK10 (backplane connector)

    CLK IN (SMB front panel connector)

    Frequency accuracy

    When using the PLL, the frequency accuracy of the PXI-5422 is solely dependent on the frequency accuracy of the PLL Reference Clock source.

    Lock time

    ≤200 ms, typical

    Frequency range[26]

    5 MHz to 20 MHz in increments of 1 MHz[27]

    Duty cycle range

    40% to 60%

    Destinations

    PFI <0..1> (SMB front panel connectors)

    PXI_Trig <0..6> (backplane connector)

    CLK IN

    Connector type

    SMB jack

    Direction

    Input

    Destinations

    Sample Clock

    PLL Reference Clock
    Frequency range

    Sample Clock destination

    5 MHz to 200 MHz

    PLL Reference Clock destination

    5 MHz to 20 MHz
    Input voltage range into 50 Ω

    Sine wave

    0.65 V pk-pk to 2.8 V pk-pk (0 dBm to +13 dBm)

    Square wave

    0.2 V pk-pk to 2.8 V pk-pk

    Maximum input overload

    ±10 V

    Input impedance

    50 Ω

    Input coupling

    AC

    PFI 0 and PFI 1

    Connector type

    SMB jack (x2)

    Direction

    Bidirectional

    Frequency range

    DC to 200 MHz
    As an input (trigger)

    Destinations

    Start Trigger

    Maximum input overload

    -2 V to +7 V

    V IH

    2.0 V

    V IL

    0.8 V

    Input impedance

    1 kΩ
    As an output (event)

    Sources

    Sample Clock divided by integer K (1 ≤ K ≤ 4,194,304)

    Sample Clock Timebase (200 MHz) divided by integer M (4 ≤ M ≤ 4,194,304)

    PLL Reference Clock

    Marker

    Exported Start Trigger (Out Start Trigger)

    Output impedance

    50 Ω

    Maximum output overload

    -2 V to +7 V
    Minimum V OH[28]

    Open load

    2.7 V

    50 Ω load

    1.3 V
    Maximum V OL[28]

    Open load

    0.6 V

    50 Ω load

    0.2 V

    Rise/fall time (20% to 80%)[29]

    ≤2.0 ns

    DIGITAL DATA & CONTROL (DDC)

    Connector type

    68-pin VHDCI female receptacle

    Number of data output signals

    16

    Control signals

    DDC CLK OUT (clock output)

    DDC CLK IN (clock input)

    PFI 2 (input)

    PFI 3 (input)

    PFI 4 (output)

    PFI 5 (output)

    Ground

    23 pins

    Output Signals (Data Outputs, DDC CLK OUT, and PFI <4..5>)

    <
    Low-voltage differential signal (LVDS)[30]

    V OH

    1.3 V, typical

    1.7 V, maximum

    V OL

    0.8 V, minimum

    1.0 V, typical

    Differential output voltage

    0.25 V, minimum

    0.45 V, maximum

    Output common-mode voltage

    1.125 V, minimum

    1.375 V, maximum

    Rise/fall time (20% to 80%)

    0.8 ns, typical

    1.6 ns, maximum

    Output skew[31]

    1 ns, typical

    2 ns, maximum

    Output enable/disable

    Controlled through the software on all data output signals and control signals collectively. When disabled, the output signals go to a high-impedance state.

    Maximum output overload

    -0.3 V to +3.9 V

    Input Signals (DDC CLK IN and PFI <2..3>)

    Signal type

    Low-voltage differential signal (LVDS)

    Input differential impedance

    100 Ω

    Maximum output overload

    -0.3 V to +3.9 V

    Differential input voltage

    0.1 V, minimum

    0.5 V, maximum

    Input common mode voltage

    0.2 V, minimum

    2.2 V, maximum

    DDC CLK OUT

    Clocking format

    Data outputs and markers change on the falling edge of DDC CLK OUT.

    Frequency range

    Refer to the Sample Clock section for more information.

    Duty cycle

    35% to 65%

    Jitter

    60 ps rms, typical

    DDC CLK IN

    Clocking format

    DDC data output signals change on the rising edge of DDC CLK IN.

    Frequency range

    10 Hz to 200 MHz

    Input duty cycle tolerance

    40% to 60%

    Start Trigger

    Sources

    PFI <0..1> (SMB front panel connectors)

    PFI <2..3> (DIGITAL DATA & CONTROL front panel connector)

    PXI_Trig <0..7> (backplane connector)

    PXI Star Trigger (backplane connector)

    Software (use node or function call)

    Immediate (does not wait for a trigger)[32]

    Trigger modes

    Single

    Continuous

    Stepped

    Burst

    Edge detection

    Rising

    Minimum pulse width

    25 ns

    Delay from Start Trigger to CH 0 analog output

    65 Sample Clock periods + 110 ns

    Delay from Start Trigger to digital data output

    41 Sample Clock periods + 110 ns

    Destinations

    A signal used as a trigger can be routed out to any destination listed in the Destinations specification of the Markers section.

    Exported trigger delay

    65 ns, typical

    Exported trigger pulse width

    >150 ns

    Related Topics

    Markers

    Destinations

    PFI <0..1> (SMB front panel connectors)

    PFI <4..5> (DIGITAL DATA & CONTROL front panel connector)

    PXI_Trig <0..6> (backpane connector)

    Quantity

    One marker per segment

    Quantum

    Marker position must be placed at an integer multiple of four samples.

    Width

    >150 ns

    Skew with respect to analog output

    PFI <0..1>

    ±2 Sample Clock periods

    PXI_Trig <0..6>

    ±2 Sample Clock periods
    Skew with respect to digital data output

    PFI <4..5>

    <2 ns

    Jitter

    40 ps rms, typical

    Related Topics

    Arbitrary Waveform Generation Mode

    Memory usage

    The PXI-5422 uses the Synchronization and Memory Core (SMC) technology in which waveforms and instructions share onboard memory. Parameters—such as number of segments in sequence list, maximum number of waveforms in memory, and number of samples available for waveform storage—are flexible and user-defined.

    Onboard memory size

    8 MB standard

    8,388,608 bytes

    32 MB option

    33,554,432 bytes

    256 MB option

    268,435,456 bytes

    512 MB option

    536,870,912 bytes

    Output modes

    Arbitrary waveform[33]

    Arbitrary sequence[34]
    Table 17. Minimum Waveform Size
    Trigger Mode Minimum Waveform Size (Samples)
    Arbitrary Waveform Mode Arbitrary Sequence Mode[35]
    At >50 MS/s At ≤50 MS/s
    Single 16
    Continuous 32 192 96
    Stepped
    Burst

    Loop count

    1 to 16,777,215

    Burst trigger: Unlimited

    Quantum

    Waveform size must be an integer multiple of four samples.

    Memory Limits[36]

    Table 18. Maximum Waveform Memory
    Onboard Memory Maximum Waveform Memory (Samples)
    Arbitrary Waveform Mode Arbitrary Sequence Mode[37]
    8 MB standard 4,194,176 4,194,048
    32 MB option 16,777,088 16,776,960
    256 MB option 134,217,600 134,217,472
    512 MB option 268,435,328 268,435,200
    Table 19. Maximum Waveforms in Arbitrary Sequence Mode [37]
    Onboard Memory Maximum Waveforms
    8 MB standard 65,000
    Burst trigger: 8,000
    32 MB option 262,000
    Burst trigger: 32,000
    256 MB option 2,097,000
    Burst trigger: 262,000
    512 MB option 4,194,000
    Burst trigger: 524,000
    Table 20. Maximum Segments in a Sequence in Arbitrary Sequence Mode [38]
    Onboard Memory Maximum Segments in a Sequence
    8 MB standard 104,000
    Burst trigger: 65,000
    32 MB option 418,000
    Burst trigger: 262,000
    256 MB option 3,354,000
    Burst trigger: 2,090,000
    512 MB option 6,708,000
    Burst trigger: 4,180,000

    Calibration

    Self-calibration

    An onboard, 24-bit ADC and precision voltage reference are used to calibrate the DC gain and offset. The self-calibration is initiated by the user through the software and takes approximately 90 seconds to complete.

    External calibration

    External calibration calibrates the VCXO, voltage reference, DC gain, and offset. Appropriate constants are stored in nonvolatile memory.

    Calibration interval

    Specifications valid within two years of external calibration.

    Warm-up time

    15 minutes

    Power

    Table 21. Power
    Power
    Typical Operation[39] Overload Operation[40]
    +3.3 V DC 2 A
    +5 V DC Refer to Figure 13. 2.7 A
    +12 V DC 0.46 A
    -12 V DC 0.01 A
    Total 12.2 W + 5 V × 5 V current 25.7 W
    Figure 13. 5 V Current Versus Frequency and Amplitude

    Physical

    Dimensions

    3U, one-slot, PXI/cPCI module[41]

    21.6 cm × 2.0 cm × 13.0 cm (8.5 in. × 0.8 in. × 5.1 in.)

    Weight

    352 g (12.4 oz)

    Environment

    Maximum altitude

    2,000 m (at 25 °C ambient temperature)

    Pollution Degree

    2

    Indoor use only.

    Operating Environment

    Ambient temperature range

    0 °C to 55 °C (Tested in accordance with IEC 60068-2-1 and IEC 60068-2-2.)

    0 °C to 45 °C (Tested in accordance with IEC 60068-2-1 and IEC 60068-2-2.) when installed in a PXI-101x or PXI-1000B chassis

    Relative humidity range

    10% to 90%, noncondensing (Tested in accordance with IEC 60068-2-56.)

    Storage Environment

    Ambient temperature range

    -25 °C to 85 °C (Tested in accordance with IEC 60068-2-1 and IEC 60068-2-2.)

    Relative humidity range

    5% to 95%, noncondensing (Tested in accordance with IEC 60068-2-56.)

    Shock and Vibration

    Shock

    Operating[42]

    30 g peak, half-sine, 11 ms pulse (Tested in accordance with IEC 60068-2-27. Test profile developed in accordance with MIL-PRF-28800F.)

    Storage

    50 g peak, half-sine, 11 ms pulse (Tested in accordance with IEC 60068-2-27. Test profile developed in accordance with MIL-PRF-28800F.)

    Random vibration

    Operating[42]

    5 Hz to 500 Hz, 0.31 grms (Tested in accordance with IEC 60068-2-64.)

    Nonoperating

    5 Hz to 500 Hz, 2.46 grms (Tested in accordance with IEC 60068-2-64. Test profile exceeds the requirements of MIL-PRF-28800F, Class 3.)

    Compliance and Certifications

    Safety Compliance Standards

    This product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:

    • IEC 61010-1, EN 61010-1
    • UL 61010-1, CSA C22.2 No. 61010-1
    spd-note-note
    Note  

    For UL and other safety certifications, refer to the product label or the Product Certifications and Declarations section.

    Electromagnetic Compatibility

    This product meets the requirements of the following EMC standards for electrical equipment for measurement, control, and laboratory use:
    • EN 61326-1 (IEC 61326-1): Class A emissions; Basic immunity
    • EN 55011 (CISPR 11): Group 1, Class A emissions
    • AS/NZS CISPR 11: Group 1, Class A emissions
    • FCC 47 CFR Part 15B: Class A emissions
    • ICES-001: Class A emissions
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    Note  

    In the United States (per FCC 47 CFR), Class A equipment is intended for use in commercial, light-industrial, and heavy-industrial locations. In Europe, Canada, Australia, and New Zealand (per CISPR 11), Class A equipment is intended for use only in heavy-industrial locations.

    spd-note-note
    Note  

    Group 1 equipment (per CISPR 11) is any industrial, scientific, or medical equipment that does not intentionally generate radio frequency energy for the treatment of material or inspection/analysis purposes.

    spd-note-note
    Note  

    For EMC declarations and certifications, refer to the Online Product Certification section.

    CE Compliance

    This product meets the essential requirements of applicable European Directives, as follows:

    • 2014/35/EU; Low-Voltage Directive (safety)
    • 2014/30/EU; Electromagnetic Compatibility Directive (EMC)

    Product Certifications and Declarations

    Refer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for NI products, visit ni.com/certification, search by model number or product line, and click the appropriate link in the Certification column.

    Environmental Management

    NI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.

    For additional environmental information, refer to the Minimize Our Environmental Impact web page at ni.com/environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.

    Waste Electrical and Electronic Equipment (WEEE)

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    EU Customers  

    At the end of the product life cycle, all NI products must be disposed of according to local laws and regulations. For more information about how to recycle NI products in your region, visit ni.com/environment/weee.

    电子信息产品污染控制管理办法（中国RoHS）

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    中国客户  

    National Instruments符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。关于National Instruments中国RoHS合规性信息，请登录 ni.com/environment/rohs_china。(For information about China RoHS compliance, go to ni.com/environment/rohs_china.)

    • 1 When the main output path is selected, either the low-gain amplifier or the high-gain amplifier is used, depending on the value of the Gain property or NIFGEN_ATTR_GAIN attribute.
    • 2 The direct path is optimized for intermediate frequency (IF) applications.
    • 3 Amplitude values assume the full scale of the DAC is utilized. If an amplitude smaller than the minimum value is desired, then waveforms less than full scale of the DAC can be used. NI-FGEN compensates for user-specified resistive loads.
    • 4 Offset range is not available on the direct path.
    • 5 The combination of amplitude and offset is limited by the maximum output voltage.
    • 6 All paths are calibrated for amplitude and gain errors. The low-gain and high-gain amplifier paths are also calibrated for offset errors. DC accuracy is calibrated into a high-impedance load. Amplitude Range is defined as two times the gain setting. For example, a DC signal with a gain of 8 has an amplitude range of 16 V. If this signal has an offset of 1.5, DC accuracy is calculated by the following equation: ±0.2% * (16 V) ± 0.05% * (1.5 V) ± 500µV = ±33.25 mV
    • 7 Within 0 °C to 55 °C.
    • 8 With a 50 kHz sine wave and terminated with high impedance.
    • 9 When the output path is disabled, CH 0 is terminated to ground with a 1 W resistor with a value equal to the selected output impedance.
    • 10 No damage occurs if CH 0 is shorted to ground indefinitely.
    • 11 The output terminals of multiple PXI-5422 waveform generators can be connected directly together.
    • 12 Available on low-gain amplifier and high-gain amplifier paths.
    • 13 Analog filter disabled. Measured with a 1 m RG-223 cable.
    • 14 The minimum frequency is <1 mHz. The value depends on memory size and module configuration.
    • 15 Disable the analog filter for square, ramp, and triangle functions.
    • 16 At amplitude of -1 dBFS and measured from DC to 100 MHz. All values include aliased harmonics. Dynamic range is defined as the difference between the carrier level and the largest spur.
    • 17 Average noise density at small amplitudes is limited by a -148 dBm/Hz noise floor.
    • 18 The noise floor in this figure is limited by the measurement device. Refer to Table 8 for more information about this limit.
    • 19 Refer to the Onboard Clock section for more information about internal clock sources.
    • 20 Specified at two times DAC oversampling.
    • 21 High-Resolution specifications vary with sample rate.
    • 22 PXI Star Trigger specification is valid when the Sample Clock source is locked to PXI_CLK10.
    • 23 Specified at two times DAC oversampling. Integrated from 100 Hz to 100 kHz.
    • 24 Exported Sample Clocks can be divided by integer K (1 ≤ K ≤ 4,194,304).
    • 25 The PLL Reference Clock provides the reference frequency for the PLL.
    • 26 The PLL Reference Clock frequency must be accurate to ±50 ppm.
    • 27 The default is 10 MHz.
    • 28 Output drivers are +3.3 V TTL compatible.
    • 29 Load of 10 pF.
    • 30 Tested with a 100 Ω differential load, measured with an SHC68-C68-D3 LVDS cable (188143B-01), and driver and receiver comply with ANSI/TIA/EIA-644.
    • 31 Skew between any two output signals on the DIGITAL DATA & CONTROL (DDC) front panel connector.
    • 32 The default is Immediate.
    • 33 In arbitrary waveform mode, a single waveform is selected from the set of waveforms stored in onboard memory and generated.
    • 34 In arbitrary sequence mode, a sequence directs the PXI-5422 to generate a set of waveforms in a specific order. Elements of the sequence are referred to as segments. Each segment is associated with a set of instructions. The instructions identify which waveform is selected from the set of waveforms in memory, how many loops (iterations) of the waveform are generated, and at which sample in the waveform a marker output signal is sent.
    • 35 The minimum waveform size is sample rate dependent in arbitrary sequence mode.
    • 36 All trigger modes except where noted.
    • 37 One or two segments in a sequence.
    • 38 Waveform memory is <4,000 samples.
    • 39 Typical operation includes the following conditions:
      • Sine output
      • Analog filter enabled
      • 50 Ω termination
      • 200 MS/s High-Resolution Sample Clock
      • Digital pattern enabled and terminated
      • Sample Clock routed to PFI 0 and terminated
    • 40 Occurs when CH 0 is shorted to ground.
    • 41 PXI-5422 modules of revision B or later are equipped with a modified PXI Express-compatible backplane connector. This modified connector allows the PXI-5422 to be supported by hybrid slots in a PXI Express chassis. To determine the revision of a PXI-5422, read the label on the underside of the PXI-5422 module. The label will list an assembly number of the format 191946x-01, where x is the revision.
    • 42 Spectral and jitter specifications could degrade.

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