PXI-6542 Specifications

These specifications apply to the PXI-6542 with 1 MBit, 8 MBit, and 64 MBit of memory per channel.

Note All values were obtained using a 1 m cable (SHC68-C68-D4 recommended). Performance specifications are not guaranteed when using longer cables.

Definitions

Warranted specifications describe the performance of a model under stated operating conditions and are covered by the model warranty.

Characteristics describe values that are relevant to the use of the model under stated operating conditions but are not covered by the model warranty.

  • Typical specifications describe the performance met by a majority of models.
  • Nominal specifications describe an attribute that is based on design, conformance testing, or supplemental testing.

Specifications are Typical unless otherwise noted.

Conditions

Typical values are representative of an average unit operating at room temperature.

Channels

Data

Number of channels

32

Direction control

Per channel

Programmable Function Interface (PFI)

Number of channels

4

Direction control

Per channel

Clock terminals

Input

3

Output

2

Generation Channels

Channels

Data

DDC CLK OUT

PFI <0..3>

Signal type

Single-ended

Table 1. Voltage Levels, I = 100 µA
Logic family, into 1 MΩ Low High
Typical Maximum Minimum Typical
1.8 V 0 V 0.1 V 1.7 V 1.8 V
2.5 V 2.4 V 2.5 V
3.3 V TTL (5 V TTL compatible) 3.2 V 3.3 V

Output impedance

50 Ω, nominal

Maximum DC drive strength, by logic family

1.8 V

±8 mA

2.5 V

±16 mA

3.3 V

±32 mA

Data channel driver enable/disable control

Software-selectable: per channel

Channel power-on state[1]

Drivers disabled, 50 kΩ input impedance

Output protection

Range

0 V to 5 V

Duration

Indefinite

Acquisition Channels

Channels

Data

STROBE

PFI <0..3>

Signal type

Single-ended

Table 2. Voltage Levels
Logic family Maximum Low Threshold Minimum High Threshold
1.8 V 0.45 V 1.35 V
2.5 V 0.75 V 1.75 V
3.3 V TTL (5 V TTL compatible) 1.00 V 2.30 V

Input impedance[2]

50 kΩ

Input protection range[3]

-1 V to 6 V

Timing

Sample Clock

Sources

1. On Board clock (internal voltage-controlled crystal oscillator [VCXO] with divider)

2. CLK IN (SMB connector)

3. PXI_STAR (PXI backplane)

4. STROBE (Digital Data & Control [DDC] connector; acquisition only)

Frequency range

On Board clock

48 Hz to 100 MHz

Configurable to 200 MHz/N

2 ≤ N ≤ 4,194,304

CLK IN

20 kHz to 100 MHz

PXI_STAR

48 Hz to 100 MHz

STROBE

48 Hz to 100 MHz

Relative delay adjustment

Range

0.0 to 1.0 Sample clock periods

Resolution

10 ps

Exported Sample Clock

Destinations[5]

1. DDC CLK OUT (DDC connector)

2. CLK OUT (SMB jack connector)

Delay (δC), for clock frequencies ≥25 MHz

Range

0.0 to 1.0 Sample clock periods

Resolution

1/256 of Sample clock period

Jitter, using On Board clock

Period

20 psrms, typical

Cycle-to-cycle

35 psrms, typical

Generation Timing

Channels

Data

DDC CLK OUT

PFI <0..3>

Data channel-to-channel skew

±600 ps, typical

Maximum data channel toggle rate

50 MHz

Data position modes

Sample clock rising edge

Sample clock falling edge

Delay from Sample clock rising edge

Generation data delay G), for clock frequencies ≥25 MHz

Range

0.0 to 1.0 Sample clock periods

Resolution

1/256 of Sample clock period

Exported Sample clock offset (tCO)

Software-selectable: 0.0 ns or 2.5 ns (default)

Time delay from Sample clock (internal) to DDC connector (tSCDDC)

15 ns, typical

Table 3. Generation Provided Setup and Hold Times
Exported Sample Clock Mode and Offset Voltage Family Time from Rising Clock Edge to Data Transition (tPCO) Minimum Provided Setup Time (tPSU) Minimum Provided Hold Time (tPH)
Noninverted, 2.5 ns 1.8 V 2.5 ns, typical tP - 5.5 ns 0.5 ns
2.5 V tP - 4.5 ns 0.9 ns
3.3 V/5.0 V tP - 4.5 ns 1 ns
Inverted, 0 ns 1.8 V tP/2 tP/2 - 3.5 ns (tP/2) - 1.5 ns
2.5 V tP/2 - 2.5 ns
3.3 V/5.0 V tP/2 - 2 ns
Note Provided setup and hold times account for maximum channel-to-channel skew and jitter.

The table values provided assume the following data position is set to Sample clock rising edge and the Sample clock is exported to the DDC connector and includes worst-case effects of channel-to-channel skew, inter-symbol interference, and jitter. Other combinations of exported Sample clock mode and offset are also allowed. The values presented are from the default case (noninverted clock with 2.5 s offset) and for providing balanced setup and hold times (inverted clock with 0 ns offset).

To determine the appropriate exported Sample clock mode and offset for your PXI-6542 generation session, compare the setup and hold times from the datasheet of your device under test (DUT) to the values in this table. Select the exported Sample clock mode and offset such that the PXI-6542 provided setup and hold times are greater than the setup and hold times required for the DUT.

Specified timing relationships apply at the DDC connector and at high-speed DIO accessory terminals. Any signal routing, clock splitting, buffers, or translation logic can impact this relationship. If multiple copies of DDC_CLK_OUT are necessary, use a zero buffer to preserve this relationship.

Figure 1. Generation Provided Setup and Hold Times Timing Diagram

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Note Provided setup and hold times account for maximum channel-to-channel skew and jitter.
Figure 2. Generation Timing Diagram

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Acquisition Timing

Channels

Data

STROBE

PFI <0..3>

Channel-to-channel skew

±600 ps, typical

Data position modes

Sample clock rising edge

Sample clock falling edge

Delay from Sample clock rising edge

Setup and hold times
To STROBE[6]

Setup time (tSUS)

3.1 ns, maximum

Hold time (tHS)

2.7 ns, maximum

To Sample clock[7]

Setup time (tSUSC)

0.4 ns

Hold time (tHSC)

0 ns

Time delay from DDC connector data to internal Sample clock (tDDCSC)

10 ns, typical

Acquisition data delay (δA), for clock frequencies ≥25 MHz

Range

0.0 to 1.0 Sample clock periods

Resolution

1/256 of Sample clock period

Figure 3. Acquisition Timing Diagram Using STROBE as the Sample Clock

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Figure 4. Acquisition Timing Diagram with Sample Clock Sources Other than STROBE

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CLK IN

Connector

SMB jack

Direction

Input

Signal type

Single-ended

Destinations

1. Reference clock for the phase-locked loop (PLL)

2. Sample clock

Input coupling

AC

Input protection

±10 VDC

Input impedance

Software-selectable: 50 Ω (default) or 1 kΩ

Minimum detectable pulse width

4 ns

Clock requirements

Free-running (continuous) clock

As Sample Clock

Table 4. External Sample Clock Range
Voltage Range (Vpk-pk) Sine Wave Square Wave
Frequency Range Frequency Range Duty Cycle
0.65 to 5.0 5.5 MHz to 100 MHz 20 kHz to 100 MHz
  • ƒ <50 MHz: 25% to 75%
  • ƒ ≥50 MHz: 40% to 60%
1.0 to 5.0 3.5 MHz to 100 MHz
2.0 to 5.0 1.8 MHz to 100 MHz

As Reference Clock

Frequency range

10 MHz ±50 ppm

Voltage range

0.65 Vpk-pk to 5.0 Vpk-pk

Duty cycle

25% to 75%

STROBE

Connector

DDC

Direction

Input

Destination

Sample clock (acquisition only)

Frequency range

48 Hz to 100 MHz

Duty cycle range[8]

ƒ <50 MHz

25% to 75%

ƒ ≥50 MHz

40% to 60%

Minimum detectable pulse width[9]

4 ns

Voltage thresholds

Refer to Acquisition Timing in the Timing section.

Clock requirements

Free-running (continuous) clock

Input impedance[10]

Software-selectable: 50 kΩ

PXI_STAR

Connector

PXI backplane

Direction

Input

Signal type

Single-ended

Destinations

1. Sample clock

2. Start trigger

3. Reference trigger (acquisition sessions only)

4. Advance trigger (acquisition sessions only)

5. Pause trigger (generation sessions only)

6. Script trigger <0..3> (generation sessions only)

Frequency range

48 Hz to 100 MHz

Clock requirements

Free-running (continuous) clock

CLK OUT

Connector

SMB jack

Direction

Output

Sources

1. Sample clock (excluding STROBE)

2. Reference clock (PLL)

Output impedance

50 Ω, nominal

Electrical characteristics

Refer to Generation Timing in the Timing section.

Maximum drive current

At 1.8 V

8 mA

At 2.5 V

16 mA

At 3.3 V

32 mA

Logic type

Generation logic family setting: 1.8 V, 2.5 V, 3.3 V

DDC CLK OUT

Connector

DDC

Direction

Output

Source[11]

Sample clock

Electrical characteristics

Refer to Generation Timing in the Timing section.

Reference Clock (PLL)

Sources[12]

1. PXI_CLOCK10, (PXI backplane)

2. CLK IN (SMB jack connector)

3. None (On Board clock not locked to a reference)

Destination

CLK OUT (SMB jack connector)

Lock time

400 ms, typical

Frequencies

10 MHz ±50 ppm

Duty cycle range

25% to 75%

Waveform

Memory and Scripting

Memory architecture

The PXI-6542 uses Synchronization and Memory Core (SMC) technology in which waveforms and instructions share onboard memory. Parameters such as number of script instructions, maximum number of script instructions, maximum number of waveforms in memory, and number of samples (S) available for waveform storage are flexible and user defined.

Onboard memory size[13]
1 Mbit/channel

Acquisition

1 Mbit/channel (4 MBytes total)

Generation

1 Mbit/channel (4 MBytes total)

8 Mbit/channel

Acquisition

8 Mbit/channel (32 MBytes total)

Generation

8 Mbit/channel (32 MBytes total)

64 Mbit/channel

Acquisition

64 Mbit/channel (256 MBytes total)

Generation

64 Mbit/channel (256 MBytes total)

Generation

Single waveform mode

Generates a single waveform once, n times, or continuously.

Scripted mode[14]

Generates a simple or complex sequence of waveforms.

Finite repeat count

1 to 16,777,216

Waveform quantum

Waveform must be an integer multiple of 2 S (samples).[15]

Table 5. Generation Minimum Waveform Size, Samples (S)[16]
Configuration Sample Rate
100 MHz 50 MHz
Single waveform 2 S 2 S
Continuous waveform 32 S 16 S
Stepped sequence 128 S 64 S
Burst sequence 512 S 256 S
Acquisition

Minimum record size[17]

1 S

Record quantum

1 record

Total records

2,147,483,647, maximum

Total pre-Reference trigger samples

0 up to full record

Total post-Reference trigger samples

0 up to full record

Triggers

Trigger Types Sessions Edge Detection Level Detection
1. Start Acquisition and generation Rising or falling
2. Pause Acquisition and generation High or low
3. Script <0..3> Generation Rising or falling High or low
4. Reference Acquisition Rising or falling
5. Advance Acquisition Rising or falling

Sources

1. PFI 0 (SMB jack connector)

2. PFI <1..3> (DDC connector)

3. PXI_TRIG <0..7> (PXI backplane)

4. PXI_STAR (PXI backplane)

5. Pattern match (acquisition sessions only)

6. Software (user function call)

7. Disabled (do not wait for a trigger)

Destinations[18]

PFI 0 (SMB jack connector)

PFI <1..3> (DDC connector)

PXI_TRIG <0..6> (PXI backplane)

Minimum required trigger pulse width

Generation

30 ns

Acquisition

Acquisition triggers must meet setup and hold time requirements.

Table 6. Trigger Rearm Time
Type Typical Maximum
Start to Reference 57 S 64 S
Start to Advance 138 S 143 S
Reference to Reference 132 S 153 S
Delay from Pause trigger to Pause state[19]

Generation sessions

32 Sample clock periods + 150 ns

Acquisition sessions

Data synchronous

Delay from trigger to digital data output

32 Sample clock periods + 160 ns

Events

Event Types Sessions
1. Marker <0..3> Generation
2. Data Active Generation
3. Ready for Start Acquisition and generation
4. Ready for Advance Acquisition
5. End of Record Acquisition

Destinations[20]

1. PFI 0 (SMB jack connector)

2. PFI <1..3> (DDC connector)

3. PXI_TRIG <0..6> (PXI backplane)

Marker time resolution (placement)

Markers must be placed at an integer multiple of 2 S (samples).

Miscellaneous

Warm-up time

15 minutes

On Board clock characteristics (valid only when PLL reference source is set to None)

Frequency accuracy

±100 ppm

Temperature stability

±30 ppm

Aging

±5 ppm first year

Software

Driver Software

Driver support for this device was first available in NI-HSDIO 1.2.

NI-HSDIO is an IVI-compliant driver that allows you to configure, control, and calibrate the PXI-6542. NI-HSDIO provides application programming interfaces for many development environments.

Application Software

NI-HSDIO provides programming interfaces, documentation, and examples for the following application development environments:

  • LabVIEW
  • LabWindows™/CVI™
  • Measurement Studio
  • Microsoft Visual C/C++
  • .NET (C# and VB.NET)

NI Measurement Automation Explorer

NI Measurement Automation Explorer (MAX) provides interactive configuration and test tools for the PXI-6542. MAX is included on the NI-HSDIO media.

Power

VDC Current Draw, Typical Current Draw, Maximum
+3.3 V 1.6 A 1.8 A
+5 V 1.2 A 1.7 A
+12 V 0.25 A 0.4 A
-12 V 0.06 A 0.10 A

Total power

15 W, typical

20.5 W, maximum

Physical Specifications

Dimensions

Single 3U, CompactPCI slot, PXI compatible, 21.6 cm × 2.0 cm × 13.1 cm

Weight

343 g (12.1 oz)

I/O Connectors

Label Connector Type Description
CLK IN SMB jack External Sample clock, external PLL reference input
PFI 0 Events, triggers
CLK OUT Exported Sample clock, exported Reference clock
DIGITAL DATA & CONTROL 68-pin VHDCI connector Digital data channels, exported Sample clock, STROBE, events, triggers

Environment

Note To ensure that the PXI-6542 cools effectively, follow the guidelines in the Maintain Forced Air Cooling Note to Users included with the PXI-6542 or available at ni.com/manuals. The PXI-6542 is intended for indoor use only.

Operating temperature

0 °C to 55 °C in all NI PXI chassis except the following: 0 °C to 45 °C when installed in an NI PXI-1000B or NI PXI-101x chassis

Operating relative humidity

10 to 90% relative humidity, noncondensing (meets IEC 60068-2-56)

Storage temperature

-20 °C to 70 °C

Storage relative humidity

5 to 95% relative humidity, noncondensing (meets IEC 60068-2-56)

Operating shock

30 g, half-sine, 11 ms pulse (meets IEC 60068-2-27; test profile developed in accordance with MIL-PRF-28800F)

Operating vibration

5 Hz to 500 Hz, 0.31 grms (meets IEC 60068-2-64)

Storage shock

50 g, half-sine, 11 ms pulse (meets IEC 60068-2-27; test profile developed in accordance with MIL-PRF-28800F)

Storage vibration

5 Hz to 500 Hz, 2.46 grms (meets IEC 60068-2-64; test profile exceeds requirements of MIL-PRF-28800F, Class B)

Altitude

0 to 2,000 m above sea level (at 25 °C ambient temperature)

Pollution degree

2

Compliance and Certifications

Safety Compliance Standards

This product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:

  • IEC 61010-1, EN 61010-1
  • UL 61010-1, CSA C22.2 No. 61010-1
Note For safety certifications, refer to the product label or the Product Certifications and Declarations section.

Electromagnetic Compatibility

This product meets the requirements of the following EMC standards for electrical equipment for measurement, control, and laboratory use:
  • EN 61326-1 (IEC 61326-1): Class A emissions; Basic immunity
  • EN 55011 (CISPR 11): Group 1, Class A emissions
  • AS/NZS CISPR 11: Group 1, Class A emissions
  • FCC 47 CFR Part 15B: Class A emissions
  • ICES-001: Class A emissions
Note For EMC declarations, certifications, and additional information, refer to the Online Product Certification section.

To meet EMC compliance, the following cautions apply:

Caution The SHC68-C68-D4 shielded cables must be used when operating the PXI-6542.
Caution EMC filler panels must be installed in all empty chassis slots.

CE Compliance 1378

This product meets the essential requirements of applicable European Directives, as follows:

  • 2014/35/EU; Low-Voltage Directive (safety)
  • 2014/30/EU; Electromagnetic Compatibility Directive (EMC)
  • 2011/65/EU; Restriction of Hazardous Substances (RoHS)
  • 2014/53/EU; Radio Equipment Directive (RED)
  • 2014/34/EU; Potentially Explosive Atmospheres (ATEX)

Product Certifications and Declarations

Refer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for NI products, visit ni.com/product-certifications, search by model number, and click the appropriate link.

Environmental Management

NI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.

For additional environmental information, refer to the Engineering a Healthy Planet web page at ni.com/environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.

EU and UK Customers

  • 1378 Waste Electrical and Electronic Equipment (WEEE)—At the end of the product life cycle, all NI products must be disposed of according to local laws and regulations. For more information about how to recycle NI products in your region, visit ni.com/environment/weee.
  • 电子信息产品污染控制管理办法(中国RoHS)

  • 1378 中国RoHSNI符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。关于NI中国RoHS合规性信息,请登录 ni.com/environment/rohs_china。(For information about China RoHS compliance, go to ni.com/environment/rohs_china.)
  • 1 For module assemblies C and later. Module assemblies A and B have an input impedance of 10 kΩ.

    2 For module assemblies C and later. Module assemblies A and B have an input impedance of 10 kΩ.

    3 Diode clamps in the design may provide additional protection outside the specified range.

    4 You can apply a delay or phase adjustment to the On Board clock to align multiple devices.

    5 Sample clocks with sources other than STROBE can be exported.

    6 Includes maximum data channel-to-channel skew.

    7 Does not include data channel-to-channel skew, tDDCSC, or tSCDDC.

    8 At the programmed thresholds.

    9 Required at both acquisition voltage thresholds.

    10 For module assemblies C and later. Module assemblies A and B have an input impedance of 10 kΩ.

    11 STROBE cannot be routed to DDC CLK OUT.

    12 The source provides the reference frequency for the PLL.

    13 Maximum limit for generation sessions assumes no scripting instructions.

    14 Use scripts to describe the waveforms to be generated, the order in which the waveforms are generated, how many times the waveforms are generated, and how the device responds to Script triggers.

    15 Regardless of waveform size, NI-HSDIO allocates waveforms into block sizes of 32 S of physical memory.

    16 Sample rate dependent. Increasing sample rate increases minimum waveform size.

    17 Regardless of waveform size, NI-HSDIO allocates at least 128 bytes for a record.

    18 Each trigger can be routed to any destination except the Pause trigger. The Pause trigger cannot be exported for acquisition sessions.

    19 Use the Data Active event during generation to determine when the PXI-6542 enters the Pause state.

    20 Except for the Data Active event, each event can be routed to any destination. The Data Active event can be routed only to the PFI channels.