PDF1. Step 1: Choose Your NI Single-Board RIO Embedded Device
| NI Single-Board RIO Embedded Devices | Processor Speed (MHz) | FPGA Size |
3.3 V DIO Lines |
AI Channels |
AO Channels |
24 V DI/DO Lines |
||
| Digital I/O Only Devices | ||||||||
| sbRIO-9601 | 266 | 1M | 110 | 0 | 0 | 0 | ||
| sbRIO-9602 | 400 | 2M | 110 | 0 | 0 | 0 | ||
| sbRIO-9605 | 400 | LX25 | 96 | 0 | 0 | 0 | ||
| sbRIO-9606 | 400 | LX45 | 96 | 0 | 0 | 0 | ||
| Analog and Digital I/O Devices | ||||||||
| sbRIO-9611 | 266 | 1M | 110 | 32 | 0 | 0 | ||
| sbRIO-9612 | 400 | 2M | 110 | 32 | 0 | 0 | ||
| sbRIO-9631 | 266 | 1M | 110 | 32 | 4 | 0 | ||
| sbRIO-9632 | 400 | 2M | 110 | 32 | 4 | 0 | ||
| sbRIO-9641 | 266 | 1M | 110 | 32 | 4 | 32/32 | ||
| sbRIO-9642 | 400 | 2M | 110 | 32 | 4 | 32/32 | ||
2. Step 2: Choose Your I/O Expansion
In addition to built-in I/O, NI Single-Board RIO has the ability to expand the I/O through C Series modules or the RIO Mezzanine Card connector. The RIO Mezzanine Card connector is a high-speed, high-bandwidth connector providing direct access to FPGA digital I/O lines as well as certain processor-specific functions. The connector enables users to design custom RIO Mezzanine Cards, or daughter cards, to further customize NI Single-Board RIO to fit specific applications requiring custom circuitry or combination of I/O and peripherals. The connector is the primary method to extend the I/O of NI Single-Board RIO systems that do not implement direct C Series I/O connectors, such as the sbRIO-9605 and sbRIO-9606.
Figure 2. NI sbRIO-9606 featuring a RIO Mezzanine Card connector for direct FPGA and processor access to custom daughter cards.
You can connect up to three board-only C Series modules to certain NI Single-Board RIO embedded systems without a RIO Mezzanine Card connector if you need additional I/O on a specific motherboard. If you have an NI Single-Board RIO application that requires a C Series module that has not been converted to a board-only version, contact National Instruments at (800) 531-5066 to determine if a board-only version is available or can be created.
Figure 3. You can connect up to three of the more than 50 C Series I/O and communication modules to add I/O capabilities to certain NI Single-Board RIO products or build your own custom I/O module.
Board-only C Series devices use the same circuitry as C Series modules for NI CompactDAQ and CompactRIO, but are built without the mechanical enclosure for use with NI Single-Board RIO. By removing the enclosure, you can place the modules closer together to minimize the size of the system footprint. Removing the enclosures also removes the shielding from around the module and makes it more susceptible to ambient environmental changes (such as temperature). Because of these variables, the specifications of a board-only C Series module may be slightly different than the specifications for an enclosed C Series module. It may be possible, with the aid of a system enclosure, to improve on the documented specifications of board-only C Series modules. In all cases, use the latest Operating Instructions and Specifications document for the specific C Series modules to determine any expected differences in packaged and board-only versions of modules.
In addition to the board-only line of C Series modules, the entire line of packaged C Series modules for CompactRIO is compatible with NI Single-Board RIO. The C Series modules with enclosures are slightly larger than the board-only C Series modules, so they overlap with neighboring NI Single-Board RIO expansion slots. This limits the number of available expansion slots at two when C Series modules are used within their enclosure. If you need up to eight channels of C Series expansion I/O in a prebuilt rugged enclosure, consider using CompactRIO.
| Type of Signal | Signal | Module | Channels | Special Features |
| Analog Input | Small voltage (±80 mV) |
32 |
16-bit, ±200 mV to ±10 V, 250 kS/s, 32 SE or 16 diff channels, isolation | |
|
4 |
24-bit, 100 S/s, ch-ch isolated universal AI module (±125 mV to ±60 V, ±25 mA, TC, 3- and 4-wire RTD, quarter-, half-, and full-bridge) |
|||
| Medium voltage (±10 V) |
8 |
12-bit, 500 kS/s, single-ended, isolation | ||
|
32 |
16-bit, ±200 mV to ±10 V, 250 kS/s, 32 SE or 16 diff channels, isolation |
|||
|
4 |
16-bit, 100 kS/s per ch, simultaneous, differential |
|||
|
4 |
24-bit, 100 S/s, ch-ch isolated universal AI module (±125 mV to ±60 V, ±25 mA, TC, 3- and 4-wire RTD, quarter-, half-, and full-bridge) |
|||
|
4 |
24-bit, ±10 V, 50 kS/s, simultaneous, antialiasing, 250 Vrms ch-ch isolation |
|||
| Medium voltage (±10 V) with high isolation |
4 |
16-bit, ±200 mV to ±10 V, 250 kS/s, 600 VDC (US)/400 VDC (EU) Cat I bank isolation | ||
|
4 |
24-bit, 100 S/s per ch, ch-ch isolated universal AI module (±125 mV to ±60 V, ±25 mA, TC, 3- and 4-wire RTD, quarter-, half-, and full-bridge) |
|||
|
4 |
24-bit, ±10 V, 50 kS/s, simultaneous, antialiasing, 250 Vrms ch-ch isolation |
|||
| High voltage (±60 V) |
4 |
24-bit, 100S/s per ch, ch-ch isolated universal AI module (±125 mV to ±60 V, ±25 mA, TC, 3- and 4-wire RTD, quarter-, half-, and full-bridge) | ||
|
8 |
12-bit, 800 kS/s, single-ended, isolation |
|||
|
4 |
24-bit, ±60 V, 50 kS/s, simultaneous, antialiasing, 250 Vrms ch-ch isolation |
|||
| Thermocouple |
4 |
24-bit delta-sigma, 15 S/s, differential | ||
|
4 |
24-bit, 100 S/s, ch-ch isolated universal AI module (±125 mV to ±60 V, ±25 mA, TC, 3 and 4-wire RTD, quarter-, half-, and full-bridge) |
|||
| RTD |
4 |
24-bit, 400 S/s, 0 to 400 Ω RTD support, 3- and 4-wire measurements | ||
|
4 |
24-bit, 100 S/s, ch-ch isolated universal AI module (±125 mV to ±60 V, ±25 mA, TC, 3- and 4-wire RTD, quarter-, half-, and full-bridge) |
|||
| IEPE Sensors (Accelerometer/ Microphone) |
4 |
24-bit, 51.2 kS/s, simultaneous, IEPE conditioning, built-in antialiasing | ||
| Bridge-Based Sensors (Strain Gages/Load Cells) |
4 |
24-bit, 100 S/s, ch-ch isolated universal AI module (±125 mV to ±60 V, ±25 mA, TC, 3- and 4-wire RTD, quarter-, half-, and full-bridge) | ||
|
4 |
24-bit, 50 kS/s, simultaneous, full-/half-bridge support, antialiasing |
|||
| Analog Output | Medium voltage (±10 V) |
4 |
16-bit, 100 kS/s per ch, simultaneous | |
| Medium Current (0 - 20 mA) |
4 |
16-bit, 100 kS/s per ch, simultaneous, ±36 V protection, open-loop detection | ||
| Controller Area Network (CAN) | Low-Speed CAN |
2 |
2-port, low-speed CAN, 125 kbits/s max transfer rate, ISO 11519 compliant, 11- and 29-bit arbitration IDs | |
| High-Speed CAN |
2 |
Transmit/receive 100% bus load at 1 Mbits/s, Philips SJA1000 CAN controller | ||
| Motion | H-Bridge Motion Drive (Brushed-DC Servo Motor) |
1 |
1-axis, 30 V, 1 A continuous at 70 ºC, 7.3 A continuous at <40 ºC, 12 A peak, built-in encoder interface and current sensor | |
| Digital Input | Bidirectional 5 V TTL |
8 |
100 ns, 5 V TTL, ultrahigh-speed, bidirectional, 30 V protection | |
| 24 V Sinking |
8 |
100 µs, up to 30 V, 40 V protection connectivity | ||
|
8 |
100 µs, up to 60 V, 250 V channel-to-channel isolation |
|||
|
8 |
1 µs, high-speed, up to 30 V, 35 V protection |
|||
|
32 |
7 µs, up to 30 V (60 V for 8 channels), 60 V protection |
|||
| 250 AC/DC universal |
4 |
3 ms, ±5 to 250 VDC, 10 to 250 VAC, universal, sink/source | ||
| Differential or TTL |
6 |
500 ns, ±5 to 24 V, single-ended TTL or differential, regulated 5 V supply output | ||
| Digital Output | Bidirectional 5 V TTL |
8 |
100 ns, 5 V TTL, ultrahigh-speed, bidirectional, 30 V protection | |
| 24 V Sourcing |
8 |
100 µs, 6 to 30 V, 750 mA max per ch, 30 V protection, short-circuit-proof | ||
|
8 |
1 µs, high-speed, 5 to 30 V, 1 A max per ch, 30 V protection, short-circuit-proof |
|||
|
32 |
500 µs, 6 to 36 V, 40 V protection, short-circuit-proof |
|||
| 24 V Sinking |
32 |
8 µs, 5 to 60 V, sinking, isolation, up to 20 A per module | ||
| Relay Output | Form A (SPST) |
4 |
1 s, 30 VDC (2 A), 60 VDC (1 A), 250 VAC (2 A) electromechanical form A (SPST) | |
| Solid State Relay |
8 |
60 VDC, SSR form A, up to 750 mA per ch, 5 ms set and reset time, ch-to-ch isolation | ||
| Counter, Pulse Generation | Counter/timer (24 V) |
8 |
1 µs, high-speed, up to 30 V, 35 V protection | |
|
32 |
7 µs, up to 30 V (60 V for 8 channels), 60 V protection |
|||
| Counter/timer (TTL) |
8 |
100 ns, 5 V TTL, ultrahigh-speed, bidirectional, 30 V protection | ||
|
6 |
500 ns, ±5 to 24 V, single-ended TTL or differential, regulated 5 V supply output |
|||
| Quadrature encoder (differential) |
2 |
500 ns, ±5 to 24 V, six digital inputs for two encoders (phase A, phase B, and index inputs) | ||
| PWM/Pulse Generation (24 V) |
8 |
100 µs, 6 to 30 V logic, 750 mA max per ch, 30 V protection, short-circuit-proof | ||
|
8 |
1 µs, high-speed, 5 to 30 V logic, 1 A max per ch, 30 V protection, short-circuit-proof |
|||
|
32 |
500 µs, 6 to 36 V, 40 V protection, short-circuit-proof |
|||
|
32 |
8 µs, 5 to 60 V, sinking, isolation, up to 20 A per module |
|||
| PWM/Pulse Generation (TTL) |
8 |
100 ns, 5 V TTL, ultrahigh-speed, bidirectional, 30 V protection | ||
| Removable Storage | Secure Digital Card Module |
2 |
2-slot, up to 4 GB added storage, read/write at 2 MB/S. |
|
| Serial Interface |
RS232 |
4 |
Up to 921.6 Kbaud, 64-byte FIFOs per port | |
| RS485 |
4 |
Up to 1.843 Mbaud, 64-byte FIFOs per port | ||
| Your Custom I/O Module(s) | Specialized I/O |
N/A |
The NI cRIO-9951 Module Development Kit includes the tools needed to build custom I/O modules for application specific needs |
View connector blocks and accessories for C Series modules.
3. Step 3: Choose Your Development Software
The NI Developer Suite Core Package with the Real-Time and FPGA Deployment Options features all of the tools you need for building a custom embedded system with NI Single-Board RIO, including NI LabVIEW FPGA for customizing hardware I/O in the user-configurable FPGA core and LabVIEW Real-Time for building deterministic and reliable real-time applications. The NI Developer Suite Core Package with the Real-Time and FPGA Deployment Options also includes a comprehensive set of LabVIEW add-on tools for algorithm development, real-time development analysis, Microsoft Office report generation, and database communication.
