Tiny, Low-Power LabVIEW Embedded Deployment Platform from Boston Engineering

1. Hardware Description 

The Boston Engineering FlexStack is a modular, stackable platform featuring an Analog Devices Blackfin Processor and various I/O options including analog input channels to 65 MHz, digital I/O, counter/timer I/O, SD card storage, and an RFID reader. It supports several wired and wireless communications protocols including Bluetooth, RS232, USB, and Ethernet. You also can choose between battery pack (AA) or AC power.

Figure 1. Boston Engineering FlexStack

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2. Software Development

By applying graphical system design concepts, you can program the FlexStack using the LabVIEW Embedded Module for Blackfin Processors. This high-level graphical programming language is ideal for engineers and scientists who wish to focus on application development rather than low-level constructs and resource management. National Instruments LabVIEW graphical programming has become a standard for rapid embedded system development by providing development tools, drivers, and hardware support. Boston Engineering offers LabVIEW drivers for each of its I/O options as well, so you can easily incorporate analog, digital, and communications data into your embedded application.

Figure 2. LabVIEW Embedded Module for Blackfin Processors

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3. Hardware Specifications

Figure 3. Block Diagram of a FlexStack CPU Card

Processor Module

• 16, 32, 64, or 128 MB RAM
  
• 4 MB Flash
• Serial/JTAG programming and debugging
• Connection for external parallel or I²C display
• 4 user-programmable LEDs
• Real-time clock
• RS232 interface
• Flexible boot-up mode

Multifunction I/O Module

Analog Input

• 8 SE/4 DIFF voltage inputs
• 14-bit ADC resolution
• ±2.5 V range (DIFF), 0 to 5 V (SE)
• Up to 10 kS/s scan rate
• 2,000-sample FIFO
   

Analog Output

• 2 voltage outputs
• 5 V range
• 12-bit DAC resolution
   

Digital I/O

• 16 lines
• 3.3 V CMOS

Bluetooth Communications Module

• Class 2, 2.4 GHz
• SPP, DUN, LAN, Headset, Audio Gateway, FTP Client, OBEX, OPP – Push/Pull, GAP, SDP, RFCOMM, and L2CAP profiles
• Internal, external antennae
• Standard 2-port communication module
• RS232 2-port COM board or USB client
  
• RS485
• Ethernet

RFID Module

• 12.56 MHz reader
  
• 26 kb/s ISO 15693
• 106 kb/s ISO 14443A

High-Speed Analog Input Module

• 2 differential channels
• 12-bit resolution
• ±5 V, 0 to 10 V (battery may change)
• 20, 40, and 65 MHz scan rates
• FPGA signal processing

Experimental/Breakout Module

• Breakout of all bus signals - SPI, SPORT, I² C (TWI), and so on

Power Module

• Input: 9 to 24 V, 500 mA; NiMH 7 VDC
• Output: 3.3 V, 5 V power to bus
• AC power or rechargeable NiMH (AA battery pack)
• Power consumption benchmarks

Power + Processor Module

• Bluetooth module: 60 mA transmitting, 30 mA receiving
• Processor power-down mode
• Full stack in power-down mode

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4. Additional Resources

Read More about the NI LabVIEW Embedded Module for ADI Blackfin Processors

Inquire about Boston Engineering FlexStack Hardware