NI Multisim 3D Environment

Publish Date: Nov 21, 2017 | 37 Ratings | 4.54 out of 5 | Print


The breadboarding feature provides a technical aid for educators who wish to illustrate breadboarding as a means of prototyping circuit designs. It also gives students exposure to the breadboarding process and shows in 3D what the resulting breadboard looks like when completed.

This article features an overview of the Multisim 3D environment and references a PowerPoint presentation for download as well as a multimedia resource to learn more about how you can use this feature to bridge the gap between simulation and prototyping.

Introduction to the Multisim 3D Environment

Help students ease into hardware prototyping with the NI Multisim 3D breadboarding environment. You can choose from three different 3D environments: common breadboard, the NI Educational Laboratory Virtual Instrumentation Suite (NI ELVIS I), and NI ELVIS II.

Students can use these environments to prototype the circuits they have captured and explored through simulation, VIs, and analyses in a risk-free virtual environment before they attend their hardware labs. 

This helps them see how components look in real life and learn how a breadboard works. Students can interact with the environment by zooming in and out and panning. 

The breadboarding environment also provides guidance on where to make connections and helps students check their final breadboards with the schematics they have captured using the Design Rules and Connectivity Check.

Download the following PowerPoint presentation featuring an NI ELVIS II 3D environment example for information on how to use the 3D environment. For additional resources, refer to the user manual.


See a demo of the Multisim 3D breadboarding environment with this webcast»

Download a PowerPoint presentation on how to use the Multisim/NI ELVIS II 3D environment»

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