Electronics engineers must develop performance- and cost-optimized systems in less time. When building or buying a test system, the best solutions scale to meet escalating requirements while shortening time to market and driving down costs.
NI Expertise Overview
Smart devices are creating an inflection point in automated test for both the test managers and engineers challenged with ensuring the quality of these devices at increasingly lower costs, and for the vendors who serve them. To test their smart devices, organizations are transitioning from the status quo of rack-and-stack box instruments and closed-architecture automated test equipment (ATE) systems to smarter test systems that scale with escalating requirements to continually shorten time to market and drive down cost.
NI’s approach to automated test empowers smarter test systems. With a platform built from the ground up for customization—either through the latest commercial technology or through your domain knowledge—you become part of a living, breathing, and evolving ecosystem that’s already responsible for creating innovative approaches to automated test across every industry.
Engineers have made the switch to PXI to realize faster test execution times, improved software development productivity, faster throughput, and increased scalability, which dramatically reduce their overall system costs.
The PXI Digital Pattern Instrument is designed for semiconductor characterization and production test. It includes the Digital Pattern Editor for configuring pin maps, specifications, levels, timing, and patterns.
National Instruments delivers a flexible, modular switching solution based on PXI to help you maximize equipment reuse, test throughput, and system scalability.
The NI Alliance Partner Network
The Alliance Partner Network includes more than 950 companies that specialize in complete solutions. From products and systems to integration, consulting, and training services, NI Alliance Partners are uniquely equipped and skilled to help solve some of the toughest engineering challenges.