Table Of Contents

Specifications

Version:
    Last Modified: May 11, 2017

    This document lists specifications for the NI-5791 adapter module. Pair these specifications with the specifications listed in your FlexRIO FPGA module specifications document or your Controller for FlexRIO specifications document. Specifications are warranted by design and under the following conditions unless otherwise noted.

    • Chassis fan speed is set to High. In addition, NI recommends using slot blockers and EMC filler panels in empty module slots to minimize temperature drift.
    • The NI-5791 uses NI LabVIEW and LabVIEW FPGA software.

    National Instruments RF devices are capable of acquiring and/or generating signals within common Medical Implantable Communication System (MICS) frequency bands. NI RF devices are tested and verified in manufacturing for several measurements. For more information about RF device applications, contact a National Instruments branch office.

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    Caution  

    To avoid permanent damage to the NI-5791, disconnect all signals connected to the NI-5791 before powering down the module, and only connect signals after the module has been powered on by the FlexRIO FPGA module or the Controller for FlexRIO.

    Specifications are subject to change without notice. For the most recent device specifications, visit ni.com/manuals.

    Definitions

    Warranted specifications describe the performance of a model under stated operating conditions and are covered by the model warranty.

    Characteristics describe values that are relevant to the use of the model under stated operating conditions but are not covered by the model warranty.

    • Typical specifications describe the expected performance met by a majority of the models.
    • Nominal specifications describe parameters and attributes that may be useful in operation.

    Specifications are Typical unless otherwise noted.

    RX IN

    Amplitude Range

    RX input attenuation

    0 dB to 63.5 dB in 0.25 dB steps, 6 µs switch time

    Absolute Amplitude Accuracy

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    Note  

    All values are typical.

    Table 1. Absolute Amplitude Accuracy
    Center Frequency Absolute Amplitude Accuracy, Temperature 23 °C ±5 °C (dB)
    >200 MHz to 1 GHz 0.55
    >1 GHz to 2 GHz 0.55
    >2 GHz to 3 GHz 0.65
    >3 GHz to 3.9 GHz 1.3
    >3.9 GHz to 4.4 GHz 1.5
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    Note  

    Absolute amplitude accuracy uses a correction coefficient in EEPROM to improve performance. Performance is verified over the first 45 dB of RX attenuation.

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    Note  

    Correction coefficients in EEPROM are valid only when the baseband amplifier is in the signal path.

    Noise Density

    Table 2. Noise Density
    Center Frequency Average Noise Level (dBm/Hz), Temperature 23 °C ± 5 °C
    >200 MHz to 1 GHz -163
    >1 GHz to 2 GHz -163
    >2 GHz to 3 GHz -162
    >3 GHz to 3.5 GHz -160
    >3.5 GHz to 3.9 GHz -158
    >3.9 GHz to 4.4 GHz -148
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    Note  

    Performance is measured with an input reference level of -48 dBm and with 0 dB of RX attenuation.

    Figure 1. Noise Density
    Table 3. Gain Compression (Nominal)
    Frequency Gain Compression, Temperature 23 °C ± 5 °C (dBm)
    >200 MHz to 1 GHz -20
    >1 GHz to 2 GHz -18
    >2 GHz to 3.9 GHz -15
    >3.9 GHz to 4.4 GHz -12
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    Note  

    Values are based on stimulus of two input tones spaced 100 MHz apart, with 0 dB of RX attenuation on the receive path and with one tone placed out of band.

    Voltage Standing Wave Ratio (VSWR)

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    Note  

    All values are nominal.

    Input impedance

    50 Ω

    Input VSWR with 10 dB of RX attenuation

    <1.3 GHz

    1.5:1

    1.3 GHz < f < 3 GHz

    1.1:1

    >3 GHz

    1.9:1

    Spurious Responses

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    Note  

    All responses are typical.

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    Note  

    Performance is measured with 0 dB of RX attenuation and a 1.5 kHz resolution bandwidth (RBW).

    RX LO Residual Power

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    Note  

    All values are nominal.

    Table 4. Receiver LO Residual Power
    Center Frequency Residual Power, Temperature 23 °C ± 5 °C (dBFS)
    >200 MHz to 300 MHz -38
    300 MHz to 1 GHz -42
    >1 GHz to 2 GHz -52
    >2 GHz to 3 GHz -52
    >3 GHz to 3.9 GHz -52
    >3.9 GHz to 4.4 GHz -52
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    Note  

    Receiver LO suppression is measured at the same RX attenuation after an I/Q correction.

    RX Sideband Image Suppression

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    Note  

    All values are nominal.

    Table 5. Sideband Image Suppression
    Center Frequency Temperature 23 °C ± 5 °C (dBc)
    >200 MHz to 300 MHz -34
    300 MHz to 1 GHz -39
    >1 GHz to 2 GHz -58
    >2 GHz to 3 GHz -54
    >3 GHz to 3.9 GHz -45
    >3.9 GHz to 4.4 GHz -35
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    Note  

    The image suppression specifications hold at the center frequency of the acquired instantaneous bandwidth after the device performs a single recent point I/Q impairment self-correction.

    RX Third Order Intermodulation Distortion (IP3)

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    Note  

    All values are nominal.

    Table 6. RX IP 3
    Frequency Temperature 23 °C ± 5 °C (dBm)
    >200 MHz to 1 GHz -2
    >1 GHz to 2 GHz -1
    >2 GHz to 3 GHz 0
    >3 GHz to 3.9 GHz 1
    >3.9 GHz to 4.4 GHz 1
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    Note  

    Values are based on two input tones spaced 1 MHz apart such that the tones are 6 dB less than full-scale with 0 dB of RX attenuation.

    Dynamic Range

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    Note  

    All values are nominal.

    Table 7. Dynamic Range at 900 MHz
    Reference Level (dBm) IP3 (dBm) Noise Floor (dBm/Hz) Dynamic Range (dB)
    5 24 -135 106
    -5 14 -145 106
    -15 4 -155 106
    -25 0 -163 109
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    Note  

    The signal level of each tone is set to 6 dB less than the reference level to prevent overload. Dynamic range = 2/3 × (IMD3Noise Floor)

    Table 8. Dynamic Range at 2,400 MHz
    Reference Level (dBm) IP3 (dBm) Noise Floor (dBm/Hz) Dynamic Range (dB)
    5 22 -135 105
    -5 12 -145 105
    -15 3 -155 105
    -25 1 -163 109
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    Note  

    The signal level of each tone is set to 6 dB less than the reference level to prevent overload. Dynamic range = 2/3 × (IP3 – Noise Floor)

    LO OUT Front Panel Connector

    Frequency range

    200 MHz to 4.4 GHz

    Frequency resolution

    1,000 kHz

    Output power

    <2.4 GHz

    0 dBm ± 3 dB, nominal

    ≥2.4 GHz

    -3 dBm ± 3 dB, nominal

    Output impedance

    50 Ω, nominal

    Output VSWR

    1.78:1

    Amplitude settling time

    <0.25 dB in <10 ms, typical

    Maximum DC voltage

    ±0.5 VDC

    Figure 2. LO Output Power
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    Note  

    For frequencies above 2.8 GHz, the gain is <0 dB. The NI 5791 can daisy chain up to eight channels of adapter modules below 2.8 GHz without external amplification. For frequencies above 2.8 GHz, NI recommends using external LO distribution amplifiers if more than two adapter modules share LOs.

    CLK IN Front Panel Connector

    Frequency

    Reference Clock

    10 MHz

    Sample Clock

    130 MHz

    Amplitude

    Square

    0.7 Vpk-pk to 5.0 Vpk-pk into 50  Ω, typical

    Sine

    1.4 Vpk-pk to 5.0 Vpk-pk (1 VRMS to 3.5 VRMS) into 50 Ω, typical

    Input impedance

    50 Ω, nominal

    Coupling

    AC

    CLK OUT Front Panel Connector

    Interface standard

    3.3 V LVCMOS

    Interface logic

    Maximum VOL

    0.55 V

    Minimum VOH

    2.7 V

    Maximum VOH

    3.6 V

    Output impedance

    50 Ω ±20%

    Coupling

    DC

    Iout (DC)

    ±32 mA

    LO IN Front Panel Connector

    Frequency range

    200 MHz to 4.4 GHz

    Input power

    <2.4 GHz

    3 dBm ± 3 dB, nominal

    ≥2.4 GHz

    0 dBm ± 3 dB, nominal

    Input impedance

    50 Ω

    Input VSWR

    1.78:1

    Absolute maximum power

    +15 dBm

    Maximum DC power

    ±0.5 VDC

    TX OUT Front Panel Connector

    Amplitude Characteristics

    Power range

    Output

    Noise floor to +8 dBm, nominal

    Output resolution

    0.25 dB, nominal

    Amplitude settling time

    <0.5 dB within 1 ms, nominal

    Absolute Amplitude Accuracy

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    Note  

    All values are typical.

    Table 9. Absolute Amplitude Accuracy
    Frequency Temperature 23 °C ±5 °C (dB)
    >200 MHz to 1 GHz 0.8
    1 GHz to 2 GHz 1.3
    2 GHz to 3 GHz 1.3
    3 GHz to 4.4 GHz 1.8
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    Note  

    Absolute amplitude accuracy uses a correction coefficient in EEPROM to improve performance. The TX amplitude accuracy applies to the output power level from -12 dBm to -4 dBm.

    Figure 3. TX Output Power

    Noise Density

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    Note  

    All values are typical.

    Table 10. Noise Density
    Frequency Temperature 23 °C ±5 °C (dBm/Hz)
    >200 MHz to 1 GHz -138
    >1 GHz to 2 GHz -138
    >2 GHz to 3 GHz -130
    >3 GHz to 4.4 GHz -130
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    Note  

    Performance is measured with 0 dB of TX attenuation.

    Output Voltage Standing Wave Ratio (VSWR)

    <2.0 GHz

    1.6:1

    ≥2.0 GHz and <3.0 GHz

    1.4:1

    ≥3.0 GHz

    1.7:1

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    Note  

    The VSWR is measured with 10 dB of TX attenuation.

    TX OUT Spurious Responses

    Third Order Intermodulation (IP3)

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    Note  

    All values are typical.

    Table 11. IP 3
    Frequency Temperature 23 °C ± 5 °C (dBm)
    >200 MHz to 1 GHz 19
    >1 GHz to 2 GHz 17
    >2 GHz to 3 GHz 13
    >3 GHz to 3.9 GHz 11
    >3.9 GHz to 4.4 GHz 8
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    Note  

    Values are based on two input tones spaced 1.3 MHz apart with 5 dB of TX attenuation.

    Second Order Intermodulation (IP2)

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    Note  

    All values are typical.

    Table 12. IP 2
    Frequency Temperature 23 °C ±5 °C (dBm)
    >200 MHz to 1 GHz 25
    >1 GHz to 2 GHz 25
    >2 GHz to 3 GHz 25
    >3 GHz to 4.4 GHz 35
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    Note  

    Values are based on two input tones spaced 1.3 MHz apart with 5 dB of TX attenuation.

    TX Sideband Image Suppression

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    Note  

    All values are nominal.

    Table 13. Image Suppression
    Frequency Temperature 23 °C ±5 °C (dBc)
    >200 MHz to 1 GHz -50
    >1 GHz to 2 GHz -50
    >2 GHz to 3 GHz -50
    >3 GHz to 4.4 GHz -45
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    Note  

    The image suppression specifications hold at the center frequency of the transmitted instantaneous bandwidth after the device performs a recent single point I/Q impairment self-correction.

    TX LO Residual Power

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    Note  

    All values are typical.

    Table 14. TX LO Residual Power
    Frequency Temperature 23 °C ±5 °C (dBm)
    >200 MHz to 1 GHz -48
    >1 GHz to 2 GHz -48
    >2 GHz to 3 GHz -48
    >3 GHz to 4.4 GHz -45
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    Note  

    This specification holds at the center frequency of the transmitted instantaneous bandwidth, 100 MHz maximum after the device performs a recent single point I/Q impairment self-correction. The measurement is performed with 0 dB of TX attenuation.

    RX IN and TX OUT Frequency Characteristics

    Frequency range

    200 MHz to 4.4 GHz

    Instantaneous bandwidth

    100 MHz

    Tuning resolution[1]

    <250 kHz

    LO step size[2]

    Integer mode

    4 MHz, 6 MHz, 12 MHz, 24 MHz step sizes

    Fractional mode

    100 kHz step size

    Frequency Settling Time

    Settling time[3]

    <100 µs per 50 MHz step

    Phase Noise (Nominal)

    Table 15. Phase Noise at 2.4 GHz
    Offset Frequency Phase Noise (dBc/Hz)
    1 kHz -90
    10 kHz -94
    100 kHz -104
    1 MHz -130
    10 MHz -140
    Figure 4. Phase Noise (900 MHz, 2.4 GHz, 4.4 GHz)

    Baseband Characteristics

    ADC (TI ADS4246)[4]

    Resolution

    14 bits

    Data rate

    130 MS/s[5]

    Samples per cycle

    1

    DAC (TI DAC3482)

    Resolution

    16 bits

    Data rate

    130 MS/s (automatically interpolated to 520 MS/s)

    Samples per cycle

    1

    Dimensions and Weight

    Dimensions

    12.9 × 2.0 × 12.1 cm (5.1 × 0.8 × 4.7 in)

    Weight

    413 g (14.6 oz)

    I/O

    RX in, RX out, LO in, LO out, 10 MHz, 10 MHz out

    Power

    6 W, nominal, with one LO turned on

    AUX I/O Connector

    Table 16. NI-5791 AUX I/O Connector Pin Assignments
    AUX I/O Connector Pin Signal Signal Description
    1 DIO Port 0 (0) Bidirectional single-ended (SE) digital I/O (DIO) data channel.
    2 GND Ground reference for signals.
    3 DIO Port 0 (1) Bidirectional SE DIO data channel.
    4 DIO Port 0 (2) Bidirectional SE DIO data channel.
    5 GND Ground reference for signals.
    6 DIO Port 0 (3) Bidirectional SE DIO data channel.
    7 DIO Port 1 (0) Bidirectional SE DIO data channel.
    8 GND Ground reference for signals.
    9 DIO Port 1 (1) Bidirectional SE DIO data channel.
    10 DIO Port 1 (2) Bidirectional SE DIO data channel.
    11 GND Ground reference for signals.
    12 DIO Port 1 (3) Bidirectional SE DIO data channel.
    13 PFI 0 Bidirectional SE DIO data channel.
    14 NC No connect.
    15 PFI 1 Bidirectional SE DIO data channel.
    16 PFI 2 Bidirectional SE DIO data channel.
    17 GND Ground reference for signals.
    18 +5 V +5 V power (10 mA maximum).
    19 PFI 3 Bidirectional SE DIO data channel.
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    Caution  

    The AUX I/O connector accepts a standard, third-party HDMI cable, but the AUX I/O port is not an HDMI interface. Do not connect the AUX I/O port on the NI-5791 to the HDMI port of another device. NI is not liable for any damage resulting from such signal connections.

    AUX I/O (Port 0 DIO <0..3>, Port 1 DIO <0..3>, and PFI <0..3>)

    General Characteristics

    Number of channels

    12 bidirectional (8 DIO and 4 PFI)

    Connector type

    HDMI

    Interface standard

    3.3 LVCMOS

    Interface logic

    Maximum VIL

    0.8 V

    Minimum VIH

    2.0 V

    Maximum VOL

    0.4 V

    Minimum VOH

    2.7 V

    Maximum VOH

    3.6 V

    ZOUT

    50 Ω ± 20%

    IOUT (DC)

    ±2 mA

    Pull-down resistor

    150 kΩ

    Recommended operating voltage

    -0.3 V to 3.6 V

    Overvoltage protection

    ±10 V

    Maximum toggle frequency

    6.6 MHz

    +5 V maximum power

    10 mA

    +5 V voltage tolerance

    4.2 V to 5 V

    Environment

    Maximum altitude

    2,000 m (800 mbar) (at 25 °C ambient temperature)

    Pollution Degree

    2

    Indoor use only.

    Operating Environment

    Ambient temperature range

    0 °C to 55 °C (Tested in accordance with IEC 60068-2-1 and IEC 60068-2-2. Meets MIL-PRF-28800F Class 3 low temperature limit and MIL-PRF-28800F Class 2 high temperature limit.)

    Relative humidity range

    10% to 90%, noncondensing (Tested in accordance with IEC 60068-2-56.)

    Storage Environment

    Ambient temperature range

    -20 °C to 70 °C (Tested in accordance with IEC 60068-2-1 and IEC 60068-2-2. Meets MIL-PRF-28800F Class 3 limits.)

    Relative humidity range

    5% to 95%, noncondensing (Tested in accordance with IEC 60068-2-56.)

    Shock and Vibration

    Operating shock

    30 g peak, half-sine, 11 ms pulse (Tested in accordance with IEC 60068-2-27. Meets MIL-PRF-28800F Class 2 limits.)

    Random vibration

    Operating

    5 Hz to 500 Hz, 0.3 grms (Tested in accordance with IEC 60068-2-64.)

    Nonoperating

    5 Hz to 500 Hz, 2.4 grms (Tested in accordance with IEC 60068-2-64. Test profile exceeds the requirements of MIL-PRF-28800F, Class 3.)

    Compliance and Certifications

    Safety

    This product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:

    • IEC 61010-1, EN 61010-1
    • UL 61010-1, CSA C22.2 No. 61010-1
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    Note  

    For UL and other safety certifications, refer to the product label or the Online Product Certification section.

    Electromagnetic Compatibility

    This product meets the requirements of the following EMC standards for electrical equipment for measurement, control, and laboratory use:
    • EN 61326-1 (IEC 61326-1): Class A emissions; Basic immunity
    • EN 55011 (CISPR 11): Group 1, Class A emissions
    • EN 55022 (CISPR 22): Class A emissions
    • EN 55024 (CISPR 24): Immunity
    • AS/NZS CISPR 11: Group 1, Class A emissions
    • AS/NZS CISPR 22: Class A emissions
    • FCC 47 CFR Part 15B: Class A emissions
    • ICES-001: Class A emissions
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    Note  

    In the United States (per FCC 47 CFR), Class A equipment is intended for use in commercial, light-industrial, and heavy-industrial locations. In Europe, Canada, Australia, and New Zealand (per CISPR 11), Class A equipment is intended for use only in heavy-industrial locations.

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    Note  

    Group 1 equipment (per CISPR 11) is any industrial, scientific, or medical equipment that does not intentionally generate radio frequency energy for the treatment of material or inspection/analysis purposes.

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    Note  

    For EMC declarations, certifications, and additional information, refer to the Online Product Certification section.

    CE Compliance

    This product meets the essential requirements of applicable European Directives, as follows:

    • 2014/35/EU; Low-Voltage Directive (safety)
    • 2014/30/EU; Electromagnetic Compatibility Directive (EMC)

    Online Product Certification

    Refer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for this product, visit ni.com/certification, search by model number or product line, and click the appropriate link in the Certification column.

    Environmental Management

    NI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.

    For additional environmental information, refer to the Minimize Our Environmental Impact web page at ni.com/environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.

    Waste Electrical and Electronic Equipment (WEEE)

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    EU Customers  

    At the end of the product life cycle, all NI products must be disposed of according to local laws and regulations. For more information about how to recycle NI products in your region, visit ni.com/environment/weee.

    电子信息产品污染控制管理办法(中国RoHS)

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    中国客户  

    National Instruments符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。关于National Instruments中国RoHS合规性信息,请登录 ni.com/environment/rohs_china。(For information about China RoHS compliance, go to ni.com/environment/rohs_china.)

    Worldwide Support and Services

    The NI website is your complete resource for technical support. At ni.com/support, you have access to everything from troubleshooting and application development self-help resources to email and phone assistance from NI Application Engineers.

    Visit ni.com/services for NI Factory Installation Services, repairs, extended warranty, and other services.

    Visit ni.com/register to register your NI product. Product registration facilitates technical support and ensures that you receive important information updates from NI.

    A Declaration of Conformity (DoC) is our claim of compliance with the Council of the European Communities using the manufacturer’s declaration of conformity. This system affords the user protection for electromagnetic compatibility (EMC) and product safety. You can obtain the DoC for your product by visiting ni.com/certification. If your product supports calibration, you can obtain the calibration certificate for your product at ni.com/calibration.

    NI corporate headquarters is located at 11500 North Mopac Expressway, Austin, Texas, 78759-3504. NI also has offices located around the world. For telephone support in the United States, create your service request at ni.com/support or dial 1 866 ASK MYNI (275 6964). For telephone support outside the United States, visit the Worldwide Offices section of ni.com/niglobal to access the branch office websites, which provide up-to-date contact information, support phone numbers, email addresses, and current events.

    • 1 Tuning resolution combines LO step size capability and frequency shift DSP implemented on the FPGA.
    • 2 Enable fractional mode and use a 100 kHz LO step size with all LO step size specifications.
    • 3 This settling time specification only includes frequency settling time, and it excludes any residual amplitude settling that may occur as a result of large frequency changes. Driver and operating system timing can affect transition times. This specification reflects only hardware settling.
    • 4 ADCs and DACs are dual-channel components with each channel assigned to I and Q, respectively.
    • 5 Use the Fractional Interpolation and Decimation DSP blocks implemented in the LabVIEW FPGA target to decimate and interpolate the data.

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