Table Of Contents

PXIe-6674T Specifications

Version:
    Last Modified: January 25, 2018

    This section lists the system specifications for PXIe-6674T modules. These specifications are typical at 25 °C, unless otherwise stated.

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    Caution  

    Specifications are subject to change without notice.

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    Note  

    Some specifications are specific to earlier revisions of the PXIe-6674T module. A label with revision information can be found on the module board as shown in the PXIe-6674T Revision Label figure below.

    x denotes all letter revisions of the assembly. Ensure the specifications of interest match the revision that is printed on the label.

    Figure 1. PXIe-6674T Revision Label

    Definitions

    Warranted specifications describe the performance of a model under stated operating conditions and are covered by the model warranty.

    The following characteristic specifications describe values that are relevant to the use of the model under stated operating conditions but are not covered by the model warranty.

    • Typical specifications describe the performance met by a majority of models.
    • Nominal specifications describe an attribute that is based on design, conformance testing, or supplemental testing.

    Specifications are Typical unless otherwise noted.

    PXIe-6674T Specifications Conditions

    Specifications are valid at 25 °C unless otherwise noted.

    Safety Guidelines

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    Caution  

    This icon denotes a caution, which advises you to consult documentation where this symbol is marked.

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    Caution  

    Do not operate the PXIe-6674T in a manner not specified in this document. Product misuse can result in a hazard. You can compromise the safety protection built into the product if the product is damaged in any way. If the product is damaged, return it to NI for repair.

    spd-note-caution
    Caution  

    You can impair the protection provided by the PXIe-6674T if you use it in a manner not described in this document.

    CLKIN Characteristics

    Input coupling

    AC

    Input impedance

    50 Ω, nominal

    Setting Attenuation Setting On Attenuation Setting Off
    Attenuation Setting On (default) Off
    Attenuation Behavior 5:1 1:1
    Minimum Input Swing with 50% Duty Cycle[1] 750 mVpp 150 mVpp
    Maximum Input Swing with 50% Duty Cycle[2] 5.0 Vpp 1.2 Vpp
    Absolute Maximum Input Powered On[3] 5.6 Vpp 2.8 Vpp
    Absolute Maximum Input Powered Off [4] 1.5 Vpp
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    Note  

    Input can be either square wave or sinusoidal.

    Figure 2. Maximum and Minimum Input Swing with Attenuation On
    Figure 3. Maximum and Minimum Input Swing With Attenuation Off

    Minimum Frequency

    1 MHz[5]

    Maximum Frequency

    To Clk10PLL

    100 MHz

    To FPGA

    200 MHz

    To PXIe-DStarA

    1 GHz

    ClkIn to PXI_Clk10_In Delay (PLL not used)

    Typical at 25 °C

    6.75 ns

    Maximum over temperature

    14.8 ns

    OCXO

    Nominal Frequency

    10 MHz

    Accuracy within 1 year of calibration adjustment within 0 °C to 55 °C operating temperature range [6]

    ± 80 ppb

    Long-term stability

    ±50 ppb/year

    Stability vs temperature

    <10 ppb peak-to-peak within 0 °C to 55 °C operating temperature range

    Tuning Range

    ±1.5 ppm minimum, ±2 ppm typical, ±4 ppm maximum

    Tuning DAC Resolution

    16 bits, 0.0625 ppb per step typical

    Recommended calibration interval

    1 year

    Table 1. Maximum Phase Noise of the OCXO
    Offset Phase Noise
    1 Hz -80 dBc/Hz
    10 Hz -120 dBc/Hz
    100 Hz -140 dBc/Hz
    1 kHz -145 dBc/Hz
    10 kHz -150 dBc/Hz

    The following figure shows the phase noise on a representative module. OCXO is routed to the ClkOut SMA, measured in a PXIe-1082 chassis with low fan speed[7]. The integrated jitter from 10 Hz to 1 MHz is 507 fs rms

    .
    Figure 4. Phase Noise on a Representative Module with OCXO Routed to ClkOut SMA

    The following figure shows the phase noise on a representative module of PXI_CLK10 when OCXO is routed to PXI_CLK10_IN,[8] measured in a PXIe-1082 chassis with low fan speed:

    Figure 5. Phase Noise on a Representative Module of PXI_CLK10 when OCXO is routed to PXI_CLK10_IN

    10MHz PLL

    Reference Frequency Range (from ClkIn)

    1 MHz to 100 MHz, in increments of 1 MHz

    Recommended ClkIn Frequency[9]

    10 MHz

    Reference Frequency Required Accuracy

    ± 1.5 ppm

    Reference Frequency Duty Cycle

    40% to 60%

    PLL Loop Bandwidth

    100 Hz

    Maximum PXI_CLK10 Phase Offset

    +/- 1 ns

    The following figure shows the phase noise on a representative module of PXI_CLK10 when CLKIN is routed to PXI_CLK10_IN with and without the 10 MHz PLL, measured in a PXIe-1082 chassis with low fan speed.[10]

    Figure 6. Phase Noise on a Representative Module of PXI_CLK10 with CLKIN Routing to PXI_CLK10_IN

    ClkOut

    Low Speed ClkOut High Speed ClkOut
    Coupling AC Coupled AC Coupled
    Expected Termination 50 Ω or high impedance 50 Ω
    Frequency Range 1 MHz to 50 MHz[11] 1 MHz to 1 GHz[12]
    Typical Amplitude 2.57 Vpp into 50 Ω, 5 Vpp into high Z 800 mVpp
    Rising/Falling Edge (20%, 80%) 270 ps, typical 180 ps, typical
    Duty Cycle of output with Clock Generation as source 45% to 55% 45% to 55%
    Available Sources PXI_CLK10, 10 MHz OCXO, Clock Generation up to 50 MHz Clock Generation, PXIe-DStarA Network[13]
    PXI_CLK10 to ClkOut Delay

    Typical at 25 °C

    20.2 ns

    Maximum over temperature

    47.75 ns

    The following figure shows the typical Low Speed ClkOut Amplitude performance, with a sample size of 19 modules.

    Figure 7. Typical Low Speed ClkOut Amplitude Performance

    The following figure shows the typical High Speed ClkOut Amplitude performance, with a sample size of 19 modules.

    Figure 8. Typical High Speed ClkOut Amplitude Performance

    Clock Generation

    Reference Frequency Source[14]

    PXIe_Clk100

    Base Frequency Resolution (150 MHz to 300 MHz)

    2.84217 μHz[15]

    Minimum Generated Frequency[16]

    With FPGA divider

    0.2794 Hz

    Without FPGA divider

    4.6875 MHz

    Maximum Generated Frequency

    1 GHz[17]

    Clock Generation Phase Noise Performance

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    Note  

    All phase noise measurements were made on a Representative Module of various clock generation frequencies routed to ClkOut. All measurements made in an PXIe-1062 chassis with low fan speed and OCXO connected to PXI_Clk10_IN.

    The phase noise performance of the clock generation circuitry varies depending on what elements are used to generate the requested frequency. To generate frequencies above 300 MHz, a PLL is used to multiply the DDS frequency up which results in increased phase noise versus when the DDS is used directly (all frequencies below 300 MHz).

    Figure 9. Phase Noise Performance

    The following figure shows the phase noise of various frequencies coming from the multiplying PLL.

    Figure 10. Phase Noise of Frequencies From the Multiplying PLL

    At 50 MHz, NI-Sync software will automatically switch between the high speed and low speed ClkOut drivers[18]. The phase noise performance of these two drivers differs, as shown in the following figure:

    Figure 11. Phase Noise of Frequencies from DDS

    PXIe-DStarA

    Figure 12. PXIe-DStarA Topology

    PXIe-DStarA Maximum Frequency

    1 GHz[19]

    Table 2. PXIe-DStarA LVPECL Signal Characteristics
    Minimum Typical Maximum
    Voltage High Output 2.155 V 2.280 V 2.405 V
    Voltage Low Output 1.355 V 1.530 V 1.700 V
    Rise Time/Fall Time 20%, 80% 125 ps 180 ps 275 ps
    ClkIn to PXIe-DStarA Delay

    Typical at 25 °C

    4.21 ns

    Maximum over temperature

    4.36 ns

    PXIe-DStarA to PXIe-DStarA Skew

    Typical

    100 ps

    Maximum over temperature

    250 ps

    Triggers

    PFI Single Ended

    Table 3. Input Characteristics
    Termination Setting High Impedance 50 Ω
    Input Impedance 10kΩ, ± 20% 50 Ω, ± 5%
    Input Coupling DC DC
    Hysteresis 50 mV typical 58 mV typical (Revision C and D)[20], 53 mV typical (Revision E and later)[20]
    Adjustable Threshold Range 15 mV to 3.795 V 16.8 mV to 4.25 V (Revision C and D)[20], 15.975 mV to 4.04 V (Revision E and later)[20]
    Adjustable Threshold Resolution 15 mV 16.8 mV (Revision C and D)[20], 15.975 mV (Revision E and later)[20]
    Adjustable Threshold Error[21] ± 5 mV ± 5 mV
    Default Threshold Setting 1.005 V 1.008 V (Revision C and D)[20], 1.006 V (Revision E and later)[20]
    Minimum Input Voltage Swing[22] 400 mVpp 450 mVpp
    Frequency Range[23] DC to 150 MHz DC to 150 MHz
    Recommended Maximum Input Voltage Range 0.0 V to 5.0 V 0.0 V to 5.0 V
    Maximum Input Voltage Range –0.5 V to 5.5 V –0.5V to 5.5 V
    PFI Open Circuit Voltage[24] 0.45 V, typical N/A
    Table 4. Output Characteristics
    Output Impedance 50 Ω, nominal
    Output Coupling DC
    Output Voltage Range into 50 Ω load 0 V to 1.63 V, typical
    Output Voltage Range into open load 0 V to 3.22 V, typical
    Output Rising/Falling Edge into 50 Ω load 450 ps to 500 ps, 20%–80%, typical
    Maximum Output Frequency[25] DC to 150 MHz

    PFI LVDS

    Input Characteristics

    Minimum Differential Input Voltage

    100 mVpp

    Recommended Maximum Differential Input Voltage[26]

    1 V

    Maximum Input Voltage Range[27]

    0 V to 4 V

    Differential Input Resistance

    100 Ω, ± 10%

    Maximum Input Frequency—Routed to DStarA[28]

    1 GHz

    Maximum Input Frequency—Routed to FPGA[29]

    200 MHz

    Output Characteristics

    Differential Output Voltage into 100 ohm differential load (at DC)

    600 mVpp typical

    Output Common Mode Voltage

    1.125 V to 1.375 V

    Maximum Output Frequency—Sourced from Cross Point Switch[30]

    1 GHz

    Maximum Output Frequency—Sourced from FPGA[31]

    200 MHz

    Differential Rise and Fall Time

    180 ps, typical

    The following figure shows the representative LVDS output operating at 100 MHz. 1 unit interval in this figure equals 5 ns.

    Figure 13. Representative LVDS output operating at 100 MHz

    The following figure shows the representative LVDS output operating at 1 GHz. 1 unit interval in the figure equals 500 ps.

    Figure 14. Representative LVDS Output Operating at 1 GHz

    PXI-Triggers

    I/O Voltage Level

    3.3 V CMOS, 5 V input tolerant

    PXI-Star

    I/O Voltage Level

    3.3 V CMOS, 5 V input tolerant

    PXIe-DStarB

    The PXIe-DStarB signals are LVDS signals that allow the PXIe-6674T to route high speed trigger signals to any other PXIe slot in a chassis. Each PXI Express slot in a chassis has its own PXIe-DStarB connection with the System Timing Slot.

    By default, these are driven logic low until configured by software.

    Maximum operating frequency

    200 MHz

    PXIe-DStarC

    The PXIe-DStarC signals are LVDS signals that come from other PXI Express slots in a chassis. Each PXI Express slot in a chassis has a PXIe-DStarC connection with the System Timing Slot. These allow other modules in a PXIe-Chassis to share a trigger or clock signal with the PXIe-6674T. The PXIe-6674T can connect a signal received through PXIe-DStarC to the PXIe-DStarA network (when sharing a clock signal) or treat the PXIe-DStarC as a trigger source.

    Maximum operating frequency when used with the PXIe-DStarA network

    1 GHz

    Maximum operating frequency when used for triggering

    200 MHz

    Trigger Timing

    Table 5. Asynchronous Trigger Delays and Skew Values
    Trigger Source Trigger Destination Typical Delay[32] Typical Skew[33]
    Single Ended PFI Single Ended PFI 23.4 ns < .5 ns
    Single Ended PFI LVDS PFI 22.4 ns < .5 ns
    Single Ended PFI PXI-Trigger 38.7 ns < 1.5 ns
    Single Ended PFI PXI-Star 26.8 ns < .75 ns
    Single Ended PFI PXIe-DStarB 23.2 ns < .5 ns
    LVDS PFI Single Ended PFI 13.7 ns < .5 ns
    LVDS PFI LVDS PFI 11.8 ns < .5 ns
    LVDS PFI PXI-Trigger 28.9 ns < 1.5 ns
    LVDS PFI PXI-Star 17.5 ns < .75 ns
    LVDS PFI PXIe-DStarB 13.8 ns < .5 ns
    PXI-Trigger Single Ended PFI 17.8 ns < .5 ns
    PXI-Trigger LVDS PFI 16.6 ns < .5 ns
    PXI-Trigger PXI-Trigger 33.8 ns < 1.5 ns
    PXI-Trigger PXI-Star 21.0 ns < .75 ns
    PXI-Trigger PXIe-DStarB 15.9 ns < .5 ns
    PXI-Star Single Ended PFI 17.0 ns < .5 ns
    PXI-Star LVDS PFI 15.6 ns < .5 ns
    PXI-Star PXI-Trigger 26.2 ns < 1.5 ns
    PXI-Star PXI-Star 20.2 ns < .75 ns
    PXI-Star PXIe-DStarB 16.0 ns < .5 ns
    PXIe-DStarC Single Ended PFI 13.6 ns < .5 ns
    PXIe-DStarC LVDS PFI 7.2 ns < .5 ns
    PXIe-DStarC PXI-Trigger 28.1 ns < 1.5 ns
    PXIe-DStarC PXI-Star 16.8 ns < .75 ns
    PXIe-DStarC PXIe-DStarB 13.0 ns < .5 ns
    Table 6. Synchronized Trigger PXI_Clk10 to Out
    Trigger Destination Clock to Out Time[34]
    Single Ended PFI 11.2 ns Typical, 19.9 ns Max
    LVDS PFI 9.8 ns Typical, 14.8 ns Max
    PXI-Trigger 28.2 ns Typical, 30.2 ns Max
    PXI-Star 14.8 ns Typical, 24.5 ns Max
    PXIe-DStarB 9.4 ns Typical, 14.0 ns Max
    Table 7. Synchronized Trigger Setup and Hold Timing With Respect to PXI_Clk10
    Trigger Source Trigger Destination Setup Time[35] Hold Time[36]
    Single Ended PFI Single Ended PFI 11.2 ns Typical, 13.2 ns Max -8.2 ns Typical, 1.1 ns Max
    Single Ended PFI LVDS PFI 11.2 ns Typical, 13.5 ns Max -8.5 ns Typical, 0.8 ns Max
    Single Ended PFI PXI-Trigger 11.3 ns Typical, 14.2 ns Max -7.5 ns Typical, 1.3 ns Max
    Single Ended PFI PXI-Star 11.2 ns Typical, 13.1 ns Max -6.9 ns Typical, 2.0 ns Max
    Single Ended PFI PXIe-DStarB 13.2 ns Typical, 15.4 ns Max -9.8 ns Typical, -0.4 ns Max
    LVDS PFI Single Ended PFI 0.6 ns Typical, 4.0 ns Max 0.4 ns Typical, 3.9 ns Max
    LVDS PFI LVDS PFI -0.3 ns Typical, 4.3 ns Max 1.2 ns Typical, 3.5 ns Max
    LVDS PFI PXI-Trigger -0.2 ns Typical, 3.6 ns Max 1.1 ns Typical, 5.0 ns Max
    LVDS PFI PXI-Star -0.1 ns Typical, 3.7 ns Max 1.4 ns Typical, 5.0 ns Max
    LVDS PFI PXIe-DStarB 2.1 ns Typical, 5.7 ns Max -0.5 ns Typical, 2.6 ns Max
    PXI-Trigger Single Ended PFI 11 ns Typical, 17.5 ns Max -9.5 ns Typical, -4.8 ns Max
    PXI-Trigger LVDS PFI 10.9 ns Typical, 18.1 ns Max -9.8 ns Typical, -5.4 ns Max
    PXI-Trigger PXI-Trigger 10.1 ns Typical, 17.0 ns Max -7.8 ns Typical, -3.6 ns Max
    PXI-Trigger PXI-Star 9.7 ns Typical, 16.2 ns Max --7.4 ns Typical, -3.1 ns Max
    PXI-Trigger PXIe-DStarB 10.7 ns Typical, 17.8 ns Max -9.0 ns Typical, -5.1 ns Max
    PXI-Star Single Ended PFI 3.9 ns Typical, 10.9 ns Max -2.5 ns Typical, -0.5 ns Max
    PXI-Star LVDS PFI 3.9 ns Typical, 11.1 ns Max -3.1 ns Typical, -0.8 ns Max
    PXI-Star PXI-Trigger 2.7 ns Typical, 9.9 ns Max -0.9 ns Typical, 0.9 ns Max
    PXI-Star PXI-Star 2.0 ns Typical, 9.6 ns Max -0.1 ns Typical, 1.1 ns Max
    PXI-Star PXIe-DStarB 4.3 ns Typical, 11.7 ns Max -2.4 ns Typical, -1.1 ns Max
    PXIe-DStarC Single Ended PFI 0.5 ns Typical, 3.9 ns Max 0.4 ns Typical, 3.7 ns Max
    PXIe-DStarC LVDS PFI -0.3 ns Typical, 4.4 ns Max 0.5 ns Typical, 3.1 ns Max
    PXIe-DStarC PXI-Trigger -1.1 ns Typical, 2.8 ns Max 1.9 ns Typical, 5.2 ns Max
    PXIe-DStarC PXI-Star -0.5 ns Typical, 3.2 ns Max 3.1 ns Typical, 4.9 ns Max
    PXIe-DStarC PXIe-DStarB 1.3 ns Typical, 5.6 ns Max 0.2 ns Typical, 2.4 ns Max

    FPGA Functionality

    Trigger Routing

    The following figure shows the routes that can be made.

    Figure 15. PXIe-6674T Routing Table

    Frequency Measurement

    Maximum Measurable Frequency[37]

    200 MHz

    Reference Counter Source[38]

    PXIe_Clk100

    Frequency Counter Sources

    All Trigger inputs plus Clock In and the OCXO

    Trigger Sync Clock

    Two independent synchronization clock zones:

    • Front Synchronization Clock for PFI Single Ended and PFI LVDS
    • Rear Synchronization Clock for PXI-Star, PXI-Trigger, and PXIe-DStarB

    Synchronization Clock Sources

    PXI_Clk10, PXIe_Clk100, Clock In, OCXO, and Clock Generation

    Two division ratios can be specified in powers of 2 from 2 to 512. These ratios are used in all synchronization clock zones to divide down the selected full speed synchronization clock.

    Physical

    Chassis requirement

    One 3U PXI Express slot (system timing slot)

    Front panel connectors

    Eight SMA female, 50 Ω

    Front panel indicators

    Two tricolor LEDs (green, red, and amber)

    Weight

    349 g (12.3 oz)

    Dimensions (not including connectors)

    16 cm × 10 cm (6.3 in. × 3.9 in.)

    Power Requirements

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    Caution  

    You can impair the protection provided by the PXIe-6674T if you use it in a manner not described in this document.

    +3.3 V

    2.54 A, max

    +12 V

    2.25 A, max

    +5 VAUX

    0 A, max

    Environmental

    Maximum altitude

    2,000 m (800 mbar) (at 25 °C ambient temperature)

    Pollution Degree

    2

    Indoor use only.

    Operating Environment

    Ambient temperature range

    0 to 55 °C (Tested in accordance with IEC-60068-2-1 and IEC-60068-2-2. Meets MIL-PRF-28800F Class 3 low temperature limit and MIL-PRF-28800F Class 2 high temperature limit.)

    Relative humidity range

    10% to 90%, noncondensing (Tested in accordance with IEC-60068-2-56.)

    Storage Environment

    Ambient temperature range

    -40 to 71 °C (Tested in accordance with IEC-60068-2-1 and IEC-60068-2-2. Meets MIL-PRF-28800F Class 3 limits.)

    Relative humidity range

    5% to 95%, noncondensing (Tested in accordance with IEC-60068-2-56.)

    Shock and Vibration

    Operating Shock

    30 g peak, half-sine, 11 ms pulse (Tested in accordance with IEC-60068-2-27. Meets MIL-PRF-28800F Class 2 limits.)

    Random Vibration

    Operating

    5 to 500 Hz, 0.3 grms

    Nonoperating

    5 to 500 Hz, 2.4 grms (Tested in accordance with IEC-60068-2-64. Nonoperating test profile exceeds the requirements of MIL-PRF-28800F, Class 3.)

    Safety

    This product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:

    • IEC 61010-1, EN 61010-1
    • UL 61010-1, CSA C22.2 No. 61010-1
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    Note  

    For UL and other safety certifications, refer to the product label or the Online Product Certification section.

    Electromagnetic Compatibility

    This product meets the requirements of the following EMC standards for electrical equipment for measurement, control, and laboratory use; for radio equipment; and for telecommunication terminal equipment:

    • EN 61326-1 (IEC 61326-1): Class A emissions; Basic immunity
    • EN 55011 (CISPR 11): Group 1, Class A emissions
    • AS/NZS CISPR 11: Group 1, Class A emissions
    • FCC 47 CFR Part 15B: Class A emissions
    • ICES-001: Class A emissions
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    Note  

    In the United States (per FCC 47 CFR), Class A equipment is intended for use in commercial, light-industrial, and heavy-industrial locations. In Europe, Canada, Australia and New Zealand (per CISPR 11) Class A equipment is intended for use only in heavy-industrial locations.

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    Note  

    Group 1 equipment (per CISPR 11) is any industrial, scientific, or medical equipment that does not intentionally generate radio frequency energy for the treatment of material or inspection/analysis purposes.

    spd-note-note
    Note  

    To ensure the specified EMC performance, operate this product only with double-shielded cables and accessories (for example, RG-223 cables).

    spd-note-note
    Note  

    For EMC declarations and certifications, and additional information, refer to the Online Product Certification section.

    CE Compliance

    This product meets the essential requirements of applicable European Directives, as follows:

    • 2014/35/EU; Low-Voltage Directive (safety)
    • 2014/30/EU; Electromagnetic Compatibility Directive (EMC)

    Online Product Certification

    Refer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for this product, visit ni.com/certification, search by model number or product line, and click the appropriate link in the Certification column.

    Environmental Management

    NI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.

    For additional environmental information, refer to the Minimize Our Environmental Impact web page at ni.com/environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.

    Waste Electrical and Electronic Equipment (WEEE)

    spd-note-weee
    EU Customers  

    At the end of the product life cycle, all NI products must be disposed of according to local laws and regulations. For more information about how to recycle NI products in your region, visit ni.com/environment/weee.

    电子信息产品污染控制管理办法(中国RoHS)

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    中国客户  

    National Instruments符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。关于National Instruments中国RoHS合规性信息,请登录 ni.com/environment/rohs_china。(For information about China RoHS compliance, go to ni.com/environment/rohs_china.)

    • 1 A duty cycle other than 50% will increase the minimum input swing. Refer to Maximum and Minimum Input Swing with Attenuation On for more information.
    • 2 A duty cycle other than 50% will increase the minimum input swing. Refer to Maximum and Minimum Input Swing With Attenuation Off for more information.
    • 3 Operation above the Absolute Maximum Input Powered On may cause damage to the device.
    • 4 Absolute Maximum Input Powered Off is the maximum input signal amplitude that the device can tolerate before damage might occur while in an unpowered state.
    • 5 The minimum frequency is limited by AC coupling.
    • 6 After 72 hours of continuous operation.
    • 7 OCXO also driven to PXI_CLK10_IN.
    • 8 The PXIe backplane employs a PLL to phase lock PXI_CLK10 to the signal on PXI_CLK10_IN. As a result, the phase noise of PXI_CLK10 above about 1 kHz offset is unchanged, regardless of reference used.
    • 9 10 MHz PLL filter is designed for a 10 MHz phase detector frequency. Any other reference frequency will default to a phase detector frequency of 1 MHz resulting in a slight degradation of PLL performance.
    • 10 The PXIe backplane employs a PLL to phase lock PXI_CLK10 to the signal on PXI_CLK10_IN. As a result, the phase noise of PXI_CLK10 above about 1 kHz offset is unchanged, regardless of reference used.
    • 11 Operation of low speed ClkOut above 50 MHz is possible however NI does not guarantee performance. Use ClkOutLS as the destination terminal to force NI-Sync to use the low speed driver above 50 MHz.
    • 12 Operation above 1 GHz is possible but NI does not guarantee performance.
    • 13 Routing PXIe-DStarA to ClkOut requires routing through either Banks 0, 1, or 2.
    • 14 Frequency Accuracy is inherited from PXIe_Clk100/PXI_Clk10. Use OCXO for PXIe_Clk100/PXI_Clk10 replacement for improved frequency accuracy and phase noise.
    • 15 This is the frequency resolution of the DDS used in the Clock Generation circuitry. For Clock Generation frequencies below 150 MHz, this resolution is divided down and for frequencies above 300 MHz, this resolution is multiplied up.
    • 16 When routed to ClkOut Low Speed or used as a trigger synchronization clock, Clock Generation can be further divided by theFPGA by factors of two up to 24. This extends the Clock Generation range down to 4.6875 MHz/224=.2794 Hz. When routed to ClkOut High Speed the minimum frequency is 4.6875 MHz. Use ClkOutHS as the destination terminal to force NI-Sync to use the low speed driver below 50 MHz. Note that AC coupling on ClkOut limits the minimum frequency which can be used.
    • 17 Clock Generation can be operated beyond the upper limit; however, NI does not guarantee performance beyond 1 GHz. 2 GHz is the maximum output frequency by design.
    • 18 Use ClkOutHS as the destination terminal to force NI-Sync to use the high speed driver below 50 MHz.
    • 19 Maximum Frequency may exceed 1 GHz, however, performance is not guaranteed.
    • 20 Ensure that the specifications of interest match the revision label on your board.
    • 21 PFI Input switching behavior is a function of both the threshold setting and hysteresis.
    • 22 Input Voltage Swing below 400mV may be possible but performance is not guaranteed.
    • 23 Operation beyond 150MHz frequency may be possible but performance is not guaranteed.
    • 24 PFI line will float to 0.45V when configured in high impedance mode with no external signal connected as input.
    • 25 Operation beyond 150 MHz frequency may be possible but performance is not guaranteed.
    • 26 Operation with greater voltage swing will not damage the device but performance characteristics are not guaranteed.
    • 27 Maximum Input Voltage Range is any combination of input voltage swing and common mode voltage. For example, a 200 mV differential swing with common mode voltage of 100 mV is acceptable as the lowest applied voltage to the input would be 0 V. A 200 mV differential swing with common mode less than 100 mV would cause the applied voltage to fall below 0 V and therefore would not be acceptable.
    • 28 Operation beyond 1 GHz is possible but performance is not guaranteed.
    • 29 Operation beyond 200 MHz is possible but performance is not guaranteed. This limitation comes from the FPGA, not the LVDS receiver.
    • 30 Operation beyond 1 GHz is possible but performance is not guaranteed.
    • 31 Operation beyond 200 MHz is possible but performance is not guaranteed. This limitation comes from the FPGA, not the LVDS driver.
    • 32 Typical Delay is measured from the input to the PXIe-6674T at the connector to the output at the connector. For example, Single Ended PFI to PXI-Star is the delay from the Single Ended PFI SMA connector to the PXI-Star at the backplane connector.
    • 33 Typical Skew is defined as the difference in arrival time of a rising edge on a common source to two or more outputs with in a trigger destination, as seen as the connector. For example, if Single Ended PFI(0) is asynchronously routed to all PXI-Star lines, the typical skew would be less than .75 ns.
    • 34 Clock to Out Time is the amount of time it takes for a logic change on a synchronous trigger to appear (at the connector) with respect to the rising edge of PXI-Clk10 (at the backplane connector) that it is synchronized to. Refer to the Synchronous Routing section of Chapter 3, Hardware Overview, for more information.
    • 35 Setup Time is the amount of time before a rising edge of PXI-Clk10 (at the backplane connector) that a logic level must be valid on the trigger source (at the connector) in order for the trigger destination to update. Refer to the Synchronous Routing section of Chapter 3, Hardware Overview, for more information.
    • 36 Hold Time is the amount of time after a rising edge of PXI-Clk10 (at the backplane connector) that a logic level must be valid on the trigger source (at the connector) in order for the trigger destination to update. Refer to the Synchronous Routing section of Chapter 3, Hardware Overview, for more information.
    • 37 Operation beyond 200 MHz is possible but performance is not guaranteed.
    • 38 Accuracy of frequency measurement is relative to the frequency accuracy of the reference counter source. The Frequency Measure node in NI-Sync does not account for error from the reference source.

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