Table Of Contents

PCI-6541 Specifications

Version:
    Last Modified: November 3, 2017

    These specifications apply to the PCI-6541 with 1 MBit, 8 MBit, and 64 MBit of memory per channel.

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    Hot Surface  

    If the PCI-6541 has been in use, it may exceed safe handling temperatures and cause burns. Allow the PCI-6541 to cool before removing it from the chassis.

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    Note  

    All values were obtained using a 1 m cable (SHC68-C68-D4 recommended). Performance specifications are not guaranteed when using longer cables.

    Definitions

    Warranted specifications describe the performance of a model under stated operating conditions and are covered by the model warranty.

    The following characteristic specifications describe values that are relevant to the use of the model under stated operating conditions but are not covered by the model warranty.

    • Typical specifications describe the performance met by a majority of models.
    • Nominal specifications describe an attribute that is based on design, conformance testing, or supplemental testing.

    Specifications are Typical unless otherwise noted.

    Conditions

    Typical values are representative of an average unit operating at room temperature.

    Channels

    Data

    Number of channels

    32

    Direction control

    Per channel

    Programmable Function Interface (PFI)

    Number of channels

    4

    Direction control

    Per channel

    Clock terminals

    Input

    3

    Output

    2

    Generation Channels

    Channels

    Data

    DDC CLK OUT

    PFI <0..3>

    Signal type

    Single-ended

    Table 1. Voltage Levels, I = 100 µA
    Logic family, into 1 MΩ Low High
    Typical Maximum Minimum Typical
    1.8 V 0 V 0.1 V 1.7 V 1.8 V
    2.5 V 2.4 V 2.5 V
    3.3 V TTL (5 V TTL compatible) 3.2 V 3.3 V

    Output impedance

    50 Ω, nominal

    Maximum DC drive strength, by logic family

    1.8 V

    ±8 mA

    2.5 V

    ±16 mA

    3.3 V

    ±32 mA

    Data channel driver enable/disable control

    Software-selectable: per channel

    Channel power-on state[1]

    Drivers disabled, 50 kΩ input impedance

    Output protection

    Range

    0 V to 5 V

    Duration

    Indefinite

    Acquisition Channels

    Channels

    Data

    STROBE

    PFI <0..3>

    Signal type

    Single-ended

    Table 2. Voltage Levels
    Logic family Maximum Low Threshold Minimum High Threshold
    1.8 V 0.45 V 1.35 V
    2.5 V 0.75 V 1.75 V
    3.3 V TTL (5 V TTL compatible) 1.00 V 2.30 V

    Input impedance[2]

    50 kΩ

    Input protection range[3]

    -1 V to 6 V

    Timing

    Sample Clock

    Sources

    1. On Board clock (internal voltage-controlled crystal oscillator [VCXO] with divider)

    2. CLK IN (SMB jack connector)

    3. STROBE (Digital Data & Control [DDC] connector; acquisition only)

    Frequency range

    On Board clock

    48 Hz to 50 MHz,

    Configurable to 200 MHz/N;

    4 ≤ N ≤ 4,194,304

    CLK IN

    20 kHz to 50 MHz

    STROBE

    48 Hz to 50 MHz

    Relative delay adjustment[4]

    Range

    0.0 to 1.0 Sample clock periods

    Resolution

    10 ps

    Exported Sample clock

    Destinations[5]

    1. DDC CLK OUT (DDC connector)

    2. CLK OUT (SMB jack connector)

    Delay C), for clock frequencies ≥25 MHz

    Range

    0.0 to 1.0 Sample clock periods

    Resolution

    1/256 of Sample clock period

    Jitter, using On Board clock

    Period

    20 psrms, typical

    Cycle-to-cycle

    35 psrms, typical

    Generation Timing

    Channels

    Data

    DDC CLK OUT

    PFI <0..3>

    Data channel-to-channel skew

    ±600 ps, typical

    Maximum data channel toggle rate

    25 MHz

    Data position modes

    Sample clock rising edge

    Sample clock falling edge

    Delay from Sample clock rising edge

    Generation data delay G), for clock frequencies ≥25 MHz

    Range

    0.0 to 1.0 Sample clock periods

    Resolution

    1/256 of Sample clock period

    Exported Sample clock offset (tCO)

    Software-selectable: 0.0 ns or 2.5 ns (default)

    Time delay from Sample clock (internal) to DDC connector (tSCDDC)

    15 ns, typical

    Table 3. Generation Provided Setup and Hold Times
    Exported Sample Clock Mode and Offset Voltage Family Time from Rising Clock Edge to Data Transition (tPCO) Minimum Provided Setup Time (tPSU) Minimum Provided Hold Time (tPH)
    Noninverted, 2.5 ns 1.8 V 2.5 ns, typical tP - 5.5 ns 0.5 ns
    2.5 V tP - 4.5 ns 0.9 ns
    3.3 V/5.0 V tP - 4.5 ns 1 ns
    Inverted, 0 ns 1.8 V tP/2 tP/2 - 3.5 ns (tP/2) - 1.5 ns
    2.5 V tP/2 - 2.5 ns
    3.3 V/5.0 V tP/2 - 2 ns
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    Note  

    Provided setup and hold times account for maximum channel-to-channel skew and jitter.

    The table values provided assume the following data position is set to Sample clock rising edge and the Sample clock is exported to the DDC connector and includes worst-case effects of channel-to-channel skew, inter-symbol interference, and jitter. Other combinations of exported Sample clock mode and offset are also allowed. The values presented are from the default case (noninverted clock with 2.5 s offset) and for providing balanced setup and hold times (inverted clock with 0 ns offset).

    To determine the appropriate exported Sample clock mode and offset for your PCI-6541 generation session, compare the setup and hold times from the datasheet of your device under test (DUT) to the values in this table. Select the exported Sample clock mode and offset such that the PCI-6541 provided setup and hold times are greater than the setup and hold times required for the DUT.

    Specified timing relationships apply at the DDC connector and at high-speed DIO accessory terminals. Any signal routing, clock splitting, buffers, or translation logic can impact this relationship. If multiple copies of DDC_CLK_OUT are necessary, use a zero buffer to preserve this relationship.

    Figure 1. Generation Provided Setup and Hold Times Timing Diagram
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    Note  

    Provided setup and hold times account for maximum channel-to-channel skew and jitter.

    Figure 2. Generation Timing Diagram

    Acquisition Timing

    Channels

    Data

    STROBE

    PFI <0..3>

    Channel-to-channel skew

    ±600 ps, typical

    Data position modes

    Sample clock rising edge

    Sample clock falling edge

    Delay from Sample clock rising edge

    Setup and hold times
    To STROBE[6]

    Setup time (tSUS)

    3.1 ns, maximum

    Hold time (tHS)

    2.7 ns, maximum

    To Sample clock[7]

    Setup time (tSUSC)

    0.4 ns

    Hold time (tHSC)

    0 ns

    Time delay from DDC connector data to internal Sample clock (tDDCSC)

    10 ns, typical

    Acquisition data delay (δA), for clock frequencies ≥25 MHz

    Range

    0.0 to 1.0 Sample clock periods

    Resolution

    1/256 of Sample clock period

    Figure 3. Acquisition Timing Diagram Using STROBE as the Sample Clock
    Figure 4. Acquisition Timing Diagram with Sample Clock Sources Other than STROBE

    CLK IN

    Connector

    SMB jack

    Direction

    Input

    Signal type

    Single-ended

    Destinations

    1. Reference clock for the phase-locked loop (PLL)

    2. Sample clock

    Input coupling

    AC

    Input protection

    ±10 VDC

    Input impedance

    Software-selectable: 50 Ω (default) or 1 kΩ

    Minimum detectable pulse width

    4 ns

    Clock requirements

    Free-running (continuous) clock

    As Sample Clock

    Table 4. External Sample Clock Range
    Voltage Range (Vpk-pk) Sine Wave Square Wave
    Frequency Range Frequency Range Duty Cycle
    0.65 to 5.0 5.5 MHz to 50 MHz 20 kHz to 50 MHz
    • 25% to 75%
    1.0 to 5.0 3.5 MHz to 50 MHz
    2.0 to 5.0 1.8 MHz to 50 MHz

    As Reference Clock

    Frequency range

    10 MHz ±50 ppm

    Voltage range

    0.65 Vpk-pk to 5.0 Vpk-pk

    Duty cycle

    25% to 75%

    STROBE

    Connector

    DDC

    Direction

    Input

    Destination

    Sample clock (acquisition only)

    Frequency range

    48 Hz to 50 MHz

    Duty cycle range[8]

    25% to 75%

    Minimum detectable pulse width[9]

    4 ns

    Voltage thresholds

    Refer to Acquisition Timing in the Timing section.

    Clock requirements

    Free-running (continuous) clock

    Input impedance[10]

    Software-selectable: 50 kΩ

    CLK OUT

    Connector

    SMB jack

    Direction

    Output

    Sources

    1. Sample clock (excluding STROBE)

    2. Reference clock (PLL)

    Output impedance

    50 Ω, nominal

    Electrical characteristics

    Refer to Generation Timing in the Timing section.

    Maximum drive current

    At 1.8 V

    8 mA

    At 2.5 V

    16 mA

    At 3.3 V

    32 mA

    Logic type

    Generation logic family setting: 1.8 V, 2.5 V, 3.3 V

    DDC CLK OUT

    Connector

    DDC

    Direction

    Output

    Source[11]

    Sample clock

    Electrical characteristics

    Refer to Generation Timing in the Timing section.

    Reference Clock (PLL)

    Sources[12]

    1. RTSI 7

    2. CLK IN (SMB jack connector)

    3. None (On Board clock not locked to a reference)

    Destination

    CLK OUT (SMB jack connector)

    Lock time

    400 ms, typical

    Frequencies

    10 MHz ±50 ppm

    Duty cycle range

    25% to 75%

    Waveform

    Memory and Scripting

    Memory architecture

    The PCI-6541 uses Synchronization and Memory Core (SMC) technology in which waveforms and instructions share onboard memory. Parameters such as number of script instructions, maximum number of script instructions, maximum number of waveforms in memory, and number of samples (S) available for waveform storage are flexible and user defined.

    Onboard memory size[13]
    1 Mbit/channel

    Acquisition

    1 Mbit/channel (4 MBytes total)

    Generation

    1 Mbit/channel (4 MBytes total)

    8 Mbit/channel

    Acquisition

    8 Mbit/channel (32 MBytes total)

    Generation

    8 Mbit/channel (32 MBytes total)

    64 Mbit/channel

    Acquisition

    64 Mbit/channel (256 MBytes total)

    Generation

    64 Mbit/channel (256 MBytes total)

    Generation

    Single waveform mode

    Generates a single waveform once, n times, or continuously.

    Scripted mode[14]

    Generates a simple or complex sequences of waveforms.

    Finite repeat count

    1 to 16,777,216

    Waveform quantum[15]

    Waveform must be an integer multiple of 2 S (samples).

    Table 5. Generation Minimum Waveform Size, Samples (S) [16]
    Configuration Sample Rate
    50 MHz
    Single waveform 2 S
    Continuous waveform 16 S
    Stepped sequence 64 S
    Burst sequence 256 S
    Acquisition

    Minimum record size[17]

    1 S

    Record quantum

    1 S

    Total records

    2,147,483,647, maximum

    Total pre-Reference trigger samples

    0 up to full record

    Total post-Reference trigger samples

    0 up to full record

    Triggers

    Trigger Types Sessions Edge Detection Level Detection
    1. Start Acquisition and generation Rising or Falling
    2. Pause Acquisition and generation High or Low
    3. Script <0..3> Generation Rising or Falling High or Low
    4. Reference Acquisition Rising or Falling
    5. Advance Acquisition Rising or Falling

    Sources

    1. PFI 0 (SMB jack connector)

    2. PFI <1..3> (DDC connector)

    3. RTSI <0..7> (RTSI bus)

    4. Pattern match (acquisition sessions only)

    5. Software (user function call)

    6. Disabled (do not wait for a trigger)

    Destinations[18]

    PFI 0 (SMB jack connector)

    PFI <1..3> (DDC connector)

    RTSI <0..6> (RTSI bus)

    Minimum required trigger pulse width

    Generation

    30 ns

    Acquisition

    Acquisition triggers must meet setup and hold time requirements.

    Table 6. Trigger Rearm Time
    Trigger Operation Samples, Typical Samples, Maximum
    Start to Reference 57 S 64 S
    Start to Advance 138 S 143 S
    Reference to Reference 132 S 153 S
    Delay from Pause trigger to Pause state[19]

    Generation sessions

    32 Sample clock periods + 150 ns

    Acquisition sessions

    Data synchronous

    Delay from trigger to digital data output

    32 Sample clock periods + 160 ns

    Events

    Event Types Sessions
    1. Marker <0..3> Generation
    2. Data Active Generation
    3. Ready for Start Acquisition and generation
    4. Ready for Advance Acquisition
    5. End of Record Acquisition

    Destinations[20]

    1. PFI 0 (SMB jack connector)

    2. PFI <1..3> (DDC connector)

    3. RTSI <0..6> (RTSI bus)

    Marker time resolution (placement)

    Markers must be placed at an integer multiple of 2 S (samples).

    Miscellaneous

    Warm-up time

    15 minutes

    On Board clock characteristics (valid only when PLL reference source is set to None)

    Frequency accuracy

    ±100 ppm

    Temperature stability

    ±30 ppm

    Aging

    ±5 ppm first year

    Software

    Driver Software

    Driver support for this device was first available in NI-HSDIO 1.2.

    NI-HSDIO is an IVI-compliant driver that allows you to configure, control, and calibrate the PCI-6541. NI-HSDIO provides application programming interfaces for many development environments.

    Application Software

    NI-HSDIO provides programming interfaces, documentation, and examples for the following application development environments:

    • LabVIEW
    • LabWindows™/CVI™
    • Measurement Studio
    • Microsoft Visual C/C++
    • .NET (C# and VB.NET)

    NI Measurement Automation Explorer

    NI Measurement Automation Explorer (MAX) provides interactive configuration and test tools for the PCI-6541. MAX is included on the NI-HSDIO media.

    Power

    VDC Current Draw, Typical Current Draw, Maximum
    +3.3 V 1.6 A 1.8 A
    +5 V 1.2 A 1.7 A
    +12 V 0.25 A 0.4 A
    -12 V 0.06 A 0.10 A

    Total power

    15 W, typical

    20.5 W, maximum

    Physical Specifications

    Dimensions

    12.6 cm × 35.5 cm (4.95 in × 13.9 in)

    Weight

    410 g (14.5 oz)

    I/O Connectors

    Label Connector Type Description
    CLK IN SMB jack External Sample clock, external PLL reference input
    PFI 0 Events, triggers
    CLK OUT Exported Sample clock, exported Reference clock
    DIGITAL DATA & CONTROL 68-pin VHDCI connector Digital data channels, exported Sample clock, STROBE, events, triggers

    Environment

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    Note  

    To ensure that the PCI-6541 cools effectively, follow the guidelines in the Maintain Forced Air Cooling Note to Users included with the PCI-6541 or available at ni.com/manuals. The PCI-6541 is intended for indoor use only.

    Operating temperature

    0 °C to 45 °C

    Operating relative humidity

    10 to 90% relative humidity, noncondensing (meets IEC 60068-2-56)

    Storage temperature

    -20 °C to 70 °C (meets IEC 60068-2-2)

    Storage relative humidity

    5 to 95% relative humidity, noncondensing (meets IEC 60068-2-56)

    Altitude

    0 to 2,000 m above sea level (at 25 °C ambient temperature)

    Pollution degree

    2

    Compliance and Certifications

    Safety

    This product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:

    • IEC 61010-1, EN 61010-1
    • UL 61010-1, CSA C22.2 No. 61010-1
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    Note  

    For UL and other safety certifications, refer to the product label or the Online Product Certification section.

    Electromagnetic Compatibility

    This product meets the requirements of the following EMC standards for electrical equipment for measurement, control, and laboratory use:
    • EN 61326-1 (IEC 61326-1): Class A emissions; Basic immunity
    • EN 55011 (CISPR 11): Group 1, Class A emissions
    • AS/NZS CISPR 11: Group 1, Class A emissions
    • FCC 47 CFR Part 15B: Class A emissions
    • ICES-001: Class A emissions
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    Note  

    For EMC declarations, certifications, and additional information, refer to the Online Product Certification section.

    To meet EMC compliance, the following cautions apply:

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    Caution  

    The SHC68-C68-D4 shielded cables must be used when operating the PCI-6541.

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    Caution  

    EMC filler panels must be installed in all empty chassis slots.

    CE Compliance

    This product meets the essential requirements of applicable European Directives, as follows:

    • 2014/35/EU; Low-Voltage Directive (safety)
    • 2014/30/EU; Electromagnetic Compatibility Directive (EMC)

    Online Product Certification

    Refer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for this product, visit ni.com/certification, search by model number or product line, and click the appropriate link in the Certification column.

    Environmental Management

    NI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.

    For additional environmental information, refer to the Minimize Our Environmental Impact web page at ni.com/environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.

    Waste Electrical and Electronic Equipment (WEEE)

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    EU Customers  

    At the end of the product life cycle, all NI products must be disposed of according to local laws and regulations. For more information about how to recycle NI products in your region, visit ni.com/environment/weee.

    电子信息产品污染控制管理办法(中国RoHS)

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    中国客户  

    National Instruments符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。关于National Instruments中国RoHS合规性信息,请登录 ni.com/environment/rohs_china。(For information about China RoHS compliance, go to ni.com/environment/rohs_china.)

    • 1 For module assemblies C and later. Module assemblies A and B have an input impedance of 10 kΩ.
    • 2 For module assemblies C and later. Module assemblies A and B have an input impedance of 10 kΩ.
    • 3 Diode clamps in the design may provide additional protection outside the specified range.
    • 4 You can apply a delay or a phase adjustment to the On Board clock to align multiple devices.
    • 5 Sample clocks with sources other than STROBE can be exported.
    • 6 Includes maximum data channel-to-channel skew.
    • 7 Does not include data channel-to-channel skew, tDDCSC, or tSCDDC.
    • 8 At the programmed thresholds.
    • 9 Required at both acquisition voltage thresholds.
    • 10 For module assemblies C and later. Module assemblies A and B have an input impedance of 10 kΩ.
    • 11 STROBE cannot be routed to DDC CLK OUT.
    • 12 The source provides the reference frequency for the PLL.
    • 13 Maximum limit for generation sessions assumes no scripting instructions.
    • 14 Use scripts to describe the waveforms to be generated, the order in which the waveforms are generated, how many times the waveforms are generated, and how the device responds to Script triggers.
    • 15 Regardless of waveform size, NI-HSDIO allocates waveforms into block sizes of 32 S of physical memory.
    • 16 Sample rate dependent. Increasing sample rate increases minimum waveform size.
    • 17 Regardless of waveform size, NI-HSDIO allocates at least 128 bytes for a record.
    • 18 Each trigger can be routed to any destination except the Pause trigger. The Pause trigger cannot be exported for acquisition sessions.
    • 19 Use the Data Active event during generation to determine when the PCI-6541 enters the Pause state.
    • 20 Except for the Data Active event, each event can be routed to any destination. The Data Active event can be routed only to the PFI channels.

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